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USB7252C/KDX

Microchip Technology

USB7252C/KDX by Microchip Technology

Microchip Technology's USB7252C/KDX is a BUS CONTROLLER with 100 terminals, operating at 0-70 °C. It supports data transfer rates up to 1250 MBps and has a clock frequency of 25 MHz. Ideal for I2C, I2S, SMBUS, SPI, and USB applications.

Median Price

$11.800

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 6,288 parts In-Stock

1+ parts

$9.830

100+ parts

$7.450

1k+ parts

$6.880

10k+ parts

$6.530

6,288

$9.830

$7.450

$6.880

$6.530

Mouser Electronics

USA . 210 parts In-Stock

1+ parts

$11.800

100+ parts

$9.500

1k+ parts

-

10k+ parts

-

210

$11.800

$9.500

-

-

DigiKey

USA . 108 parts In-Stock

1+ parts

$11.800

100+ parts

$9.500

1k+ parts

-

10k+ parts

-

108

$11.800

$9.500

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 1,107 parts In-Stock

1+ parts

$70.946

100+ parts

-

1k+ parts

-

10k+ parts

-

1,107

$70.946

-

-

-

Fulton Briggs Corp.

USA . 7,011 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,011

-

-

-

-

Authorized Procurement Solutions

USA . 1,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,500

-

-

-

-

Overview

Unlock seamless connectivity and efficiency with the USB7252C/KDX from Microchip Technology. As a leading manufacturer, Microchip ensures top-tier quality and reliability in their bus controllers. Ideal for applications in I2C, I2S, SMBus, SPI, and USB, this versatile component offers lightning-fast data transfer rates of up to 1250 MBps, maximizing productivity and performance. Say goodbye to compatibility issues and hello to streamlined operations with the USB7252C/KDX. Experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material is lightweight, durable, and cost-effective, making this product suitable for various applications.

Surface Mount: YES

The ability for surface mounting allows for easy and efficient installation, saving time and effort during assembly.

Maximum Supply Voltage: 1.21 V

With a high maximum supply voltage, this product can handle power fluctuations without getting damaged, ensuring reliable performance.

Package Shape: SQUARE

The square package shape helps in easy integration into circuit designs, optimizing board space and layout.

No. of Terminals: 100

Having a high number of terminals provides versatility in connectivity options, allowing for complex system configurations.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles offers efficient heat dissipation and space-saving benefits.

Minimum Supply Voltage: 1.09 V

The low minimum supply voltage requirement ensures energy efficiency and compatibility with a wide range of power sources.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this product can withstand demanding environmental conditions, increasing its reliability.

Maximum Data Transfer Rate: 1250 MBps

The high data transfer rate enables fast and efficient communication between devices, enhancing overall system performance.

Minimum Operating Temperature: 0 °C

The ability to operate at low temperatures ensures functionality in various environments, making this product suitable for a wide range of applications.

Terminal Finish: Matte Tin (Sn)

The matte tin finish provides excellent solderability and corrosion resistance, ensuring long-term reliability in various operating conditions.

Terminal Position: QUAD

The quad terminal position offers increased connectivity options and ease of integration into circuit designs for optimized functionality.

Maximum Seated Height: 0.9 mm

With a low maximum seated height, this product allows for compact design layouts and efficient use of space in electronic devices.

Width: 12 mm

The width of 12mm provides a compact form factor, making this product suitable for applications where space is limited.

Maximum Clock Frequency: 25 MHz

The high maximum clock frequency allows for fast data processing and communication, enhancing the overall performance of the product.

Length: 12 mm

With a length of 12mm, this product offers a balanced form factor for easy integration into various electronic systems.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures reliable operation in standard temperature ranges, making this product suitable for commercial applications.

Peripheral IC Type: BUS CONTROLLER, UNIVERSAL SERIAL BUS

The peripheral IC type of bus controller and universal serial bus enhances the connectivity and compatibility of this product with a wide range of devices.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, contributing to the energy efficiency and reliability of this product.

Terminal Form: NO LEAD

The no-lead terminal form enhances the mechanical and thermal performance of this product, ensuring robust connectivity and solder joint reliability.

Nominal Supply Voltage: 1.15 V

The nominal supply voltage of 1.15V is suitable for stable and efficient operation, meeting the power requirements of various applications.

Bus Compatibility: I2C; I2S; SMBUS; SPI; USB

The compatibility with various bus protocols such as I2C, I2S, SMBUS, SPI, and USB enhances the versatility and connectivity options of this product.

Terminal Pitch: 0.4 mm

The small terminal pitch of 0.4mm allows for high-density mounting, enabling compact and efficient PCB designs with increased functionality.

Technical Specifications

Bus Controllers USB7252C/KDX attributes and parameters. Explore more Bus Controllers devices from Microchip Technology

Specs

Additional Features:

ALSO OPERATES AT 3.3V SUPPLY

Bus Compatibility:

I2C; I2S; SMBUS; SPI; USB

Maximum Clock Frequency:

25 MHz

Maximum Data Transfer Rate:

1250 MBps

JESD-30 Code:

S-PQCC-N100

JESD-609 Code:

e3

Length:

12 mm

No. of Terminals:

100

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC100,.47SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

.9 mm

Maximum Supply Voltage:

1.21 V

Minimum Supply Voltage:

1.09 V

Nominal Supply Voltage:

1.15 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

12 mm

Trade Compliance

USB7252C/KDX Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

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