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ADF7901BRUZ-RL7

Analog Devices

ADF7901BRUZ-RL7 by Analog Devices

Analog Devices' ADF7901BRUZ-RL7 is a cellphone IC with 24 terminals in a small outline package. It operates at temperatures from 0 to 50 °C, with a supply voltage of 3V. This RF and baseband circuit is designed for telecom applications requiring surface mount technology.

Median Price

$1.940

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

$1.800

1k+ parts

$1.610

10k+ parts

$1.510

2,000

-

$1.800

$1.610

$1.510

DigiKey

USA . 2,000 parts In-Stock

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$2.080

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2,000

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$2.080

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Distributors (In-Stock)

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Digiode

USA . 653 parts In-Stock

1+ parts

$1.900

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653

$1.900

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Vyrian

USA . 324 parts In-Stock

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$2.000

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324

$2.000

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Distributors (Availability)

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Semicontronic

India . 1,733 parts In-Stock

1+ parts

$1.700

100+ parts

$1.658

1k+ parts

$1.649

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1,733

$1.700

$1.658

$1.649

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Corphita

USA . 755 parts In-Stock

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$1.800

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755

$1.800

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Component Stockers USA

USA . 2,121 parts In-Stock

1+ parts

$2.070

100+ parts

$1.950

1k+ parts

$1.770

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-

2,121

$2.070

$1.950

$1.770

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Parana Technologies

USA . 4,714 parts In-Stock

1+ parts

$15.561

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$14.472

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4,714

$15.561

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$14.472

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IDEA Electronic Components Group

UK . 1,507 parts In-Stock

1+ parts

$16.732

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$15.895

1k+ parts

$15.895

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1,507

$16.732

$15.895

$15.895

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DigiPath Technology Company

USA . 4,714 parts In-Stock

1+ parts

$26.102

100+ parts

$25.058

1k+ parts

-

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$25.058

4,714

$26.102

$25.058

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$25.058

Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Kepictronics

USA . 3,000 parts In-Stock

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RC Electronics

USA . 2,083 parts In-Stock

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2,083

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Northwest PG Solutions

USA . 1,761 parts In-Stock

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Robosynatics

Brazil . 950 parts In-Stock

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950

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Lucentia Tech

USA . 950 parts In-Stock

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$12.772

1k+ parts

$11.827

10k+ parts

$11.827

950

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$12.772

$11.827

$11.827

Native Components

USA . 404 parts In-Stock

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404

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Overview

Unlock the potential of your cellphone with the ADF7901BRUZ-RL7 by Analog Devices. As a leading manufacturer in the industry, Analog Devices brings you top-quality cellphone ICs designed to enhance your mobile experience. With its small outline and dual terminal position, this IC offers seamless integration and reliable performance. Whether you're looking to improve signal clarity or optimize power efficiency, the ADF7901BRUZ-RL7 delivers unmatched value and benefits. Trust Analog Devices to provide cutting-edge solutions for all your telecom IC needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and provides good protection for the internal components of the cellphone IC, ensuring longevity and reliability.

Surface Mount: YES

Surface mount technology makes it easy to integrate this cellphone IC onto a circuit board, saving space and making assembly more efficient.

Power Supplies (V): 3

The 3V power supply ensures compatibility with a wide range of devices, making this cellphone IC versatile and easy to integrate into various applications.

Maximum Operating Temperature: 50 °C

With a maximum operating temperature of 50 °C, this cellphone IC can withstand high temperatures, making it suitable for use in various environments.

Terminal Finish: MATTE TIN

Matte Tin terminal finish provides good conductivity and corrosion resistance, ensuring reliable performance of the cellphone IC over time.

Telecom IC Type: RF AND BASEBAND CIRCUIT

The RF and Baseband circuit capabilities of this cellphone IC allow for efficient communication and processing of signals, making it ideal for telecom applications.

Technical Specifications

Cellphone ICs ADF7901BRUZ-RL7 attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e3

Length:

7.8 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

50 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

ADF7901BRUZ-RL7 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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