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XIO2000AGZZ

Texas Instruments

XIO2000AGZZ by Texas Instruments

XIO2000AGZZ by Texas Instruments is a bus controller with 32-bit address and external data bus width. It operates at a max clock frequency of 125 MHz, supporting a data transfer rate of 250 MBps. This low-profile, fine-pitch IC is ideal for PCI applications in commercial-grade environments.

Median Price

$17.420

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 7,369 parts In-Stock

1+ parts

-

100+ parts

$17.420

1k+ parts

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10k+ parts

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7,369

-

$17.420

-

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Rochester

USA . 7,252 parts In-Stock

1+ parts

-

100+ parts

$15.080

1k+ parts

$13.490

10k+ parts

$12.700

7,252

-

$15.080

$13.490

$12.700

Verical

USA . 2,858 parts In-Stock

1+ parts

-

100+ parts

$18.850

1k+ parts

$16.863

10k+ parts

$15.875

2,858

-

$18.850

$16.863

$15.875

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,351 parts In-Stock

1+ parts

$15.912

100+ parts

-

1k+ parts

-

10k+ parts

-

2,351

$15.912

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-

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Vyrian

USA . 1,990 parts In-Stock

1+ parts

$16.750

100+ parts

-

1k+ parts

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10k+ parts

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1,990

$16.750

-

-

-

DigiKey Marketplace

USA . 7,441 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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7,441

-

-

-

-

PC Components Company LLC

USA . 8 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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8

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Bristol Electronics

USA . 8 parts In-Stock

1+ parts

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100+ parts

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8

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,539 parts In-Stock

1+ parts

$15.075

100+ parts

-

1k+ parts

-

10k+ parts

-

3,539

$15.075

-

-

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Component Stockers USA

USA . 10,245 parts In-Stock

1+ parts

$16.970

100+ parts

$15.950

1k+ parts

$14.420

10k+ parts

-

10,245

$16.970

$15.950

$14.420

-

Corohmni

South Africa . 8 parts In-Stock

1+ parts

$39.176

100+ parts

-

1k+ parts

-

10k+ parts

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8

$39.176

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Parana Technologies

USA . 1,261 parts In-Stock

1+ parts

$47.294

100+ parts

-

1k+ parts

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10k+ parts

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1,261

$47.294

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-

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DigiPath Technology Company

USA . 1,591 parts In-Stock

1+ parts

$52.076

100+ parts

$47.910

1k+ parts

-

10k+ parts

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1,591

$52.076

$47.910

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ChromeModa Solutions

Germany . 4,252 parts In-Stock

1+ parts

$53.139

100+ parts

$43.574

1k+ parts

-

10k+ parts

-

4,252

$53.139

$43.574

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-

IDEA Electronic Components Group

UK . 854 parts In-Stock

1+ parts

$53.139

100+ parts

$50.482

1k+ parts

$47.825

10k+ parts

-

854

$53.139

$50.482

$47.825

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Microchip USA

USA . 234 parts In-Stock

1+ parts

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100+ parts

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234

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Overview

Unlock seamless data transfer and enhanced performance with the XIO2000AGZZ from Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality bus controllers like the XIO2000AGZZ that provide reliable connectivity solutions for a wide range of applications. With its advanced technology and high-speed data transfer rate of up to 250 MBps, this product offers customers unmatched value and efficiency. Upgrade your systems today with the XIO2000AGZZ and experience the difference that superior quality and cutting-edge design can make in your operations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for use in portable or rugged applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the product onto circuit boards, saving time and effort during manufacturing.

Maximum Supply Voltage: 1.65 V

With a low maximum supply voltage requirement, the product ensures energy efficiency and reduces the risk of damage from power spikes.

Address Bus Width: 32

A wide address bus width of 32 allows for efficient communication and data transfer between multiple devices connected to the bus controller.

Package Shape: SQUARE

The square package shape provides easy integration and placement on circuit boards, optimizing space utilization in electronic designs.

Power Supplies (V): 1.5,3.3

Support for multiple power supply options (1.5V and 3.3V) offers flexibility in system design and compatibility with various power sources.

No. of Terminals: 201

Having a high number of terminals allows for versatile connectivity and functionality, enabling the bus controller to interface with a wide range of devices.

Minimum Supply Voltage: 1.35 V

The low minimum supply voltage requirement ensures efficient operation even at lower power levels, enhancing energy efficiency and reliability.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature capability of 70°C ensures reliable performance in a variety of environmental conditions, making the product suitable for industrial applications.

Maximum Data Transfer Rate: 250 MBps

High data transfer rate of 250 MBps allows for fast and efficient communication between devices, improving overall system performance and responsiveness.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C ensures the product can function in cold environments without compromising performance, ideal for a wide range of applications.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides good solderability and reliability during assembly, ensuring secure connections and long-term performance of the product.

Terminal Position: BOTTOM

Bottom terminal position simplifies the integration of the bus controller into circuit boards, allowing for easy access to terminals for connection and testing.

Maximum Seated Height: 1.4 mm

Low maximum seated height of 1.4 mm minimizes the profile of the product on the circuit board, reducing overall system size and improving airflow for better thermal management.

Width: 15 mm

Compact width of 15 mm enables the bus controller to fit in tight spaces within electronic devices, making it suitable for applications with size constraints.

External Data Bus Width: 32

A wide external data bus width of 32 allows for high-speed data transfer between the bus controller and connected devices, enhancing system performance.

Maximum Clock Frequency: 125 MHz

High maximum clock frequency of 125 MHz enables fast data processing and synchronization, ensuring efficient operation of the bus controller in demanding applications.

Maximum Time At Peak Reflow Temperature (s): 20

The maximum time at peak reflow temperature of 20 seconds ensures proper soldering and thermal management during assembly, preventing damage to the product.

Peak Reflow Temperature °C: 220

High peak reflow temperature of 220°C allows for reliable soldering of the bus controller onto circuit boards, ensuring robust connections and long-term performance.

Length: 15 mm

Compact length of 15 mm enhances the overall space efficiency of the product on the circuit board, making it suitable for compact electronic designs.

Temperature Grade: COMMERCIAL

Commercial temperature grade designation ensures the product is suitable for standard operating conditions in commercial applications, offering stable and reliable performance.

Peripheral IC Type: BUS CONTROLLER, PCI

Specifically designed as a bus controller with PCI interface, the product is optimized for managing data communication and control within PCI-based systems, ensuring compatibility and seamless integration.

Technology: CMOS

Utilizing CMOS technology allows for low power consumption, high noise immunity, and reliable operation of the bus controller, making it efficient and suitable for a wide range of applications.

Terminal Form: BALL

Ball terminal form enables secure and reliable connections during soldering, ensuring stable electrical contacts and long-term performance of the bus controller in demanding environments.

Nominal Supply Voltage: 1.5 V

Stable nominal supply voltage of 1.5V ensures consistent power delivery to the bus controller, promoting reliable operation and preventing voltage fluctuations that could affect performance.

Terminal Pitch: 0.8 mm

Narrow terminal pitch of 0.8 mm allows for dense packaging of terminals on the bus controller, optimizing space utilization on the circuit board and improving connectivity efficiency.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates the product can withstand standard moisture exposure during handling and storage, ensuring long-term reliability and performance in various environments.

Technical Specifications

Bus Controllers XIO2000AGZZ attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 3.3V SUPPLY

Address Bus Width:

32

Maximum Clock Frequency:

125 MHz

Maximum Data Transfer Rate:

250 MBps

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B201

JESD-609 Code:

e0

Length:

15 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

201

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA201,17X17,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.5,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Sub-Category:

Bus Controllers

Maximum Supply Voltage:

1.65 V

Minimum Supply Voltage:

1.35 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

15 mm

Peripheral IC Type:

Trade Compliance

XIO2000AGZZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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