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CY7C68023-56LTXCT

Infineon Technologies

CY7C68023-56LTXCT by Infineon Technologies

Infineon's CY7C68023-56LTXCT is a 3.3V bus controller with 56 terminals in a square chip carrier package. Operating from 0 to 70°C, it features CMOS technology and nickel palladium gold finish. Ideal for applications requiring high terminal count and surface mount compatibility.

Median Price

$25.830

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics (Authorized)

USA . 6,000 parts In-Stock

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6,000

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Verical

USA . 4,900 parts In-Stock

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$25.830

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4,900

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$25.830

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Distributors (In-Stock)

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Vyrian

USA . 5,999 parts In-Stock

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5,999

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Flip Electronics

USA . 5,360 parts In-Stock

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5,360

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Digiode

USA . 282 parts In-Stock

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282

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Nova Conductors

Japan . 87 parts In-Stock

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87

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Distributors (Availability)

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Semicontronic

India . 5,994 parts In-Stock

1+ parts

$19.010

100+ parts

$18.535

1k+ parts

$18.440

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5,994

$19.010

$18.535

$18.440

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Ampacity Inc.

Singapore . 5,760 parts In-Stock

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$19.010

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5,760

$19.010

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Aztec Data Supply Inc.

USA . 4,111 parts In-Stock

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$21.841

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$21.841

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Modulus Dynamics

Lithuania . 1,687 parts In-Stock

1+ parts

$40.880

100+ parts

$39.245

1k+ parts

$37.610

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1,687

$40.880

$39.245

$37.610

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Corohmni

South Africa . 2,163 parts In-Stock

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$41.955

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Microchip USA

USA . 149 parts In-Stock

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$51.299

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149

$51.299

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Component Stockers USA

USA . 683 parts In-Stock

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$99.990

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683

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QUARKTWIN TECHNOLOGY LTD

USA . 12,072 parts In-Stock

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Continental Prestige Electronics

USA . 5,616 parts In-Stock

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Corphita

USA . 893 parts In-Stock

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Argo Parts USA

USA . 776 parts In-Stock

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Robosynatics

Brazil . 500 parts In-Stock

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$0.110

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$0.110

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$0.110

500

-

$0.110

$0.110

$0.110

Lucentia Tech

USA . 500 parts In-Stock

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$0.110

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$0.110

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$0.110

500

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$0.110

$0.110

$0.110

Bastille Electronics

Australia . 100 parts In-Stock

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100

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Overview

Unlock the potential of your electronic devices with the CY7C68023-56LTXCT from Infineon Technologies. As a leading manufacturer in the industry, Infineon provides top-quality bus controllers that offer seamless connectivity and reliable performance. Whether you're looking to enhance the functionality of your applications or streamline data transfer processes, this product delivers unmatched value and benefits. With its advanced technology and versatile applications, the CY7C68023-56LTXCT is the perfect solution for all your connectivity needs. Experience the difference with Infineon Technologies today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product ideal for use in various applications.

Surface Mount: YES

Surface mount technology allows for easy installation and is more space-efficient compared to through-hole mounting.

Power Supplies (V): 3.3

Operates at a standard power supply voltage, ensuring compatibility with common power sources.

No. of Terminals: 56

Having multiple terminals allows for more connections and functionality in the bus controller.

Package Style (Meter): CHIP CARRIER

Chip carrier packages provide a compact form factor while maintaining reliability and performance.

Maximum Operating Temperature: 70 °C

Can operate in higher temperature environments without risk of damage or malfunction.

Minimum Operating Temperature: 0 °C

Capable of functioning in low temperature conditions, increasing versatility of use.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish offers excellent conductivity, corrosion resistance, and durability for long-lasting performance.

Terminal Position: QUAD

Quad terminal position allows for easy connections and improves overall efficiency in circuit design.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, enhancing the reliability of the bus controller.

Terminal Pitch: 0.5 mm

With a small terminal pitch, this bus controller can accommodate more terminals in a compact space, increasing its functionality.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that the product can withstand exposure to moderate levels of moisture during storage and handling.

Technical Specifications

Bus Controllers CY7C68023-56LTXCT attributes and parameters. Explore more Bus Controllers devices from Infineon Technologies

Specs

JESD-30 Code:

S-PQCC-N56

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

56

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC56,.31SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

3.3

Qualification:

Not Qualified

Sub-Category:

Bus Controllers

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

CY7C68023-56LTXCT Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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