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XIO2000AZZZ

Texas Instruments

XIO2000AZZZ by Texas Instruments

XIO2000AZZZ by Texas Instruments is a bus controller with 32-bit address and data bus width, operating at up to 125 MHz. It features a low profile grid array package suitable for PCI applications, with supply voltage ranging from 1.35V to 1.65V. This CMOS technology device has a max data transfer rate of 250 MBps and operates in commercial temperature range of 0°C to 70°C.

Median Price

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Lifecycle Status

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8

In-Stock Inventory

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Digiode

USA . 4,224 parts In-Stock

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Vyrian

USA . 2,396 parts In-Stock

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Bas Electronics GmbH & Co. KG

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Bristol Electronics

USA . 20 parts In-Stock

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Atlantic Semiconductor

USA . 20 parts In-Stock

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Cyclops Electronics Ltd

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Semi Source

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Prism Electronics

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AZTECH Wire

Italy . 841 parts In-Stock

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$11.612

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One Stop Electronics

USA . 382 parts In-Stock

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$27.000

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Corohmni

South Africa . 2,047 parts In-Stock

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$48.948

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Parana Technologies

USA . 1,744 parts In-Stock

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IDEA Electronic Components Group

UK . 1,688 parts In-Stock

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ChromeModa Solutions

Germany . 975 parts In-Stock

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S.R.D Solutions

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Lixinc

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DigiPath Technology Company

USA . 1,998 parts In-Stock

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Corphita

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A-Z Elektronik GmbH

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Microchip USA

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Kepictronics

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Overview

Unlock seamless data transfer with the XIO2000AZZZ by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality bus controllers designed to optimize performance and efficiency. Whether you're in need of high-speed data processing or reliable bus control solutions, this product offers exceptional value and benefits. Perfect for a wide range of applications, the XIO2000AZZZ ensures smooth operation and unmatched reliability. Upgrade your systems today with Texas Instruments' cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material that protects the internal components of the bus controller from damage, ensuring longevity and reliability.

Surface Mount: YES

Ease of installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 1.65 V

Efficient power usage while providing sufficient voltage for optimal performance.

Address Bus Width: 32

Wide address bus width allows for efficient data transfer and communication between components.

Package Shape: SQUARE

Compact square shape saves space on the circuit board and allows for efficient placement.

Power Supplies (V): 1.5,3.3

Support for multiple power supply options, offering flexibility in different system configurations.

No. of Terminals: 201

Sufficient number of terminals for connection to other components in the system.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Advanced package style that enhances thermal performance and reliability in various applications.

Minimum Supply Voltage: 1.35 V

Low minimum supply voltage allows for efficient power management and extends the lifespan of the bus controller.

Maximum Operating Temperature: 70 °C

High maximum operating temperature range ensures stable performance even in demanding environmental conditions.

Maximum Data Transfer Rate: 250 MBps

High data transfer rate enables fast communication between devices, improving overall system efficiency.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures reliable performance in various temperature environments.

Terminal Finish: TIN SILVER COPPER

Quality terminal finish that enhances conductivity and corrosion resistance for long-lasting performance.

Terminal Position: BOTTOM

Bottom terminal position allows for easy and secure connection to the circuit board.

Maximum Seated Height: 1.4 mm

Low profile design with maximum seated height for space-saving installation in compact electronic devices.

Width: 15 mm

Optimal width size for efficient placement on the circuit board without taking up too much space.

External Data Bus Width: 32

Matching external data bus width ensures seamless data transfer between the bus controller and other components.

Maximum Clock Frequency: 125 MHz

High clock frequency for fast data processing and communication within the system.

Maximum Time At Peak Reflow Temperature (s): 30

Quick reflow process time for efficient manufacturing and assembly of the bus controller.

Peak Reflow Temperature °C: 260

High peak reflow temperature for reliable soldering and connection during assembly.

Length: 15 mm

Compact length size for space-saving installation on the circuit board.

Temperature Grade: COMMERCIAL

Suitable temperature grade for commercial applications, ensuring consistent performance in standard operating conditions.

Peripheral IC Type: BUS CONTROLLER, PCI

Specifically designed as a bus controller for PCI interfaces, providing compatibility and seamless integration in PCI-based systems.

Technology: CMOS

Advanced CMOS technology for low power consumption, high speed, and reliable performance in the bus controller.

Terminal Form: BALL

Ball terminal form for secure and reliable connections on the circuit board.

Nominal Supply Voltage: 1.5 V

Stable nominal supply voltage for consistent and efficient power delivery to the bus controller.

Terminal Pitch: 0.8 mm

Optimal terminal pitch for easy and accurate soldering during assembly.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 indicates the level of protection needed during storage and handling to prevent moisture-related damage.

Technical Specifications

Bus Controllers XIO2000AZZZ attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 3.3V SUPPLY

Address Bus Width:

32

Maximum Clock Frequency:

125 MHz

Maximum Data Transfer Rate:

250 MBps

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B201

JESD-609 Code:

e1

Length:

15 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

201

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA201,17X17,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Sub-Category:

Bus Controllers

Maximum Supply Voltage:

1.65 V

Minimum Supply Voltage:

1.35 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

15 mm

Peripheral IC Type:

Trade Compliance

XIO2000AZZZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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