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CYUSB3610-68LTXC

Infineon Technologies

CYUSB3610-68LTXC by Infineon Technologies

CYUSB3610-68LTXC by Infineon Technologies is a USB bus controller with 68 terminals, operating at 25 MHz clock frequency and supporting data transfer rates up to 1000 MBps. It is designed for applications requiring high-speed USB connectivity in commercial-grade environments, featuring a square package shape with a very thin profile suitable for surface mount assembly.

Median Price

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Lifecycle Status

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Flip Electronics

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Cyclops Electronics Ltd

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Nova Conductors

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PC Components Company LLC

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Bristol Electronics

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Sensible Micro Corp

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NexGen Digital

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Ampacity Inc.

Singapore . 1,617 parts In-Stock

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Semicontronic

India . 671 parts In-Stock

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AZTECH Wire

Italy . 218 parts In-Stock

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Aztec Data Supply Inc.

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Corohmni

South Africa . 2,549 parts In-Stock

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Modulus Dynamics

Lithuania . 4,023 parts In-Stock

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Continental Prestige Electronics

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Argo Parts USA

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Overview

Unlock the power of seamless data transfer with the CYUSB3610-68LTXC from Infineon Technologies. As a trusted leader in bus controllers, Infineon delivers unmatched reliability and performance in every product. Perfect for a wide range of applications, this chip carrier boasts a very thin profile and a maximum data transfer rate of 1000 MBps. Say goodbye to slow connectivity and hello to efficient, high-speed solutions. Upgrade your systems today with the CYUSB3610-68LTXC and experience the difference Infineon quality can make.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and reducing costs.

Maximum Supply Voltage: 1.26 V

Higher maximum supply voltage provides flexibility in power input options.

Package Shape: SQUARE

Square package shape allows for efficient use of board space and easy integration into designs.

No. of Terminals: 68

Having a high number of terminals allows for connectivity with multiple devices, enhancing functionality.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The chip carrier package style with heat sink/slug and very thin profile helps in heat dissipation and compact design, suitable for space-constrained applications.

Minimum Supply Voltage: 1.14 V

Lower minimum supply voltage helps in reducing power consumption and improving energy efficiency.

Maximum Operating Temperature: 70 °C

High maximum operating temperature ensures reliable performance even in harsh environments.

Maximum Data Transfer Rate: 1000 MBps

High data transfer rate allows for fast and efficient communication between devices.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures functionality in a wide range of environmental conditions.

Terminal Position: QUAD

Quad terminal position offers versatility in connection options and compatibility with various systems.

Maximum Seated Height: 0.9 mm

Low maximum seated height makes the product suitable for slim and compact designs.

Width: 8 mm

Compact width allows for easy integration into tight spaces.

Maximum Clock Frequency: 25 MHz

High maximum clock frequency enables fast data processing and efficient operation.

Length: 8 mm

Short length contributes to a compact form factor, ideal for space-saving designs.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures reliable operation in standard operating conditions.

Peripheral IC Type: BUS CONTROLLER, UNIVERSAL SERIAL BUS

Being a bus controller for USB, this product facilitates communication and data exchange between devices effectively.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with various systems.

Terminal Form: NO LEAD

No lead terminal form enhances reliability and allows for a smaller footprint on the PCB.

Nominal Supply Voltage: 1.2 V

Stable nominal supply voltage ensures consistent performance of the device.

Bus Compatibility: USB

Compatibility with USB bus ensures seamless integration with a wide range of devices and systems.

Terminal Pitch: 0.4 mm

Narrow terminal pitch enables high-density mounting and compact layout design.

Drive Interface Standard: IEEE 802.3AZ

Compliance with IEEE 802.3AZ drive interface standard ensures interoperability and industry compatibility.

Technical Specifications

Bus Controllers CYUSB3610-68LTXC attributes and parameters. Explore more Bus Controllers devices from Infineon Technologies

Specs

Additional Features:

IEEE 802.1P; IEEE 802.1Q; IEEE 802.3; IEEE 802.3AB; IEEE 802.3U

Address Bus Width:

0

Bus Compatibility:

USB

Maximum Clock Frequency:

25 MHz

Maximum Data Transfer Rate:

1000 MBps

Drive Interface Standard:

IEEE 802.3AZ

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N68

Length:

8 mm

No. of Terminals:

68

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

.9 mm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

8 mm

Trade Compliance

CYUSB3610-68LTXC Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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