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XIO2000AZAY

Texas Instruments

XIO2000AZAY by Texas Instruments

XIO2000AZAY by Texas Instruments is a 175-terminal bus controller with 32-bit address and external data bus width. It operates at 125 MHz, supporting PCI bus compatibility and achieving a max data transfer rate of 250 MBps. Ideal for commercial applications requiring low-profile, fine-pitch package style with a temperature range of 0-70°C.

Median Price

$30.460

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 140 parts In-Stock

1+ parts

$30.460

100+ parts

$24.480

1k+ parts

$22.760

10k+ parts

$21.510

140

$30.460

$24.480

$22.760

$21.510

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,661 parts In-Stock

1+ parts

$28.937

100+ parts

-

1k+ parts

-

10k+ parts

-

1,661

$28.937

-

-

-

Vyrian

USA . 3,795 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,795

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 642 parts In-Stock

1+ parts

$27.414

100+ parts

-

1k+ parts

-

10k+ parts

-

642

$27.414

-

-

-

Corohmni

South Africa . 260 parts In-Stock

1+ parts

$43.155

100+ parts

-

1k+ parts

-

10k+ parts

-

260

$43.155

-

-

-

Parana Technologies

USA . 2,227 parts In-Stock

1+ parts

$72.989

100+ parts

-

1k+ parts

-

10k+ parts

-

2,227

$72.989

-

-

-

DigiPath Technology Company

USA . 1,025 parts In-Stock

1+ parts

$80.370

100+ parts

-

1k+ parts

-

10k+ parts

-

1,025

$80.370

-

-

-

ChromeModa Solutions

Germany . 2,864 parts In-Stock

1+ parts

$82.010

100+ parts

$67.248

1k+ parts

-

10k+ parts

-

2,864

$82.010

$67.248

-

-

IDEA Electronic Components Group

UK . 1,080 parts In-Stock

1+ parts

$82.010

100+ parts

$77.910

1k+ parts

$73.809

10k+ parts

-

1,080

$82.010

$77.910

$73.809

-

Microchip USA

USA . 2,889 parts In-Stock

1+ parts

$153.420

100+ parts

$150.750

1k+ parts

$149.420

10k+ parts

$148.080

2,889

$153.420

$150.750

$149.420

$148.080

Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

-

-

-

-

Overview

Experience seamless data transfer and enhanced system performance with the XIO2000AZAY by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality bus controllers that are perfect for a wide range of applications. From increasing data transfer rates to improving overall system efficiency, this product offers unparalleled value and benefits to customers. Upgrade your system with the XIO2000AZAY and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly on circuit boards, saving space and reducing manufacturing costs.

Maximum Supply Voltage: 1.65 V

The high maximum supply voltage ensures compatibility with a wide range of system power requirements.

Address Bus Width: 32

A 32-bit address bus width allows for efficient data processing and communication between components.

Package Shape: SQUARE

The square package shape offers a compact form factor, saving space on the circuit board.

No. of Terminals: 175

With 175 terminals, the product provides ample connectivity options for interfacing with other components.

Minimum Supply Voltage: 1.35 V

The low minimum supply voltage ensures efficient power consumption and compatibility with low-power systems.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature tolerance allows the product to perform reliably even in harsh environmental conditions.

Maximum Data Transfer Rate: 250 MBps

The high data transfer rate enables fast and efficient communication between devices, enhancing overall system performance.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style offers high-density mounting and efficient signal transmission.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides excellent conductivity, ensuring reliable connections and signal integrity.

Terminal Position: BOTTOM

Bottom terminal positioning simplifies the installation and maintenance of the product on the circuit board.

Maximum Seated Height: 1.4 mm

The low maximum seated height allows for slim and compact designs, suitable for space-constrained applications.

Width: 12 mm

A width of 12 mm offers a balance between compact size and sufficient space for terminals and components.

External Data Bus Width: 32

A 32-bit external data bus width enables high-speed data transfer and processing capabilities.

Maximum Clock Frequency: 125 MHz

The high maximum clock frequency supports rapid data processing and efficient system operation.

Maximum Time At Peak Reflow Temperature (s): 30

The 30-second maximum time at peak reflow temperature ensures the product can withstand reflow soldering processes without damage.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance of 260°C enables reliable soldering and assembly of the product on the circuit board.

Length: 12 mm

A length of 12 mm complements the compact width of the product, offering a space-saving solution for circuit board integration.

Temperature Grade: COMMERCIAL

A commercial temperature grade ensures reliable operation within standard temperature ranges, suitable for most commercial applications.

Peripheral IC Type: BUS CONTROLLER, PCI

The peripheral IC type of bus controller for PCI interface allows for efficient data management and control within a PCI-based system.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, enhancing the overall performance of the product.

Terminal Form: BALL

Ball terminal form provides reliable solder joints and connection points, ensuring long-term durability and stability.

Nominal Supply Voltage: 1.5 V

The nominal supply voltage of 1.5 V offers a standard power requirement, making the product compatible with various power sources.

Bus Compatibility: PCI

PCI bus compatibility ensures seamless integration with PCI-based systems, enabling efficient data transfer and communication.

Terminal Pitch: 0.8 mm

The 0.8 mm terminal pitch allows for compact terminal spacing, reducing the overall footprint of the product on the circuit board.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that the product has a moderate moisture sensitivity level, suitable for standard solder reflow processes.

Technical Specifications

Bus Controllers XIO2000AZAY attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 3.3V SUPPLY

Address Bus Width:

32

Bus Compatibility:

PCI

Maximum Clock Frequency:

125 MHz

Maximum Data Transfer Rate:

250 MBps

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B175

JESD-609 Code:

e1

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

175

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA175,14X14,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage:

1.65 V

Minimum Supply Voltage:

1.35 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Trade Compliance

XIO2000AZAY Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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