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FUSB307BMPX

Onsemi

FUSB307BMPX by Onsemi

FUSB307BMPX by Onsemi is a BUS CONTROLLER IC with 16 terminals, operating at 2.8-5.5V and industrial temperature range (-40 to 85°C). It features NO LEAD terminal form, 0.5mm pitch, and PLASTIC/EPOXY package suitable for USB applications.

Median Price

$1.397

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,000 parts In-Stock

1+ parts

$1.630

100+ parts

$1.540

1k+ parts

$1.390

10k+ parts

-

3,000

$1.630

$1.540

$1.390

-

Mouser Electronics

USA . 5,869 parts In-Stock

1+ parts

$4.090

100+ parts

$1.880

1k+ parts

$1.430

10k+ parts

$1.400

5,869

$4.090

$1.880

$1.430

$1.400

Arrow

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$1.384

6,000

-

-

-

$1.384

Verical

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

$1.384

6,000

-

-

-

$1.384

Future Electronics

Canada . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

$1.280

3,000

-

-

-

$1.280

Chip1Stop

Japan . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$1.397

3,000

-

-

-

$1.397

RS (Exports)

UK . 2,870 parts In-Stock

1+ parts

-

100+ parts

$2.709

1k+ parts

$2.568

10k+ parts

$2.505

2,870

-

$2.709

$2.568

$2.505

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 984 parts In-Stock

1+ parts

$1.548

100+ parts

-

1k+ parts

-

10k+ parts

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984

$1.548

-

-

-

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$1.666

100+ parts

-

1k+ parts

-

10k+ parts

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500

$1.666

-

-

-

Flip Electronics

USA . 66,000 parts In-Stock

1+ parts

-

100+ parts

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66,000

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-

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Chip Stock

USA . 14,999 parts In-Stock

1+ parts

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14,999

-

-

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NAC Semi

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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$1.970

6,000

-

-

-

$1.970

Vyrian

USA . 4,001 parts In-Stock

1+ parts

-

100+ parts

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4,001

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Holdelec - ElecDif-Pro

France . 2,100 parts In-Stock

1+ parts

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2,100

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Prism Electronics

USA . 10 parts In-Stock

1+ parts

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 4,325 parts In-Stock

1+ parts

$1.180

100+ parts

$1.150

1k+ parts

$1.145

10k+ parts

-

4,325

$1.180

$1.150

$1.145

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Ampacity Inc.

Singapore . 4,182 parts In-Stock

1+ parts

$1.180

100+ parts

-

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4,182

$1.180

-

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Corohmni

South Africa . 108 parts In-Stock

1+ parts

$1.384

100+ parts

-

1k+ parts

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10k+ parts

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108

$1.384

-

-

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Corphita

USA . 1,175 parts In-Stock

1+ parts

$1.467

100+ parts

-

1k+ parts

-

10k+ parts

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1,175

$1.467

-

-

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Continental Prestige Electronics

USA . 3,212 parts In-Stock

1+ parts

$1.660

100+ parts

-

1k+ parts

-

10k+ parts

$1.627

3,212

$1.660

-

-

$1.627

Argo Parts USA

USA . 2,859 parts In-Stock

1+ parts

$1.660

100+ parts

-

1k+ parts

-

10k+ parts

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2,859

$1.660

-

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Netroflash

USA . 100 parts In-Stock

1+ parts

$1.666

100+ parts

-

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10k+ parts

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100

$1.666

-

-

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$1.696

100+ parts

$1.696

1k+ parts

$1.696

10k+ parts

-

5,000

$1.696

$1.696

$1.696

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Microchip USA

USA . 9,697 parts In-Stock

1+ parts

$10.265

100+ parts

-

1k+ parts

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10k+ parts

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9,697

$10.265

-

-

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Aztec Data Supply Inc.

USA . 4,271 parts In-Stock

1+ parts

$15.540

100+ parts

-

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10k+ parts

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4,271

$15.540

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Perfect Parts

USA . 20,110 parts In-Stock

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20,110

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S.R.D Solutions

India . 18,000 parts In-Stock

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Problanco Electronics

Mexico . 8,204 parts In-Stock

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8,204

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Lixinc

USA . 8,095 parts In-Stock

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8,095

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TANS Electronics

Latvia . 7,827 parts In-Stock

1+ parts

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7,827

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SupplyDigital Components

Austria . 7,190 parts In-Stock

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7,190

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Kulean Microsystems

USA . 5,798 parts In-Stock

1+ parts

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5,798

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Futuretech Components

Singapore . 3,000 parts In-Stock

1+ parts

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3,000

-

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UHIMA Technologies

Türkiye . 499 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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499

-

-

-

-

Overview

Elevate your electronics with the FUSB307BMPX from Onsemi, a leading manufacturer in the industry. This innovative Bus Controller boasts top-notch quality and reliability, perfect for a variety of applications. With a package body material of PLASTIC/EPOXY, this product offers unparalleled value and benefits to customers looking for seamless connectivity solutions. Say goodbye to technical headaches and hello to smooth operation with the FUSB307BMPX.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides a lightweight and durable housing for the bus controller, making it ideal for various applications.

Surface Mount: YES

The surface mount capability allows for easy installation and integration into existing circuit boards, saving time and effort during the assembly process.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage of 5.5 V, this bus controller can handle a wide range of power inputs, making it versatile for different system requirements.

Package Shape: SQUARE

The square package shape helps in efficient layout and space utilization on the circuit board, enabling compact and streamlined designs.

No. of Terminals: 16

Having 16 terminals provides ample connectivity options for interfacing with other components and peripherals, enhancing the functionality of the bus controller.

Minimum Operating Temperature: -40 °C

The wide range of minimum operating temperature (-40°C) ensures reliable performance even in harsh environmental conditions, making it suitable for industrial applications.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures the durability and stability of the bus controller during the soldering process, leading to a robust and long-lasting product.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V is commonly used in many electronic systems, making this bus controller compatible with a wide range of devices and applications.

Technical Specifications

Bus Controllers FUSB307BMPX attributes and parameters. Explore more Bus Controllers devices from Onsemi

Specs

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

FUSB307BMPX Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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