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TUSB7340IRKMR

Texas Instruments

TUSB7340IRKMR by Texas Instruments

TUSB7340IRKMR by Texas Instruments is a USB bus controller with 100 terminals, operating at 50 MHz clock frequency. It supports data transfer rates up to 625 MBps and has a supply voltage range of 0.99V to 1.21V. Ideal for industrial applications requiring high-speed USB connectivity on PCI and I2C buses.

Median Price

$7.110

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

$7.110

3,000

-

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-

$7.110

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$9.080

100+ parts

-

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10k+ parts

-

50

$9.080

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Vyrian

USA . 4,195 parts In-Stock

1+ parts

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100+ parts

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4,195

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Digiode

USA . 2,977 parts In-Stock

1+ parts

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100+ parts

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2,977

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Chip Stock

USA . 2,510 parts In-Stock

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2,510

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 4,492 parts In-Stock

1+ parts

$6.040

100+ parts

$5.889

1k+ parts

$5.859

10k+ parts

-

4,492

$6.040

$5.889

$5.859

-

Ampacity Inc.

Singapore . 4,111 parts In-Stock

1+ parts

$6.040

100+ parts

-

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4,111

$6.040

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Continental Prestige Electronics

USA . 3,036 parts In-Stock

1+ parts

$9.080

100+ parts

-

1k+ parts

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10k+ parts

$8.898

3,036

$9.080

-

-

$8.898

Corohmni

South Africa . 2,176 parts In-Stock

1+ parts

$44.397

100+ parts

-

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2,176

$44.397

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Parana Technologies

USA . 1,075 parts In-Stock

1+ parts

$74.564

100+ parts

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1,075

$74.564

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DigiPath Technology Company

USA . 1,083 parts In-Stock

1+ parts

$82.104

100+ parts

$75.536

1k+ parts

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10k+ parts

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1,083

$82.104

$75.536

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ChromeModa Solutions

Germany . 4,099 parts In-Stock

1+ parts

$83.780

100+ parts

$68.700

1k+ parts

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10k+ parts

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4,099

$83.780

$68.700

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IDEA Electronic Components Group

UK . 321 parts In-Stock

1+ parts

$83.780

100+ parts

$79.591

1k+ parts

$75.402

10k+ parts

-

321

$83.780

$79.591

$75.402

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A-Z Elektronik GmbH

Germany . 3,000 parts In-Stock

1+ parts

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100+ parts

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3,000

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Corphita

USA . 1,297 parts In-Stock

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1,297

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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1,000

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Argo Parts USA

USA . 637 parts In-Stock

1+ parts

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100+ parts

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637

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Overview

Experience the unmatched quality of Texas Instruments with the TUSB7340IRKMR Bus Controller. This versatile chip carrier package offers a wide range of applications in industrial settings, providing seamless data transfer at speeds of up to 625 MBps. With a durable plastic/epoxy body and nickel palladium gold terminal finish, this bus controller ensures reliable performance in challenging environments. Trust Texas Instruments to deliver top-notch technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for portable electronic devices.

Surface Mount: YES

The surface mount feature allows for easy and efficient PCB assembly, saving time and labor costs.

Maximum Supply Voltage: 1.21 V

The high maximum supply voltage ensures stable and reliable operation of the bus controller.

Package Shape: SQUARE

The square package shape facilitates compact design and efficient use of PCB space in electronic systems.

Power Supplies (V): 1.1,3.3

The availability of multiple power supply options enhances compatibility with various electronic systems requiring different voltage levels.

No. of Terminals: 100

The high number of terminals allows for versatile connectivity options and functionality in complex electronic setups.

Package Style (Meter): CHIP CARRIER

The chip carrier package style ensures efficient heat dissipation and compact integration in electronic circuits.

Minimum Supply Voltage: 0.99 V

The low minimum supply voltage enables energy-efficient operation and extends the battery life of portable devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in challenging environmental conditions.

Maximum Data Transfer Rate: 625 MBps

The high data transfer rate enables fast and efficient communication between devices, enhancing overall system performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for reliable operation in extreme cold environments, expanding the product's application range.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish ensures high conductivity, corrosion resistance, and longevity of the bus controller.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy and secure mounting on the PCB, ensuring stable connection and performance.

Maximum Seated Height: 0.8 mm

The low maximum seated height allows for slim and compact device design, ideal for space-constrained applications.

Width: 9 mm

The moderate width enables easy integration and placement of the bus controller on the PCB, supporting a well-organized layout.

Maximum Clock Frequency: 50 MHz

The high maximum clock frequency supports fast data processing and communication, essential for demanding real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature ensures safe and efficient soldering during manufacturing processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance makes the bus controller suitable for lead-free soldering processes, complying with environmental standards.

Length: 9 mm

The compact length allows for flexible positioning and integration of the bus controller in various electronic devices and systems.

Temperature Grade: INDUSTRIAL

The industrial temperature grade certification ensures reliable operation in harsh industrial environments with temperature fluctuations.

Peripheral IC Type: BUS CONTROLLER, UNIVERSAL SERIAL BUS

The compatibility with both bus controller and USB peripherals offers versatile connectivity options and broadens the applicability of the product.

Technology: CMOS

The CMOS technology used in the bus controller ensures low power consumption, high speed, and compatibility with various electronic systems.

Terminal Form: BUTT

The butt terminal form simplifies the connection process and ensures secure and reliable electrical contact for optimal performance.

Nominal Supply Voltage: 1.1 V

The nominal supply voltage of 1.1V provides stable power input for the bus controller, ensuring consistent performance and reliability.

Bus Compatibility: PCI; I2C

The compatibility with PCI and I2C bus systems allows for seamless integration into a wide range of electronic products and platforms.

Terminal Pitch: 0.6 mm

The tight terminal pitch of 0.6mm enables high-density mounting of the bus controller on the PCB, maximizing space efficiency.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates that the bus controller has moderate sensitivity to moisture exposure during storage and handling.

Technical Specifications

Bus Controllers TUSB7340IRKMR attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Additional Features:

IT ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

0

Bus Compatibility:

PCI; I2C

Maximum Clock Frequency:

50 MHz

Maximum Data Transfer Rate:

625 MBps

External Data Bus Width:

0

JESD-30 Code:

S-PBCC-B100

JESD-609 Code:

e4

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BCC

Package Equivalence Code:

SLGA100,15X15,24

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.1,3.3

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Bus Controllers

Maximum Supply Voltage:

1.21 V

Minimum Supply Voltage:

.99 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.6 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Trade Compliance

TUSB7340IRKMR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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