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PM8532B-F3EI

Microchip Technology

PM8532B-F3EI by Microchip Technology

Microchip Technology's PM8532B-F3EI is a bus controller IC with 650 terminals, operating temperature range of -40 to 105°C, and data transfer rate up to 174 Gbps. It is used in I2C, PCI, SMBUS, and UART applications for efficient peripheral connectivity.

Median Price

$193.390

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

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Mouser Electronics

USA . 17 parts In-Stock

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$193.390

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Nova Conductors

Japan . 24 parts In-Stock

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$180.583

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Vyrian

USA . 7,914 parts In-Stock

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Component Sense

UK . 13 parts In-Stock

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AZTECH Wire

Italy . 721 parts In-Stock

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$6.304

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Aztec Data Supply Inc.

USA . 573 parts In-Stock

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$9.590

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573

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Corohmni

South Africa . 952 parts In-Stock

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$9.777

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Ampacity Inc.

Singapore . 39 parts In-Stock

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$164.380

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39

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Semicontronic

India . 39 parts In-Stock

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$164.380

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$160.270

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$159.449

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Continental Prestige Electronics

USA . 6,238 parts In-Stock

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$180.583

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$176.971

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Netroflash

USA . 2,000 parts In-Stock

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$180.583

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Advanced Electronics

New Zealand . 63 parts In-Stock

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$181.040

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$181.040

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63

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$181.040

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Marpe Global Electronics

Taiwan . 7,196 parts In-Stock

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QualityLine Systems

Poland . 7,196 parts In-Stock

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XL Components Corporation

Australia . 7,196 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Argo Parts USA

USA . 357 parts In-Stock

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iodParts Technologies Inc.

India . 200 parts In-Stock

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Kepictronics

USA . 84 parts In-Stock

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Perfect Parts

USA . 45 parts In-Stock

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EPS Global

USA . 1 parts In-Stock

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Overview

Unlock the power of seamless data transfer with the PM8532B-F3EI Bus Controller by Microchip Technology. Designed with top-notch quality and reliability in mind, this product offers unparalleled performance in various applications. From I2C to PCI and SMBUS to UART, this versatile bus controller ensures smooth communication across different platforms. Experience the benefits of high-speed data transfer rates and temperature resilience, all packaged in a convenient square shape with 650 terminals for easy integration. Trust Microchip Technology to deliver cutting-edge solutions that drive efficiency and productivity in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection, making the product suitable for various environments.

Surface Mount: YES

The surface mount design allows for easy installation and space-saving benefits in compact applications.

Package Shape: SQUARE

The square shape of the package offers stability and uniformity for efficient PCB layout and assembly.

No. of Terminals: 650

With a high number of terminals, this bus controller can support complex connectivity requirements and multiple devices.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature ensures reliable performance in demanding conditions.

Maximum Data Transfer Rate: 174000 MBps

This fast data transfer rate allows for quick and efficient communication between connected devices.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the product can function in extreme cold environments.

Terminal Position: BOTTOM

The terminal position at the bottom facilitates easy integration and connection to other components.

Peripheral IC Type: BUS CONTROLLER, PCI

With compatibility with various bus types, including PCI, this controller offers versatility for different applications.

Technology: CMOS

The CMOS technology used in this product provides low power consumption and high noise immunity for reliable operation.

Terminal Form: BALL

The ball terminal form ensures secure connections and robust performance in challenging conditions.

Bus Compatibility: I2C, PCI, SMBUS, UART

The compatibility with multiple bus protocols allows for seamless integration with a wide range of devices and systems.

Technical Specifications

Bus Controllers PM8532B-F3EI attributes and parameters. Explore more Bus Controllers devices from Microchip Technology

Specs

Bus Compatibility:

I2C, PCI, SMBUS, UART

Maximum Data Transfer Rate:

174000 MBps

JESD-30 Code:

S-PBGA-B650

No. of Terminals:

650

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Position:

BOTTOM

Peripheral IC Type:

Trade Compliance

PM8532B-F3EI Peripheral ICs trade compliance attributes, and parameters.

ECCN

4A994.I

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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