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GC5318IZED

Texas Instruments

GC5318IZED by Texas Instruments

Texas Instruments' GC5318IZED is a Cellphone IC with 388 terminals in a square GRID ARRAY package. Operating b/w -40 to 85°C, it has TIN SILVER COPPER finish and BALL terminal form. Ideal for BASEBAND CIRCUIT in telecom, it has a 1.5V supply voltage and measures 27x27mm with 2.5mm height.

Median Price

$108.079

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4,100 parts In-Stock

1+ parts

-

100+ parts

$96.070

1k+ parts

$85.960

10k+ parts

$80.900

4,100

-

$96.070

$85.960

$80.900

DigiKey

USA . 4,100 parts In-Stock

1+ parts

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4,100

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Verical

USA . 1,743 parts In-Stock

1+ parts

-

100+ parts

$120.088

1k+ parts

$107.450

10k+ parts

$101.125

1,743

-

$120.088

$107.450

$101.125

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,418 parts In-Stock

1+ parts

$101.412

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4,418

$101.412

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Vyrian

USA . 3,010 parts In-Stock

1+ parts

$106.750

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3,010

$106.750

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DigiKey Marketplace

USA . 4,100 parts In-Stock

1+ parts

$111.020

100+ parts

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4,100

$111.020

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,871 parts In-Stock

1+ parts

$13.699

100+ parts

-

1k+ parts

$14.194

10k+ parts

-

1,871

$13.699

-

$14.194

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ChromeModa Solutions

Germany . 6,597 parts In-Stock

1+ parts

$15.392

100+ parts

$12.621

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-

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6,597

$15.392

$12.621

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IDEA Electronic Components Group

UK . 136 parts In-Stock

1+ parts

$15.392

100+ parts

$14.622

1k+ parts

$13.853

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-

136

$15.392

$14.622

$13.853

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Native Components

USA . 222 parts In-Stock

1+ parts

$81.539

100+ parts

-

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10k+ parts

$78.278

222

$81.539

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-

$78.278

Northwest PG Solutions

USA . 189 parts In-Stock

1+ parts

$89.693

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189

$89.693

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Corphita

USA . 2,709 parts In-Stock

1+ parts

$96.075

100+ parts

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2,709

$96.075

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Component Stockers USA

USA . 5,359 parts In-Stock

1+ parts

$109.020

100+ parts

$102.470

1k+ parts

$92.660

10k+ parts

-

5,359

$109.020

$102.470

$92.660

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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DigiPath Technology Company

USA . 2,201 parts In-Stock

1+ parts

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100+ parts

$13.877

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2,201

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$13.877

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Futuretech Components

Singapore . 79 parts In-Stock

1+ parts

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79

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Kepictronics

USA . 79 parts In-Stock

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79

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Overview

Unlock the potential of your cellphone with the GC5318IZED by Texas Instruments. Known for their high-quality products, Texas Instruments delivers top-notch Cellphone ICs that are designed to enhance your device's performance. With a package style of GRID ARRAY and a temperature grade of INDUSTRIAL, this IC offers reliability and durability. Whether you're looking to improve your phone's baseband circuit or optimize its power efficiency, the GC5318IZED provides the value, benefits, and advantages you need. Upgrade your cellphone experience today with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, which is important for portable electronic devices like cellphones.

Surface Mount: YES

Surface mount design allows for easy and efficient assembly of the IC onto the PCB, saving time and increasing production efficiency.

No. of Terminals: 388

Having a high number of terminals allows for more connectivity options and functionality within the IC, making it versatile for various applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures that the IC can withstand demanding operating conditions without overheating or malfunctioning.

Telecom IC Type: BASEBAND CIRCUIT

Being a baseband circuit, this IC is responsible for essential functions like signal processing and communication, making it a crucial component in cellphone technology.

Technical Specifications

Cellphone ICs GC5318IZED attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B388

JESD-609 Code:

e1

Length:

27 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

388

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

2.5 mm

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

27 mm

Trade Compliance

GC5318IZED Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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