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XIO2001ZAJ

Texas Instruments

XIO2001ZAJ by Texas Instruments

XIO2001ZAJ by Texas Instruments is a bus controller with a max data transfer rate of 250 MBps. It has a 32-bit address bus width and is compatible with VGA buses. This peripheral IC type is commonly used in commercial applications requiring high-speed data transfer.

Median Price

$4.898

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 61 parts In-Stock

1+ parts

$2.960

100+ parts

$2.900

1k+ parts

$2.840

10k+ parts

-

61

$2.960

$2.900

$2.840

-

Texas Instruments

USA . 16,453 parts In-Stock

1+ parts

$4.898

100+ parts

$3.993

1k+ parts

$2.662

10k+ parts

-

16,453

$4.898

$3.993

$2.662

-

DigiKey

USA . 260 parts In-Stock

1+ parts

$8.070

100+ parts

$5.284

1k+ parts

$4.893

10k+ parts

$4.776

260

$8.070

$5.284

$4.893

$4.776

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,070 parts In-Stock

1+ parts

$2.812

100+ parts

-

1k+ parts

-

10k+ parts

-

1,070

$2.812

-

-

-

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$4.370

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$4.370

-

-

-

Vyrian

USA . 5,530 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,530

-

-

-

-

Prism Electronics

USA . 20 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

20

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 5,586 parts In-Stock

1+ parts

$2.520

100+ parts

-

1k+ parts

-

10k+ parts

-

5,586

$2.520

-

-

-

Corphita

USA . 3,364 parts In-Stock

1+ parts

$2.664

100+ parts

-

1k+ parts

-

10k+ parts

-

3,364

$2.664

-

-

-

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$4.370

100+ parts

-

1k+ parts

$4.151

10k+ parts

$4.064

1,000

$4.370

-

$4.151

$4.064

Corohmni

South Africa . 1,125 parts In-Stock

1+ parts

$4.797

100+ parts

-

1k+ parts

-

10k+ parts

-

1,125

$4.797

-

-

-

Parana Technologies

USA . 1,046 parts In-Stock

1+ parts

$47.757

100+ parts

-

1k+ parts

-

10k+ parts

-

1,046

$47.757

-

-

-

DigiPath Technology Company

USA . 880 parts In-Stock

1+ parts

$52.587

100+ parts

-

1k+ parts

-

10k+ parts

-

880

$52.587

-

-

-

ChromeModa Solutions

Germany . 6,250 parts In-Stock

1+ parts

$53.660

100+ parts

$44.001

1k+ parts

-

10k+ parts

-

6,250

$53.660

$44.001

-

-

IDEA Electronic Components Group

UK . 33 parts In-Stock

1+ parts

$53.660

100+ parts

$50.977

1k+ parts

$48.294

10k+ parts

-

33

$53.660

$50.977

$48.294

-

Authorized Procurement Solutions

USA . 8,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,000

-

-

-

-

Overview

Upgrade your bus controller with the XIO2001ZAJ by Texas Instruments. With its high-quality manufacturing and reliable performance, this product is a game-changer in the industry. Designed for various applications, it offers unparalleled value and benefits to customers. Experience faster data transfer rates of up to 250 MBps, flexible power supply options, and a compact package shape that fits seamlessly into any setup. Say goodbye to compatibility issues and hello to seamless integration with the XIO2001ZAJ. Upgrade today and unlock new possibilities for your business.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY. This material ensures durability and resistance to impact, making it suitable for rugged environments.

Surface Mount:

YES. The surface mount technology simplifies the installation process and saves space on the PCB.

Maximum Supply Voltage:

1.65 V. This low voltage requirement reduces power consumption and enhances energy efficiency.

Address Bus Width:

32. The wide address bus width allows for efficient data transfer and supports robust communication between components.

Package Shape:

SQUARE. The square shape offers a compact design, optimizing space utilization in electronic systems.

Power Supplies (V):

1.5,3.3. The multiple power supply options provide flexibility and compatibility with diverse system requirements.

No. of Terminals:

144. The high number of terminals ensures effective connectivity and reliable signal transmission.

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH. This package style enables increased density and better signal integrity.

Minimum Supply Voltage:

1.35 V. The low minimum supply voltage enhances power efficiency and extends battery life in portable devices.

Maximum Operating Temperature:

70 °C. The high maximum operating temperature ensures reliable performance even in demanding conditions.

Maximum Data Transfer Rate:

250 MBps. This fast data transfer rate allows for efficient communication and enhances system responsiveness.

Minimum Operating Temperature:

0 °C. The low minimum operating temperature ensures reliable operation in cold environments.

Terminal Finish:

TIN SILVER COPPER. This terminal finish provides excellent conductivity and corrosion resistance, resulting in reliable and long-lasting connections.

Terminal Position:

BOTTOM. The terminals located at the bottom simplify PCB layout and enable efficient heat dissipation.

Maximum Seated Height:

1.2 mm. The low maximum seated height contributes to a compact and space-efficient design.

Width:

7 mm. The small width allows for easy integration into space-constrained systems or PCB designs.

External Data Bus Width:

32. The wide external data bus width enables high-speed data transfer and efficient communication with external devices.

Maximum Clock Frequency:

125 MHz. This high clock frequency enables rapid data processing and enhances system performance.

Maximum Time At Peak Reflow Temperature (s):

30. The extended time at peak reflow temperature ensures proper soldering and reliable connections during assembly.

Peak Reflow Temperature °C:

260. The high peak reflow temperature ensures effective soldering and improves the overall reliability of the product.

Length:

7 mm. The short length contributes to a compact and space-efficient design for easy integration into various electronic systems.

Temperature Grade:

COMMERCIAL. This temperature grade ensures reliable operation within standard commercial operating temperature ranges.

Peripheral IC Type:

BUS CONTROLLER, PCI. This product's peripheral IC type functions as a bus controller for PCI systems, allowing for efficient and reliable data transfer.

Technology:

CMOS. The CMOS technology employed in this product ensures low power consumption, high-speed performance, and reliable operation.

Terminal Form:

BALL. The ball terminal form provides reliable and secure connections, suitable for applications subject to vibration or mechanical stress.

Nominal Supply Voltage:

1.5 V. The nominal supply voltage ensures compatibility with standard power sources and simplifies system integration.

Bus Compatibility:

VGA. This product is compatible with the VGA bus, enabling seamless integration and support for various video applications.

Terminal Pitch:

0.5 mm. The small terminal pitch allows for more compact designs and increased signal density on the PCB.

Moisture Sensitivity Level (MSL):

3. The MSL 3 rating indicates that the product can withstand moderate levels of moisture exposure during handling and storage.

Technical Specifications

Bus Controllers XIO2001ZAJ attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 3.3V SUPPLY

Address Bus Width:

32

Bus Compatibility:

VGA

Maximum Clock Frequency:

125 MHz

Maximum Data Transfer Rate:

250 MBps

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B144

JESD-609 Code:

e1

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

144

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA144,13X13,20

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Controllers

Maximum Supply Voltage:

1.65 V

Minimum Supply Voltage:

1.35 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Trade Compliance

XIO2001ZAJ Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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