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ADF4360-0BCPRL

Analog Devices

ADF4360-0BCPRL by Analog Devices

Analog Devices' ADF4360-0BCPRL is a BICMOS technology Cellphone IC with 24 terminals, operating at 3.3V. It features a square package shape, tin lead finish, and industrial temperature grade. Ideal for baseband circuits in cellphones due to its compact size (4x4mm) and low power consumption (1mm seated height).

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,787 parts In-Stock

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Digiode

USA . 619 parts In-Stock

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619

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Native Components

USA . 668 parts In-Stock

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$0.507

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668

$0.507

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Northwest PG Solutions

USA . 2,364 parts In-Stock

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$0.557

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$0.491

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$0.491

Parana Technologies

USA . 3,666 parts In-Stock

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$6.335

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$5.892

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3,666

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IDEA Electronic Components Group

UK . 49 parts In-Stock

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$6.812

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$6.471

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49

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DigiPath Technology Company

USA . 1,914 parts In-Stock

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$10.627

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$10.202

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AZTECH Wire

Italy . 569 parts In-Stock

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$18.206

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One Stop Electronics

USA . 1,096 parts In-Stock

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$340.000

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Semicontronic

India . 1,643 parts In-Stock

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$815.000

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$794.625

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$790.550

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Corphita

USA . 426 parts In-Stock

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Overview

Experience unparalleled quality and reliability with the ADF4360-0BCPRL by Analog Devices, a leading manufacturer in the industry. This innovative cellphone IC boasts a wide range of applications, offering customers exceptional value and benefits. With its surface mount capability and compact square package shape, this product is perfect for various telecom IC type applications. Trust Analog Devices to deliver cutting-edge technology that exceeds expectations. Elevate your projects with the ADF4360-0BCPRL and unlock new possibilities today.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly, reducing manufacturing costs and improving product reliability.

Package Shape: SQUARE

Square package shape provides a compact and space-efficient design, making it suitable for devices with limited space constraints.

Power Supplies (V): 3.3

Operates on a commonly used and stable voltage, ensuring compatibility with various systems and power sources.

No. of Terminals: 24

Sufficient number of terminals for versatile connectivity options and integration within different circuit configurations.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles offers thermal management benefits, space-saving advantages, and enhanced performance.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures, making it suitable for industrial and demanding applications.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for reliable performance in extreme environmental conditions.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides good solderability and electrical conductivity, ensuring robust connections.

Terminal Position: QUAD

Quad terminal position enables efficient routing of signals and power, enhancing overall signal integrity and performance.

Maximum Seated Height: 1 mm

Low profile design facilitates compact device layout and integration in thin form factors.

Width: 4 mm

Narrow width allows for space-saving installation and compatibility with smaller device designs.

Peak Reflow Temperature °C: 240

High peak reflow temperature ensures proper soldering and assembly, enhancing product reliability and durability.

Length: 4 mm

Compact length contributes to overall space efficiency and compatibility with various device sizes.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in harsh industrial environments.

Technology: BICMOS

BICMOS technology combines the benefits of both bipolar and CMOS technologies, offering high performance and low power consumption.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and promotes eco-friendly manufacturing practices.

Telecom IC Type: BASEBAND CIRCUIT

Baseband circuit telecom IC type is suitable for a wide range of telecommunications applications, ensuring versatile usage.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent and reliable performance across different operating conditions.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density packaging and precise connection, enhancing circuit board layout flexibility.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, requiring appropriate handling and storage procedures for reliable operation.

Technical Specifications

Cellphone ICs ADF4360-0BCPRL attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N24

JESD-609 Code:

e0

Length:

4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

240

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

4 mm

Trade Compliance

ADF4360-0BCPRL Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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