Loading...

MAX2041ETP+T

Analog Devices

MAX2041ETP+T by Analog Devices

MAX2041ETP+T by Analog Devices is a Cellphone IC with 20 terminals in a square package. It operates b/w -40 to 85 °C, with a supply voltage of 5V and max current of 0.145mA. This RF and baseband circuit uses BICMOS technology, suitable for telecom applications.

Median Price

$5.000

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

MAX2041ETP+T by Analog Devices
Compare Share

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,328 parts In-Stock

1+ parts

$5.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,328

$5.000

-

-

-

Chip Stock

USA . 2,789 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,789

-

-

-

-

Digiode

USA . 1,262 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,262

-

-

-

-

Anansix

USA . 628 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

628

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

MARBEL Systems

Belgium . 562 parts In-Stock

1+ parts

$15.472

100+ parts

-

1k+ parts

-

10k+ parts

-

562

$15.472

-

-

-

Texas Native Microelectronics

USA . 40 parts In-Stock

1+ parts

$17.784

100+ parts

-

1k+ parts

$16.539

10k+ parts

$15.650

40

$17.784

-

$16.539

$15.650

Kenton Components

USA . 2,983 parts In-Stock

1+ parts

$21.341

100+ parts

-

1k+ parts

-

10k+ parts

$18.780

2,983

$21.341

-

-

$18.780

Qasali Group International

UK . 19,830 parts In-Stock

1+ parts

$48.017

100+ parts

-

1k+ parts

-

10k+ parts

-

19,830

$48.017

-

-

-

Semicontronic

India . 2,021 parts In-Stock

1+ parts

$933.000

100+ parts

$909.675

1k+ parts

$905.010

10k+ parts

-

2,021

$933.000

$909.675

$905.010

-

QUARKTWIN TECHNOLOGY LTD

USA . 29,614 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

29,614

-

-

-

-

Kepictronics

USA . 1,830 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,830

-

-

-

-

Corphita

USA . 1,492 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,492

-

-

-

-

Authorized Procurement Solutions

USA . 300 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

300

-

-

-

-

Overview

Enhance the performance of your cellphone with the MAX2041ETP+T by Analog Devices. Designed with precision and quality in mind, this Cellphone IC offers superior reliability and efficiency. With its innovative technology and industrial-grade components, this RF and baseband circuit is perfect for a wide range of applications. Experience seamless connectivity and improved signal strength with this high-quality product. Upgrade your device today and enjoy the benefits of Analog Devices' cutting-edge technology.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the product onto a PCB, saving space and reducing costs.

Power Supplies (V): 5

Operating at a standard voltage of 5V makes this product compatible with a wide range of systems and applications.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile packaging styles allows for better thermal management and space-saving design.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, this product can withstand tough industrial environments without a risk of overheating.

Technology: BICMOS

Utilizing Bipolar-CMOS (BiCMOS) technology combines the advantages of both bipolar and CMOS technologies, providing high-speed performance and low power consumption.

Nominal Supply Voltage: 5 V

Having a nominal supply voltage of 5V ensures compatibility with common power sources and simplifies integration into existing systems.

Technical Specifications

Cellphone ICs MAX2041ETP+T attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N20

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC20,.20SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.145 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

MAX2041ETP+T Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Analog Devices 10

Similar products 19