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MAX2605EUT+

Analog Devices

MAX2605EUT+ by Analog Devices

MAX2605EUT+ by Analog Devices is a Cellphone IC with 6 terminals in a small outline package. It operates b/w -40 to 85 °C, suitable for industrial use. Telecom applications benefit from its baseband circuit and low profile design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

MAX2605EUT+ by Analog Devices
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Distributors (In-Stock)

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Digiode

USA . 3,203 parts In-Stock

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Vyrian

USA . 1,955 parts In-Stock

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Anansix

USA . 1,063 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 25 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Stockers USA

USA . 9,236 parts In-Stock

1+ parts

$1.390

100+ parts

$1.300

1k+ parts

$1.180

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9,236

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MARBEL Systems

Belgium . 3,376 parts In-Stock

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$5.943

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Texas Native Microelectronics

USA . 1,414 parts In-Stock

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$6.831

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$6.558

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$6.353

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$6.011

1,414

$6.831

$6.558

$6.353

$6.011

Kenton Components

USA . 3,696 parts In-Stock

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$8.197

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$7.214

3,696

$8.197

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$7.214

AZTECH Wire

Italy . 536 parts In-Stock

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$13.473

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Qasali Group International

UK . 100 parts In-Stock

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$18.444

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$17.153

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$16.230

100

$18.444

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$17.153

$16.230

Semicontronic

India . 157 parts In-Stock

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$350.000

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$341.250

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$339.500

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157

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One Stop Electronics

USA . 2,976 parts In-Stock

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$433.000

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A-Z Elektronik GmbH

Germany . 5,450 parts In-Stock

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Corphita

USA . 1,958 parts In-Stock

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Kepictronics

USA . 98 parts In-Stock

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Overview

Enhance your cellphone's performance with the MAX2605EUT+ by Analog Devices. Manufactured by a trusted industry leader, this high-quality Cellphone IC offers exceptional value and benefits to customers. Its innovative design ensures reliable operation and optimal functionality, making it ideal for a wide range of applications. Upgrade your device with the MAX2605EUT+ and experience superior performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a lightweight and durable housing for the IC, ensuring longevity and ease of handling.

Surface Mount: YES

Enables easy installation on PCBs, saving space and simplifying production processes.

No. of Terminals: 6

Offers a sufficient number of connection points for the IC to interface with other components.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial applications where heat may be a concern.

Telecom IC Type: BASEBAND CIRCUIT

Specifically designed for handling telecom signals, ensuring efficient and reliable communication.

Nominal Supply Voltage: 2.75 V

Operates within a common voltage range, making it compatible with various power sources.

Technical Specifications

Cellphone ICs MAX2605EUT+ attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.45 mm

Nominal Supply Voltage:

2.75 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.625 mm

Trade Compliance

MAX2605EUT+ Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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