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CY7C65211A-24LTXIT

Infineon Technologies

CY7C65211A-24LTXIT by Infineon Technologies

CY7C65211A-24LTXIT by Infineon is a bus controller with max data rate of 1.5 MBps, compatible with I2C, SPI, UART, and VBUS. Operating temp range from -40 to 85 °C makes it ideal for industrial applications. With a square shape and 24 terminals in a chip carrier package style, it's suitable for various peripheral IC uses.

Median Price

$1.750

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 12,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.750

10k+ parts

$1.650

12,500

-

-

$1.750

$1.650

Rochester

USA . 12,500 parts In-Stock

1+ parts

-

100+ parts

$1.570

1k+ parts

$1.400

10k+ parts

$1.320

12,500

-

$1.570

$1.400

$1.320

DigiKey

USA . 2,182 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$2.173

2,182

-

-

-

$2.173

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$2.310

100+ parts

-

1k+ parts

-

10k+ parts

-

500

$2.310

-

-

-

Digiode

USA . 797 parts In-Stock

1+ parts

$3.050

100+ parts

-

1k+ parts

-

10k+ parts

-

797

$3.050

-

-

-

Flip Electronics

USA . 12,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

12,500

-

-

-

-

Vyrian

USA . 2,126 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,126

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 5,759 parts In-Stock

1+ parts

$2.310

100+ parts

-

1k+ parts

-

10k+ parts

$2.264

5,759

$2.310

-

-

$2.264

Argo Parts USA

USA . 2,991 parts In-Stock

1+ parts

$2.310

100+ parts

-

1k+ parts

-

10k+ parts

-

2,991

$2.310

-

-

-

Ampacity Inc.

Singapore . 2,245 parts In-Stock

1+ parts

$2.730

100+ parts

-

1k+ parts

-

10k+ parts

-

2,245

$2.730

-

-

-

Corphita

USA . 964 parts In-Stock

1+ parts

$2.889

100+ parts

-

1k+ parts

-

10k+ parts

-

964

$2.889

-

-

-

Microchip USA

USA . 2,034 parts In-Stock

1+ parts

$11.754

100+ parts

-

1k+ parts

-

10k+ parts

-

2,034

$11.754

-

-

-

Corohmni

South Africa . 630 parts In-Stock

1+ parts

$67.129

100+ parts

-

1k+ parts

-

10k+ parts

-

630

$67.129

-

-

-

Modulus Dynamics

Lithuania . 362 parts In-Stock

1+ parts

$80.893

100+ parts

$77.657

1k+ parts

$74.422

10k+ parts

-

362

$80.893

$77.657

$74.422

-

Bastille Electronics

Australia . 120 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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120

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Overview

Elevate your connectivity with the CY7C65211A-24LTXIT from Infineon Technologies, a leading manufacturer known for superior quality and innovation. As a versatile bus controller, this product offers seamless integration with I2C, SPI, UART, and VBUS bus compatibility, providing high-speed data transfer rates of up to 1.5 MBps. With an industrial temperature grade and nickel palladium gold terminal finish, this chip carrier boasts reliability and durability in various applications. Experience the value and benefits of enhanced connectivity and efficiency with the CY7C65211A-24LTXIT.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for efficient and compact placement on circuit boards, saving space and reducing assembly costs.

Maximum Supply Voltage: 1.89 V

Operating at a relatively low voltage helps in reducing power consumption and heat generation.

Package Shape: SQUARE

Square package shape is easier to handle and mount compared to irregular shapes, enhancing compatibility and ease of assembly.

No. of Terminals: 24

Having a sufficient number of terminals allows for versatile connectivity options and compatibility with various systems.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This combination of package styles offers thermal management, protection, and space-saving benefits in a compact form factor.

Minimum Supply Voltage: 1.71 V

The low minimum supply voltage ensures efficient operation even under low power conditions.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the device can withstand demanding environmental conditions without compromising performance.

Maximum Data Transfer Rate: 1.5 MBps

High data transfer rate enables quick and efficient communication, enhancing overall system performance.

Minimum Operating Temperature: -40 °C

The wide range of operating temperatures makes the product suitable for use in extreme environments without performance degradation.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish provides excellent conductivity, corrosion resistance, and durability for reliable long-term performance.

Terminal Position: QUAD

Quad terminal position allows for stable and secure connection with minimal risk of disconnection or signal loss.

Width: 4 mm

Compact width enables close placement on PCBs, optimizing space utilization in electronic assemblies.

Length: 4 mm

The short length contributes to a compact form factor, ideal for applications with space constraints.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh industrial environments, enhancing product durability and longevity.

Peripheral IC Type: BUS CONTROLLER, UNIVERSAL SERIAL BUS

Support for various bus controller protocols like I2C, SPI, and UART, along with USB compatibility, allows for versatile connectivity options.

Technology: CMOS

Complementary metal-oxide-semiconductor technology offers low power consumption, high noise immunity, and compatibility with a wide range of systems.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and ensures safety during handling and disposal.

Nominal Supply Voltage: 1.8 V

Optimal nominal supply voltage balance between performance and efficiency, ensuring reliable operation under varying load conditions.

Bus Compatibility: I2C; SPI; UART; VBUS

Support for multiple bus interfaces makes the product versatile and compatible with a wide range of systems and devices.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting, enabling more connections in a limited space for enhanced functionality.

Moisture Sensitivity Level (MSL): 3

MSL level indicates the sensitivity to moisture, ensuring proper handling and storage to maintain component integrity.

Drive Interface Standard: RS232; RS422; RS485

Support for various drive interface standards offers flexibility in connecting with different communication protocols and equipment.

Technical Specifications

Bus Controllers CY7C65211A-24LTXIT attributes and parameters. Explore more Bus Controllers devices from Infineon Technologies

Specs

Additional Features:

ALSO OPERATES AT 2V-5.5V SUPPLY RANGE.

Address Bus Width:

0

Bus Compatibility:

I2C; SPI; UART; VBUS

Maximum Data Transfer Rate:

1.5 MBps

Drive Interface Standard:

RS232; RS422; RS485

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N24

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

.6 mm

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

4 mm

Trade Compliance

CY7C65211A-24LTXIT Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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