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XIO2001IZWSR

Texas Instruments

XIO2001IZWSR by Texas Instruments

XIO2001IZWSR by Texas Instruments is a 169-terminal bus controller with 32-bit address and data bus width. It operates at up to 125 MHz, supporting PCI bus compatibility and a max data transfer rate of 250 MBps. Ideal for industrial applications requiring low-profile, fine-pitch components with a temperature range of -40 to 85°C.

Median Price

$8.070

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 68,882 parts In-Stock

1+ parts

$5.377

100+ parts

$4.712

1k+ parts

$2.662

10k+ parts

-

68,882

$5.377

$4.712

$2.662

-

DigiKey

USA . 217 parts In-Stock

1+ parts

$8.070

100+ parts

$5.284

1k+ parts

$5.152

10k+ parts

-

217

$8.070

$5.284

$5.152

-

Mouser Electronics

USA . 30 parts In-Stock

1+ parts

$8.150

100+ parts

$5.300

1k+ parts

$4.760

10k+ parts

-

30

$8.150

$5.300

$4.760

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$3.993

100+ parts

-

1k+ parts

-

10k+ parts

-

500

$3.993

-

-

-

Digiode

USA . 4,756 parts In-Stock

1+ parts

$5.108

100+ parts

-

1k+ parts

-

10k+ parts

-

4,756

$5.108

-

-

-

Vyrian

USA . 23,419 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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23,419

-

-

-

-

Chip Stock

USA . 3,590 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,590

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 23,535 parts In-Stock

1+ parts

$2.940

100+ parts

$2.866

1k+ parts

$2.852

10k+ parts

-

23,535

$2.940

$2.866

$2.852

-

Ampacity Inc.

Singapore . 23,485 parts In-Stock

1+ parts

$2.940

100+ parts

-

1k+ parts

-

10k+ parts

-

23,485

$2.940

-

-

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Continental Prestige Electronics

USA . 4,068 parts In-Stock

1+ parts

$3.993

100+ parts

-

1k+ parts

-

10k+ parts

$3.913

4,068

$3.993

-

-

$3.913

Argo Parts USA

USA . 2,697 parts In-Stock

1+ parts

$3.993

100+ parts

-

1k+ parts

-

10k+ parts

-

2,697

$3.993

-

-

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

$3.993

100+ parts

-

1k+ parts

-

10k+ parts

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1,000

$3.993

-

-

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Corphita

USA . 3,835 parts In-Stock

1+ parts

$4.839

100+ parts

-

1k+ parts

-

10k+ parts

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3,835

$4.839

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-

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Corohmni

South Africa . 574 parts In-Stock

1+ parts

$28.234

100+ parts

-

1k+ parts

-

10k+ parts

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574

$28.234

-

-

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Parana Technologies

USA . 288 parts In-Stock

1+ parts

$35.216

100+ parts

$3,270.378

1k+ parts

$31.695

10k+ parts

-

288

$35.216

$3,270.378

$31.695

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DigiPath Technology Company

USA . 1,841 parts In-Stock

1+ parts

$38.778

100+ parts

-

1k+ parts

-

10k+ parts

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1,841

$38.778

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-

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ChromeModa Solutions

Germany . 3,644 parts In-Stock

1+ parts

$39.569

100+ parts

$32.447

1k+ parts

-

10k+ parts

-

3,644

$39.569

$32.447

-

-

IDEA Electronic Components Group

UK . 68 parts In-Stock

1+ parts

$39.569

100+ parts

$37.591

1k+ parts

$35.612

10k+ parts

-

68

$39.569

$37.591

$35.612

-

Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$89.237

100+ parts

$84.775

1k+ parts

$84.775

10k+ parts

-

100

$89.237

$84.775

$84.775

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Lixinc

USA . 6,057 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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6,057

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Overview

Unlock the power of seamless data transfer with the XIO2001IZWSR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and reliability. This bus controller is a game-changer for various applications, offering lightning-fast speeds of up to 250 MBps. Say goodbye to compatibility issues as this PCI-compatible device ensures smooth operation. With a low profile and industrial grade temperature tolerance, the XIO2001IZWSR provides unmatched value and performance. Elevate your projects with this cutting-edge technology today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for use in various applications without adding unnecessary weight.

Surface Mount: YES

The surface mount feature allows for easy installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 1.65 V

The maximum supply voltage of 1.65 V ensures compatibility with a wide range of power sources, providing flexibility in application.

Address Bus Width: 32

The 32-bit address bus width allows for efficient data transmission and processing, making the product suitable for high-performance tasks.

Package Shape: SQUARE

The square package shape allows for space-efficient placement on circuit boards, maximizing use of available space.

No. of Terminals: 169

The high number of terminals provides ample connectivity options, allowing for versatile integration with other components.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style enhances heat dissipation and signal integrity, ensuring reliable performance under various conditions.

Minimum Supply Voltage: 1.35 V

The minimum supply voltage of 1.35 V helps in reducing power consumption while maintaining operational efficiency, making it energy-efficient.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance even in harsh environments with elevated temperatures.

Maximum Data Transfer Rate: 250 MBps

The high data transfer rate of 250 MBps enables fast and efficient communication between devices, enhancing overall system performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows for operation in cold conditions without compromising performance.

Terminal Finish: TIN SILVER COPPER

The use of tin silver copper terminal finish provides excellent conductivity and corrosion resistance, ensuring stable connections over time.

Terminal Position: BOTTOM

The bottom terminal position simplifies installation and maintenance, making it easy to access and work with the product.

Maximum Seated Height: 1.4 mm

The low maximum seated height of 1.4 mm helps in minimizing the overall profile of the product, allowing for compact device designs.

Width: 12 mm

The width of 12 mm provides a balance between space efficiency and easy handling, making it suitable for various PCB layouts.

External Data Bus Width: 32

The 32-bit external data bus width enables efficient data transmission between the bus controller and connected devices, ensuring smooth operation.

Maximum Clock Frequency: 125 MHz

The high maximum clock frequency of 125 MHz allows for fast data processing and communication, enhancing overall system performance.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering and reliability during assembly processes.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C enables secure solder joints and component attachment during manufacturing.

Length: 12 mm

The length of 12 mm provides a compact form factor, making the product suitable for space-constrained applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance in rugged environments and extended temperature ranges, making it ideal for industrial applications.

Peripheral IC Type: BUS CONTROLLER, PCI

The bus controller with PCI compatibility allows for seamless integration with PCI devices, expanding compatibility and functionality.

Technology: CMOS

The CMOS technology offers low power consumption and high-speed operation, making the product energy-efficient and suitable for demanding applications.

Terminal Form: BALL

The ball terminal form provides secure connections and easy soldering, ensuring reliable performance and durability.

Nominal Supply Voltage: 1.5 V

The nominal supply voltage of 1.5 V provides stable power input for consistent performance, enhancing the overall reliability of the product.

Bus Compatibility: PCI

The PCI bus compatibility ensures seamless integration with PCI systems, expanding connectivity options and increasing versatility.

Terminal Pitch: 0.8 mm

The 0.8 mm terminal pitch allows for precise placement on PCBs, facilitating soldering and ensuring proper connections for optimal functionality.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates moderate sensitivity to moisture, making the product suitable for a wide range of environments while still requiring standard handling procedures.

Technical Specifications

Bus Controllers XIO2001IZWSR attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 1.5 V SUPPLY

Address Bus Width:

32

Bus Compatibility:

PCI

Maximum Clock Frequency:

125 MHz

Maximum Data Transfer Rate:

250 MBps

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B169

JESD-609 Code:

e1

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

169

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA169,13X13,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage:

1.65 V

Minimum Supply Voltage:

1.35 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Trade Compliance

XIO2001IZWSR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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