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XIO2001ZGU

Texas Instruments

XIO2001ZGU by Texas Instruments

XIO2001ZGU by Texas Instruments is a bus controller with 32-bit address and data bus width, operating at 125 MHz. It supports VGA bus compatibility, has a max data transfer rate of 250 MBps, and operates b/w 0 to 70°C. Ideal for PCI peripherals in commercial-grade applications due to its low profile grid array package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Chip Stock

USA . 7,750 parts In-Stock

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Digiode

USA . 4,295 parts In-Stock

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Vyrian

USA . 3,944 parts In-Stock

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Nova Conductors

Japan . 90 parts In-Stock

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90

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 15 parts In-Stock

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Prism Electronics

USA . 5 parts In-Stock

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AZTECH Wire

Italy . 539 parts In-Stock

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$11.184

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539

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One Stop Electronics

USA . 694 parts In-Stock

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$33.000

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694

$33.000

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Ampacity Inc.

Singapore . 1,626 parts In-Stock

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$34.000

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Parana Technologies

USA . 530 parts In-Stock

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$44.925

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530

$44.925

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DigiPath Technology Company

USA . 2,360 parts In-Stock

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$49.468

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$45.511

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$49.468

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IDEA Electronic Components Group

UK . 1,713 parts In-Stock

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$50.478

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$47.954

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$45.430

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$50.478

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$45.430

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ChromeModa Solutions

Germany . 56 parts In-Stock

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$50.478

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$41.392

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Corohmni

South Africa . 2,205 parts In-Stock

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$74.747

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A-Z Elektronik GmbH

Germany . 14,000 parts In-Stock

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Kepictronics

USA . 6,000 parts In-Stock

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Lixinc

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Authorized Procurement Solutions

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Corphita

USA . 3,485 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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S.R.D Solutions

India . 3,000 parts In-Stock

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Continental Prestige Electronics

USA . 1,723 parts In-Stock

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Argo Parts USA

USA . 932 parts In-Stock

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Microchip USA

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Bastille Electronics

Australia . 300 parts In-Stock

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Overview

Elevate your system performance with the XIO2001ZGU by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers unmatched quality and reliability. This bus controller is designed for seamless integration and offers a wide range of applications, making it a versatile solution for various projects. Experience the value of enhanced data transfer rates, increased efficiency, and superior performance with the XIO2001ZGU. Upgrade your technology with Texas Instruments today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection to the internal components of the bus controller, ensuring long-term reliability.

Surface Mount: YES

Surface mount technology helps in compact design and ease of integration into electronic circuits.

Maximum Supply Voltage: 1.65 V

Operates at a maximum supply voltage of 1.65V, ensuring compatibility with a wide range of power sources.

Address Bus Width: 32

With a 32-bit address bus width, the bus controller can handle large amounts of data efficiently.

Package Shape: SQUARE

Square package shape allows for efficient use of space on PCBs and facilitates easier mounting.

Power Supplies (V): 1.5,3.3

Supports multiple power supply voltages (1.5V and 3.3V), providing flexibility in different system configurations.

No. of Terminals: 169

Having 169 terminals allows for a greater number of connections and functionalities in the bus controller.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array, low profile, and fine pitch package style enables high-density mounting and improves signal integrity.

Minimum Supply Voltage: 1.35 V

Supports a minimum supply voltage of 1.35V, allowing for operation in low-power scenarios.

Maximum Operating Temperature: 70 °C

Operates efficiently at temperatures up to 70°C, suitable for various environmental conditions.

Maximum Data Transfer Rate: 250 MBps

High data transfer rate of 250 MBps ensures fast and efficient communication between devices connected to the bus controller.

Minimum Operating Temperature: 0 °C

Functions reliably at temperatures as low as 0°C, making it suitable for a wide range of operating environments.

Terminal Finish: TIN SILVER COPPER

Tin, silver, and copper terminal finish provides good conductivity and corrosion resistance for reliable connections.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy soldering and assembly of the bus controller onto PCBs.

Maximum Seated Height: 1.4 mm

Low maximum seated height of 1.4mm allows for compact designs and space-saving installations.

Width: 12 mm

With a width of 12mm, the bus controller can fit into various electronic systems without occupying too much space.

External Data Bus Width: 32

Same as address bus width, the 32-bit external data bus width enhances the data handling capacity of the bus controller.

Maximum Clock Frequency: 125 MHz

Supporting a maximum clock frequency of 125 MHz allows for rapid data processing and transmission within the system.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for up to 30 seconds during assembly, ensuring proper soldering and connection reliability.

Peak Reflow Temperature °C: 260

Peak reflow temperature capability of 260°C ensures proper soldering and assembly of the bus controller onto PCBs.

Length: 12 mm

Compact length of 12mm allows for space-efficient integration into electronic systems.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures reliable operation in standard environmental conditions.

Peripheral IC Type: BUS CONTROLLER, PCI

Designed as a bus controller with PCI compatibility, making it suitable for a wide range of applications and systems.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the bus controller.

Terminal Form: BALL

Ball terminal form facilitates easy soldering and assembly, ensuring secure connections on the PCB.

Nominal Supply Voltage: 1.5 V

Operates at a nominal supply voltage of 1.5V, ensuring stable and efficient performance in various system configurations.

Bus Compatibility: VGA

Supports VGA bus compatibility, making it suitable for video graphics applications and systems.

Terminal Pitch: 0.8 mm

With a terminal pitch of 0.8mm, the bus controller allows for high-density mounting and efficient use of PCB space.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 indicates that the bus controller requires careful handling during assembly to prevent moisture-related issues.

Technical Specifications

Bus Controllers XIO2001ZGU attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 3.3V SUPPLY

Address Bus Width:

32

Bus Compatibility:

VGA

Maximum Clock Frequency:

125 MHz

Maximum Data Transfer Rate:

250 MBps

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B169

JESD-609 Code:

e1

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

169

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA169,13X13,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Sub-Category:

Bus Controllers

Maximum Supply Voltage:

1.65 V

Minimum Supply Voltage:

1.35 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Trade Compliance

XIO2001ZGU Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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