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MAX2044ETP+

Analog Devices

MAX2044ETP+ by Analog Devices

MAX2044ETP+ by Analog Devices is a Cellphone IC with 20 terminals, operating at -40 to 85 °C. It features BICMOS technology, RF and baseband circuit for telecom applications, and requires 3.3V nominal voltage. The package style is chip carrier with a very thin profile, suitable for surface mount applications.

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MAX2044ETP+ by Analog Devices
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Vyrian

USA . 8,525 parts In-Stock

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Digiode

USA . 2,594 parts In-Stock

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Anansix

USA . 411 parts In-Stock

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MARBEL Systems

Belgium . 3,255 parts In-Stock

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$12.447

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Texas Native Microelectronics

USA . 33 parts In-Stock

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$14.307

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$13.735

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$13.306

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$12.590

33

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$12.590

Kenton Components

USA . 1,062 parts In-Stock

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$17.168

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AZTECH Wire

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Qasali Group International

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Component Stockers USA

USA . 673 parts In-Stock

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$99.990

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Semicontronic

India . 316 parts In-Stock

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$98.475

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One Stop Electronics

USA . 1,953 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Perfect Parts

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Overview

Upgrade your cellphone performance with the MAX2044ETP+ by Analog Devices. Trusted for its quality and reliability, Analog Devices leads the industry in cellphone ICs. This compact surface mount chip carrier offers a wide range of applications, from RF to baseband circuits. With a nominal supply voltage of 3.3V and a maximum supply current of only 0.155mA, this industrial-grade product delivers exceptional value and efficiency. Experience seamless connectivity and enhanced functionality with the MAX2044ETP+ - the perfect choice for your next project.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on a circuit board, making this product suitable for mass production and integration into various devices.

Package Shape: SQUARE

The square package shape provides a compact design, saving space on the circuit board and allowing for denser integration of components.

Power Supplies (V): 3.3/5

The dual power supply options of 3.3V and 5V offer flexibility in voltage requirements for different applications, making this product versatile and compatible with various systems.

No. of Terminals: 20

With a higher number of terminals, this product can support more complex circuit connections and functionalities, expanding its capabilities compared to products with fewer terminals.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles ensures efficient heat dissipation, improved performance, and reduced size, making this product ideal for high-performance applications in compact devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C allows the product to withstand elevated temperatures without performance degradation, ensuring reliable operation even in demanding environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C ensures the product's functionality in extreme cold conditions, making it suitable for a wide range of operating environments.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin terminal finish provides excellent solderability and corrosion resistance, ensuring reliable connections and long-term performance of the product.

Terminal Position: QUAD

The quad terminal position offers increased stability and ease of soldering during installation, enhancing the product's reliability and manufacturing efficiency.

Maximum Seated Height: 0.8 mm

The maximum seated height of 0.8mm allows for a low-profile installation, reducing overall system height and enabling the product to be used in slim devices or applications with space constraints.

Width: 5 mm

The compact width of 5mm facilitates the product's integration into tight spaces on the circuit board, optimizing board layout and allowing for efficient use of available space.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering and reflow processes during manufacturing, contributing to the product's quality and reliability.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260 °C enables effective soldering of the product onto the circuit board, ensuring strong and durable connections for robust performance.

Length: 5 mm

The short length of 5mm contributes to the product's compact design and footprint, making it suitable for applications where space-saving and miniaturization are crucial.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the product's reliability and stability across a wide range of operating temperatures, making it suitable for industrial-grade applications with stringent requirements.

Technology: BICMOS

The use of Bipolar-CMOS (BiCMOS) technology combines the advantages of both bipolar and CMOS technologies, offering high-speed performance, low power consumption, and versatile functionality in the product.

Terminal Form: NO LEAD

The no-lead terminal form reduces the risk of lead contamination and meets environmental regulations, making the product environmentally friendly and compliant with industry standards.

Maximum Supply Current: 0.155 mA

The low maximum supply current of 0.155mA minimizes power consumption and heat dissipation, contributing to energy efficiency and prolonging the product's lifespan.

Telecom IC Type: RF AND BASEBAND CIRCUIT

The integration of RF and baseband circuitry in a single IC enhances signal processing capabilities, reduces component count, and simplifies circuit design, making the product suitable for telecom applications requiring wireless communication functionalities.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V ensures compatibility with standard voltage levels in many electronic systems, simplifying integration and reducing the need for additional voltage regulation circuitry.

Terminal Pitch: 0.65 mm

The fine terminal pitch of 0.65mm enables high-density packaging and precise connection points, allowing for intricate circuit designs and compact layouts in electronic devices.

Technical Specifications

Cellphone ICs MAX2044ETP+ attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N20

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC20,.20SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.155 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

MAX2044ETP+ Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

Category top products 20

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