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MAX2351ETI

Analog Devices

MAX2351ETI by Analog Devices

Analog Devices' MAX2351ETI is a Cellphone IC with BICMOS tech, 28 terminals in a square chip carrier package. Operating temp range -40 to 85 °C, suitable for RF and baseband circuits in telecom applications. Dimensions: 5x5mm, terminal pitch 0.5mm, max seated height 0.9mm.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,894 parts In-Stock

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Digiode

USA . 2,386 parts In-Stock

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Vyrian

USA . 672 parts In-Stock

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672

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Prism Electronics

USA . 55 parts In-Stock

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55

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MARBEL Systems

Belgium . 5,812 parts In-Stock

1+ parts

$5.900

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$5.900

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Texas Native Microelectronics

USA . 222 parts In-Stock

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$6.782

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$6.511

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$6.307

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$5.968

222

$6.782

$6.511

$6.307

$5.968

Kenton Components

USA . 1,000 parts In-Stock

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$8.138

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$7.162

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$8.138

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$7.162

AZTECH Wire

Italy . 532 parts In-Stock

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$14.377

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Qasali Group International

UK . 7,168 parts In-Stock

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$18.311

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$17.030

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$16.114

7,168

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$16.114

Semicontronic

India . 1,540 parts In-Stock

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$299.000

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$291.525

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$290.030

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One Stop Electronics

USA . 2,081 parts In-Stock

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$552.000

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Corphita

USA . 934 parts In-Stock

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934

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Perfect Parts

USA . 62 parts In-Stock

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Overview

Enhance the performance of your cellphone with the MAX2351ETI by Analog Devices. As a leading manufacturer in the industry, Analog Devices delivers top-quality Cellphone ICs that are surface mountable and offer a wide range of applications. With a compact square package shape and 28 terminals, this product is designed for maximum efficiency and reliability. Experience the benefits of this advanced technology, including improved signal processing and enhanced communication capabilities. Trust Analog Devices to provide innovative solutions that exceed your expectations. Elevate your cellphone experience with the MAX2351ETI.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for smaller and more compact designs, making it ideal for portable devices like cellphones.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles help in efficient heat dissipation and overall space-saving in the design.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability and stability even under demanding environmental conditions.

Nominal Supply Voltage: 2.75 V

The low nominal supply voltage contributes to power efficiency and longer battery life in cellphones.

Technical Specifications

Cellphone ICs MAX2351ETI attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N28

JESD-609 Code:

e0

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

240

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Nominal Supply Voltage:

2.75 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

20

Width:

5 mm

Trade Compliance

MAX2351ETI Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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