Loading...

TEF8102EN/N1Y

NXP Semiconductors

TEF8102EN/N1Y by NXP Semiconductors

RF AND BASEBAND CIRCUIT; Moisture Sensitivity Level (MSL): 2; Peak Reflow Temperature (C): 260;

Median Price

$28.496

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 9,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$30.393

9,000

-

-

-

$30.393

Rochester

USA . 956 parts In-Stock

1+ parts

-

100+ parts

$26.600

1k+ parts

$23.800

10k+ parts

$22.400

956

-

$26.600

$23.800

$22.400

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 34,150 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

34,150

-

-

-

-

Digiode

USA . 2,292 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,292

-

-

-

-

Vyrian

USA . 1,226 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,226

-

-

-

-

Flip Electronics

USA . 966 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

966

-

-

-

-

Anansix

USA . 450 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

450

-

-

-

-

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

100

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 80 parts In-Stock

1+ parts

$5.990

100+ parts

-

1k+ parts

-

10k+ parts

-

80

$5.990

-

-

-

Advanced Electronics

New Zealand . 600 parts In-Stock

1+ parts

$12.273

100+ parts

$11.168

1k+ parts

$10.064

10k+ parts

-

600

$12.273

$11.168

$10.064

-

Corohmni

South Africa . 51 parts In-Stock

1+ parts

$13.536

100+ parts

-

1k+ parts

-

10k+ parts

-

51

$13.536

-

-

-

AZTECH Wire

Italy . 866 parts In-Stock

1+ parts

$13.673

100+ parts

-

1k+ parts

-

10k+ parts

-

866

$13.673

-

-

-

One Stop Electronics

USA . 1,213 parts In-Stock

1+ parts

$186.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,213

$186.000

-

-

-

Component Connect

USA . 234,968 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

234,968

-

-

-

-

Authorized Procurement Solutions

USA . 12,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

12,000

-

-

-

-

GreenTree Electronics

Israel . 12,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

12,000

-

-

-

-

Epart123

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$24.500

6,000

-

-

-

$24.500

Lixinc

USA . 5,586 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,586

-

-

-

-

Continental Prestige Electronics

USA . 3,768 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,768

-

-

-

-

Corphita

USA . 2,851 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,851

-

-

-

-

Futuretech Components

Singapore . 2,091 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,091

-

-

-

-

Argo Parts USA

USA . 1,824 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,824

-

-

-

-

UNI Independent Distributors

Spain . 214 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

214

-

-

-

-

Bastille Electronics

Australia . 10 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10

-

-

-

-

Technical Specifications

Cellphone ICs TEF8102EN/N1Y attributes and parameters. Explore more Cellphone ICs devices from NXP Semiconductors

Specs

Moisture Sensitivity Level (MSL):

2

Peak Reflow Temperature (C):

260

Telecom IC Type:

Trade Compliance

TEF8102EN/N1Y Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 5