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TLV321AC37IPT

Texas Instruments

TLV321AC37IPT by Texas Instruments

TLV321AC37IPT by Texas Instruments is a Cellphone IC with 48 terminals in a square package. Operating temp range: -40 to 85°C, supply voltage: 3V. Ideal for telecom applications as baseband circuit due to low profile and fine pitch design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,211 parts In-Stock

1+ parts

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4,211

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Digiode

USA . 2,066 parts In-Stock

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2,066

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,485 parts In-Stock

1+ parts

$8.210

100+ parts

$762.446

1k+ parts

$7.389

10k+ parts

-

1,485

$8.210

$762.446

$7.389

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DigiPath Technology Company

USA . 612 parts In-Stock

1+ parts

$9.040

100+ parts

-

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612

$9.040

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ChromeModa Solutions

Germany . 2,571 parts In-Stock

1+ parts

$9.225

100+ parts

$7.564

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-

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2,571

$9.225

$7.564

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IDEA Electronic Components Group

UK . 95 parts In-Stock

1+ parts

$9.225

100+ parts

$8.764

1k+ parts

$8.302

10k+ parts

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95

$9.225

$8.764

$8.302

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AZTECH Wire

Italy . 793 parts In-Stock

1+ parts

$13.225

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793

$13.225

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One Stop Electronics

USA . 1,142 parts In-Stock

1+ parts

$772.000

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1,142

$772.000

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Corphita

USA . 4,611 parts In-Stock

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Overview

Enhance the performance of your cellphone with the TLV321AC37IPT by Texas Instruments. Known for their top-notch quality and innovative technology, Texas Instruments offers a wide range of applications in the cellphone IC category. This product promises reliability and efficiency, ensuring seamless operation for your devices. With its compact design and advanced features, the TLV321AC37IPT provides exceptional value and benefits to customers looking to optimize their cellphone's performance. Choose Texas Instruments for trusted solutions that deliver unparalleled performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the integrated circuits, ensuring longevity and reliability.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Package Shape: SQUARE

Facilitates compact design and efficient use of space within the device.

No. of Terminals: 48

Offers a sufficient number of connections for various functions and communication protocols.

Temperature Grade: INDUSTRIAL

Ensures reliable operation under a wide range of temperature conditions, making it suitable for industrial applications.

Telecom IC Type: BASEBAND CIRCUIT

Specifically designed for handling baseband signals in telecommunications applications, ensuring high performance and accuracy.

Nominal Supply Voltage: 3 V

Operates efficiently at a common supply voltage, making it compatible with many electronic systems.

Technical Specifications

Cellphone ICs TLV321AC37IPT attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

TLV321AC37IPT Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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