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TUSB7320IRKMT

Texas Instruments

TUSB7320IRKMT by Texas Instruments

TUSB7320IRKMT by Texas Instruments is a bus controller with a max data transfer rate of 625 MBps. It operates at temperatures ranging from -40 to 85 °C and supports PCI and I2C bus compatibility. This chip carrier package has a square shape, measures 9mm in width and length, with a terminal pitch of 0.6mm, making it suitable for industrial applications requiring high-speed USB connectivity.

Median Price

$12.590

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 500 parts In-Stock

1+ parts

$15.460

100+ parts

$10.550

1k+ parts

$9.920

10k+ parts

-

500

$15.460

$10.550

$9.920

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DigiKey

USA . 257 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$9.719

10k+ parts

-

257

-

-

$9.719

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 650 parts In-Stock

1+ parts

$8.038

100+ parts

-

1k+ parts

-

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650

$8.038

-

-

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Digiode

USA . 4,690 parts In-Stock

1+ parts

$10.326

100+ parts

-

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4,690

$10.326

-

-

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Chip Stock

USA . 6,800 parts In-Stock

1+ parts

-

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6,800

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Vyrian

USA . 468 parts In-Stock

1+ parts

-

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-

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468

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 572 parts In-Stock

1+ parts

$7.170

100+ parts

-

1k+ parts

-

10k+ parts

-

572

$7.170

-

-

-

Semicontronic

India . 563 parts In-Stock

1+ parts

$7.170

100+ parts

$6.991

1k+ parts

$6.955

10k+ parts

-

563

$7.170

$6.991

$6.955

-

Continental Prestige Electronics

USA . 3,844 parts In-Stock

1+ parts

$8.038

100+ parts

-

1k+ parts

-

10k+ parts

$7.877

3,844

$8.038

-

-

$7.877

Corohmni

South Africa . 1,067 parts In-Stock

1+ parts

$8.041

100+ parts

-

1k+ parts

-

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1,067

$8.041

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Corphita

USA . 2,043 parts In-Stock

1+ parts

$9.783

100+ parts

-

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2,043

$9.783

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Parana Technologies

USA . 1,272 parts In-Stock

1+ parts

$17.903

100+ parts

-

1k+ parts

$18.072

10k+ parts

-

1,272

$17.903

-

$18.072

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ChromeModa Solutions

Germany . 1,192 parts In-Stock

1+ parts

$20.116

100+ parts

$16.495

1k+ parts

-

10k+ parts

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1,192

$20.116

$16.495

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IDEA Electronic Components Group

UK . 321 parts In-Stock

1+ parts

$20.116

100+ parts

$19.110

1k+ parts

$18.104

10k+ parts

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321

$20.116

$19.110

$18.104

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Microchip USA

USA . 220 parts In-Stock

1+ parts

$22.470

100+ parts

$22.150

1k+ parts

$21.990

10k+ parts

$21.830

220

$22.470

$22.150

$21.990

$21.830

Aztec Data Supply Inc.

USA . 772 parts In-Stock

1+ parts

$83.400

100+ parts

-

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772

$83.400

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Lixinc

USA . 12,197 parts In-Stock

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12,197

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Perfect Parts

USA . 9,495 parts In-Stock

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9,495

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Argo Parts USA

USA . 3,577 parts In-Stock

1+ parts

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100+ parts

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3,577

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DigiPath Technology Company

USA . 1,785 parts In-Stock

1+ parts

-

100+ parts

$18.137

1k+ parts

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10k+ parts

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1,785

-

$18.137

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Netroflash

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$7.877

1k+ parts

$7.636

10k+ parts

$7.475

500

-

$7.877

$7.636

$7.475

Overview

Upgrade your devices with the TUSB7320IRKMT by Texas Instruments, a top-quality Bus Controller that offers seamless connectivity and high-speed data transfer rates of up to 625 MBps. With a reputation for excellence in technology innovation, Texas Instruments delivers reliable products trusted by industry professionals worldwide. Ideal for applications requiring PCI or I2C compatibility, this chip carrier package boasts a square shape and a low seated height of just 0.8 mm, making it easy to integrate into various designs. Experience the convenience and efficiency this universal serial bus controller brings to your projects, with a wide temperature range and robust terminal finish for added durability. Upgrade to the TUSB7320IRKMT and elevate your electronics to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and lightweight properties to the product, making it suitable for use in various applications.

Surface Mount: YES

Allows for easy and secure installation on circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 1.21 V

Provides a reliable power source for the bus controller to operate efficiently and effectively within the specified voltage range.

Package Shape: SQUARE

Square shape helps in efficient utilization of space on the circuit board, enhancing overall design flexibility.

Power Supplies (V): 1.1, 3.3

Supports multiple power supply options, allowing flexibility in system design and compatibility with different voltage requirements.

No. of Terminals: 100

Sufficient number of terminals for connecting various components, ensuring proper functionality and connectivity in the system.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers compact size and efficient heat dissipation, ideal for space-constrained applications.

Minimum Supply Voltage: 0.99 V

Allows for operation at lower voltages, enhancing energy efficiency and reducing power consumption.

Maximum Operating Temperature: 85 °C

Capable of operating in high-temperature environments, ensuring reliability and performance under demanding conditions.

Maximum Data Transfer Rate: 625 MBps

High data transfer rate facilitates fast and efficient communication between devices, enhancing overall system performance.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme cold conditions, making it suitable for a wide range of operating environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides corrosion resistance and excellent conductivity for reliable terminal connections, ensuring long-term performance.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and assembly, optimizing space utilization and ensuring easy access for connections.

Maximum Seated Height: 0.8 mm

Low profile design reduces overall height of the component, contributing to space-saving and slim device designs.

Width: 9 mm

Compact width dimension allows for easy integration into various system configurations, providing flexibility in design.

Maximum Clock Frequency: 50 MHz

High clock frequency supports fast data processing and communication, enhancing system efficiency and performance.

Maximum Time At Peak Reflow Temperature (s): 30

Optimal reflow temperature management during assembly process, ensuring component reliability and functionality.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures component integrity and reliability during manufacturing processes.

Length: 9 mm

Compact length dimension facilitates space-saving installation, making it suitable for small form factor devices.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable performance in harsh environmental conditions and extended operating temperatures.

Peripheral IC Type: BUS CONTROLLER, UNIVERSAL SERIAL BUS

Integration of bus controller and USB capabilities enhances device connectivity and communication options.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ensuring efficient and reliable operation.

Terminal Form: BUTT

Butt terminal form provides secure and stable connections, reducing the risk of signal interference or disconnections.

Nominal Supply Voltage: 1.1 V

Stable nominal supply voltage ensures consistent and reliable operation of the bus controller within the specified voltage range.

Bus Compatibility: PCI; I2C

Support for multiple bus protocols enhances compatibility with a wide range of devices and systems, enabling versatile connectivity options.

Terminal Pitch: 0.6 mm

Fine terminal pitch allows for compact layout and high-density connections, optimizing PCB design efficiency.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, requiring standard precautions during storage and handling to maintain component integrity.

Technical Specifications

Bus Controllers TUSB7320IRKMT attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Additional Features:

IT ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

0

Bus Compatibility:

PCI; I2C

Maximum Clock Frequency:

50 MHz

Maximum Data Transfer Rate:

625 MBps

External Data Bus Width:

0

JESD-30 Code:

S-PBCC-B100

JESD-609 Code:

e4

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BCC

Package Equivalence Code:

SLGA100,15X15,24

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.1,3.3

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Bus Controllers

Maximum Supply Voltage:

1.21 V

Minimum Supply Voltage:

.99 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.6 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Trade Compliance

TUSB7320IRKMT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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