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FUSB307BVMPX

Onsemi

FUSB307BVMPX by Onsemi

FUSB307BVMPX by Onsemi is a BUS CONTROLLER IC with 16 terminals, operating voltage range of 2.8V to 5.5V, and industrial temperature grade (-40°C to 105°C). It is designed for UNIVERSAL SERIAL BUS applications, featuring a compact square chip carrier package suitable for surface mount assembly.

Median Price

$1.044

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2,912 parts In-Stock

1+ parts

$0.948

100+ parts

$0.823

1k+ parts

$0.726

10k+ parts

$0.726

2,912

$0.948

$0.823

$0.726

$0.726

Chip1Stop

Japan . 2,636 parts In-Stock

1+ parts

$1.140

100+ parts

$0.743

1k+ parts

$0.739

10k+ parts

-

2,636

$1.140

$0.743

$0.739

-

Mouser Electronics

USA . 39,522 parts In-Stock

1+ parts

$1.720

100+ parts

$1.120

1k+ parts

$0.772

10k+ parts

$0.706

39,522

$1.720

$1.120

$0.772

$0.706

RS (Exports)

UK . 3,000 parts In-Stock

1+ parts

-

100+ parts

$1.260

1k+ parts

$1.034

10k+ parts

-

3,000

-

$1.260

$1.034

-

Verical

USA . 2,912 parts In-Stock

1+ parts

-

100+ parts

$0.823

1k+ parts

$0.726

10k+ parts

$0.726

2,912

-

$0.823

$0.726

$0.726

Farnell

UK . 66 parts In-Stock

1+ parts

-

100+ parts

$0.808

1k+ parts

$0.761

10k+ parts

$0.619

66

-

$0.808

$0.761

$0.619

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,054 parts In-Stock

1+ parts

$0.760

100+ parts

-

1k+ parts

-

10k+ parts

-

1,054

$0.760

-

-

-

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$0.870

100+ parts

-

1k+ parts

-

10k+ parts

-

500

$0.870

-

-

-

Chip Stock

USA . 65,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

65,000

-

-

-

-

Vyrian

USA . 7,155 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,155

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 7,289 parts In-Stock

1+ parts

$0.680

100+ parts

-

1k+ parts

-

10k+ parts

-

7,289

$0.680

-

-

-

Semicontronic

India . 7,176 parts In-Stock

1+ parts

$0.680

100+ parts

$0.663

1k+ parts

$0.660

10k+ parts

-

7,176

$0.680

$0.663

$0.660

-

Corphita

USA . 833 parts In-Stock

1+ parts

$0.720

100+ parts

-

1k+ parts

-

10k+ parts

-

833

$0.720

-

-

-

Corohmni

South Africa . 240 parts In-Stock

1+ parts

$0.800

100+ parts

-

1k+ parts

-

10k+ parts

-

240

$0.800

-

-

-

Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$0.853

100+ parts

-

1k+ parts

$0.818

10k+ parts

-

2,000

$0.853

-

$0.818

-

Argo Parts USA

USA . 3,003 parts In-Stock

1+ parts

$0.870

100+ parts

-

1k+ parts

-

10k+ parts

-

3,003

$0.870

-

-

-

Continental Prestige Electronics

USA . 150 parts In-Stock

1+ parts

$1.670

100+ parts

$1.060

1k+ parts

$0.705

10k+ parts

-

150

$1.670

$1.060

$0.705

-

Aztec Data Supply Inc.

USA . 2,526 parts In-Stock

1+ parts

$65.680

100+ parts

-

1k+ parts

-

10k+ parts

-

2,526

$65.680

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 29,382 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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29,382

-

-

-

-

Perfect Parts

USA . 11,424 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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11,424

-

-

-

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SupplyDigital Components

Austria . 7,858 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,858

-

-

-

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Microchip USA

USA . 7,088 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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7,088

-

-

-

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Problanco Electronics

Mexico . 4,543 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,543

-

-

-

-

Kulean Microsystems

USA . 3,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,500

-

-

-

-

TANS Electronics

Latvia . 2,289 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,289

-

-

-

-

Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,000

-

-

-

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UHIMA Technologies

Türkiye . 102 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

102

-

-

-

-

Overview

Experience seamless connectivity and efficiency with the FUSB307BVMPX by Onsemi. As a leading manufacturer in the industry, Onsemi delivers high-quality bus controllers that are ideal for various applications. This innovative product offers customers unparalleled value and benefits, ensuring smooth operation and reliability. Say goodbye to connectivity issues and hello to enhanced performance with the FUSB307BVMPX. Upgrade your systems today and experience the difference!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material is durable and cost-effective, making the product reliable for long-term use.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving space and simplifying production processes.

Maximum Supply Voltage: 5.5 V

Supports a wide range of supply voltages, providing flexibility in various system configurations.

Package Shape: SQUARE

Square package shape is compact and space-saving, ideal for applications where real estate is limited.

No. of Terminals: 16

Having 16 terminals allows for versatile connectivity options, enabling the product to interface with multiple devices.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The package style offers a balance of heat dissipation, compactness, and low profile design, making it suitable for various applications.

Minimum Supply Voltage: 2.8 V

The minimum supply voltage requirement allows for operation in low-power scenarios, increasing energy efficiency.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions without compromising performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures functionality in cold environments, enhancing product reliability.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable signal transmission.

Terminal Position: QUAD

Quad terminal position allows for improved signal integrity and reduced crosstalk, enhancing overall system performance.

Maximum Seated Height: 0.8 mm

Low maximum seated height minimizes the overall profile of the product, making it suitable for compact electronic devices.

Width: 3 mm

Narrow width dimensions enable easy integration into tight spaces, expanding the product's application versatility.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature specification ensures proper soldering during assembly, preventing overheating and damage to the product.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance allows for reliable soldering processes, ensuring secure connections in manufacturing.

Length: 3 mm

Short length dimensions contribute to the product's compact design, facilitating space-saving installation in electronic systems.

Temperature Grade: INDUSTRIAL

Industrial temperature grade designation signifies robustness and reliability in demanding operating environments, making the product suitable for industrial applications.

Peripheral IC Type: BUS CONTROLLER, UNIVERSAL SERIAL BUS

The peripheral IC type offers bus controller functionality for universal serial bus communication, enabling seamless data transfer between devices.

Terminal Form: NO LEAD

No lead terminal form reduces the risk of solder joint failure and improves signal integrity, ensuring stable and consistent performance.

Nominal Supply Voltage: 3.3 V

Having a nominal supply voltage of 3.3V enables compatibility with standard power sources, simplifying integration into existing systems.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm supports high-density packaging, allowing for more terminals in a limited space and enhancing functionality.

Technical Specifications

Bus Controllers FUSB307BVMPX attributes and parameters. Explore more Bus Controllers devices from Onsemi

Specs

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

16

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

FUSB307BVMPX Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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