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FT232HPQ-TRAY

FTDI

FT232HPQ-TRAY by FTDI

FTDI's FT232HPQ-TRAY is a bus controller with 56 terminals, supporting I2C, SPI, UART, and USB. It operates b/w -40 to 85 °C with data transfer rate up to 40 MBps. The chip carrier package has a square shape measuring 8mm x 8mm and requires a supply voltage of 1.08V to 1.32V for various applications.

Median Price

$4.795

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 300 parts In-Stock

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$4.480

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TME

Poland . 253 parts In-Stock

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$5.110

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Vyrian

USA . 1,919 parts In-Stock

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Bristol Electronics

USA . 180 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 1 parts In-Stock

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Distributors (Availability)

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Aranea Global

USA . 500 parts In-Stock

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$4.390

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$4.215

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$4.390

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Continental Prestige Electronics

USA . 6,161 parts In-Stock

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$4.480

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Argo Parts USA

USA . 2,391 parts In-Stock

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$4.480

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AZTECH Wire

Italy . 471 parts In-Stock

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$13.841

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Corohmni

South Africa . 876 parts In-Stock

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$61.199

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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$75.893

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$72.099

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$72.099

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Aztec Data Supply Inc.

USA . 2,972 parts In-Stock

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$83.670

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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Overview

Experience seamless data transfer with the FT232HPQ-TRAY by FTDI, a high-quality bus controller designed to deliver reliable performance in various applications. With FTDI's reputation for excellence in manufacturing, this surface-mount device offers customers exceptional value and benefits. Whether you need it for I2C, SPI, UART, or USB bus compatibility, this chip carrier with a thin profile and shrink pitch is your go-to solution. Trust FTDI to provide top-notch technology that exceeds expectations.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving space and reducing complexity of assembly.

Maximum Supply Voltage: 1.32 V

Provides a higher supply voltage for reliable and efficient performance of the bus controller.

Package Shape: SQUARE

The square package shape offers uniformity and ease of handling during assembly and installation.

No. of Terminals: 56

Having a high number of terminals allows for versatile connectivity options and compatibility with a wide range of devices.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

This package style provides efficient thermal management, compact form factor, and compatibility with different mounting configurations.

Minimum Supply Voltage: 1.08 V

The low minimum supply voltage ensures energy efficiency and reliable operation even in low power conditions.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the bus controller can withstand harsh environmental conditions and maintain stable performance.

Maximum Data Transfer Rate: 40 MBps

The high data transfer rate enables fast and efficient communication between devices connected through the bus controller.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for reliable operation in extreme cold environments.

Terminal Position: QUAD

Quad terminal positioning offers stability and ease of connection to other components or devices.

Maximum Seated Height: 0.9 mm

The low maximum seated height ensures compatibility with compact electronic devices and helps in maintaining a slim profile.

Width: 8 mm

The compact width of the bus controller makes it suitable for applications where space is limited.

Length: 8 mm

The compact length of the bus controller contributes to space-saving design and ease of integration into various devices.

Peripheral IC Type: BUS CONTROLLER, UNIVERSAL SERIAL BUS

Supports multiple bus protocols including I2C, SPI, UART, and USB, making it versatile and compatible with a wide range of devices and systems.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with various digital systems.

Terminal Form: NO LEAD

The no lead terminal form simplifies the installation process, reduces soldering requirements, and improves reliability.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage provides a stable power source for the bus controller, ensuring consistent performance and compatibility.

Bus Compatibility: I2C; SPI; UART; USB

Supports multiple bus protocols, allowing for seamless integration with various devices and systems.

Terminal Pitch: 0.5 mm

The small terminal pitch enables high-density mounting and efficient use of board space, making it suitable for compact electronic designs.

Technical Specifications

Bus Controllers FT232HPQ-TRAY attributes and parameters. Explore more Bus Controllers devices from FTDI

Specs

Bus Compatibility:

I2C; SPI; UART; USB

Maximum Data Transfer Rate:

40 MBps

JESD-30 Code:

S-XQCC-N56

Length:

8 mm

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Code:

Package Equivalence Code:

LCC56,.31SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Maximum Seated Height:

.9 mm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

8 mm

Trade Compliance

FT232HPQ-TRAY Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

FTDI

FTDI Chip is a fab-less semiconductor company established in 1992, partnered with the world’s leading foundries. The headquarter is located in Glasgow, UK and is supported with research and development facilities in Glasgow, Singapore and Taipei (Taiwan) plus regional sales and technical support sites in Glasgow, Taipei, Tigard (Oregon, USA) and Shanghai (China). FTDI Chip develops innovative silicon solutions that enhance interaction with the latest in global technology. The major objective from the company is to ‘bridge technologies’ in order to support engineers with highly sophisticated, feature-rich, robust and simple-to-use product platforms. FTDI Chip continues its philosophy of Design Made Easy, where it strives to incorporate device and system features in its chips that enable the designer to quickly and easily create and implement designs. We supplement this strategy, with WW regional support and a “total” solutions mindset to provide reduced development and debug costs and a fast time to market.

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