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PI7C9X2G303ELAZXEX

Diodes Incorporated

PI7C9X2G303ELAZXEX by Diodes Incorporated

Diodes Inc. PI7C9X2G303ELAZXEX is a 36-terminal bus controller chip with 3.3V supply, operating from -40 to 85°C. It supports PCI bus compatibility at speeds up to 3000 MBps, ideal for industrial applications requiring high-speed data transfer and IEEE 1149.6 drive interface standard compliance.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

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Vyrian

USA . 655 parts In-Stock

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655

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Nova Conductors

Japan . 77 parts In-Stock

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Ampacity Inc.

Singapore . 409 parts In-Stock

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$2.000

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409

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AZTECH Wire

Italy . 655 parts In-Stock

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$11.614

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Continental Prestige Electronics

USA . 2,267 parts In-Stock

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Argo Parts USA

USA . 1,495 parts In-Stock

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1,495

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Aranea Global

USA . 1,000 parts In-Stock

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Microchip USA

USA . 294 parts In-Stock

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Overview

Enhance your system's performance with the PI7C9X2G303ELAZXEX by Diodes Incorporated. As a leading manufacturer in the industry, Diodes Incorporated ensures top-notch quality and reliability in their products. This bus controller is perfect for various applications, providing seamless data transfer at a blazing speed of 3000 MBps. With a power supply of 3.3V and industrial-grade temperature tolerance, this chip carrier package offers unmatched value and efficiency to customers. Upgrade your technology with Diodes Incorporated today!

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology makes it easy to install and remove the bus controller, reducing production time and cost.

Package Shape: SQUARE

Square packages are known for efficient use of space on a PCB, allowing for a compact design of the overall system.

Power Supplies (V): 3.3

Operating at a voltage of 3.3V is common in industrial applications, ensuring compatibility with existing systems.

No. of Terminals: 36

Having 36 terminals allows for versatile connectivity options, enabling the bus controller to interface with a wide range of devices.

Package Style (Meter): CHIP CARRIER

Chip carrier packages offer enhanced thermal performance, improving the overall reliability of the bus controller.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this bus controller can withstand harsh environmental conditions without compromising performance.

Maximum Data Transfer Rate: 3000 MBps

The high data transfer rate ensures efficient communication between devices, boosting overall system performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the bus controller to function reliably in cold environments, increasing its versatility.

Terminal Position: QUAD

Quad terminal position provides stable and secure connections, reducing the risk of signal interference or disconnections.

Temperature Grade: INDUSTRIAL

Designed for industrial use, this bus controller can withstand tough conditions in manufacturing or processing environments.

Peripheral IC Type: BUS CONTROLLER, PCI

Being a PCI bus controller, this product is compatible with a wide range of devices and systems, offering seamless integration.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, making this bus controller energy-efficient and reliable.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and ensures safety during manufacturing and disposal.

Nominal Supply Voltage: 3.3 V

Operating at a nominal voltage of 3.3V is standard in many applications, ensuring compatibility and ease of integration.

Bus Compatibility: PCI

PCI bus compatibility allows this controller to work with a wide range of devices, enabling seamless communication and data transfer.

Drive Interface Standard: IEEE 1149.6

Compliance with IEEE 1149.6 drive interface standard ensures interoperability and reliability in data transfer processes.

Technical Specifications

Bus Controllers PI7C9X2G303ELAZXEX attributes and parameters. Explore more Bus Controllers devices from Diodes Incorporated

Specs

Bus Compatibility:

PCI

Maximum Data Transfer Rate:

3000 MBps

Drive Interface Standard:

IEEE 1149.6

JESD-30 Code:

S-XQCC-N36

No. of Terminals:

36

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SLGA136,20X20,32

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

3.3

Qualification:

Not Qualified

Sub-Category:

Bus Controllers

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

QUAD

Peripheral IC Type:

Trade Compliance

PI7C9X2G303ELAZXEX Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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