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TCM320AC57DWR

Texas Instruments

TCM320AC57DWR by Texas Instruments

Texas Instruments TCM320AC57DWR is a cellphone IC with 20 terminals in a small outline package. Operating temperature range from -40 to 85°C makes it suitable for industrial use. Telecom IC type baseband circuit, nominal voltage of 5V, and gull wing terminal form are key features.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,204 parts In-Stock

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Digiode

USA . 799 parts In-Stock

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799

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Distributors (Availability)

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AZTECH Wire

Italy . 610 parts In-Stock

1+ parts

$13.077

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-

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610

$13.077

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Parana Technologies

USA . 423 parts In-Stock

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$15.306

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-

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$15.700

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423

$15.306

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$15.700

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DigiPath Technology Company

USA . 793 parts In-Stock

1+ parts

$16.854

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$15.506

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793

$16.854

$15.506

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ChromeModa Solutions

Germany . 5,649 parts In-Stock

1+ parts

$17.198

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$14.102

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5,649

$17.198

$14.102

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IDEA Electronic Components Group

UK . 2,263 parts In-Stock

1+ parts

$17.198

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$16.338

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$15.478

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2,263

$17.198

$16.338

$15.478

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Ampacity Inc.

Singapore . 1,065 parts In-Stock

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$305.000

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1,065

$305.000

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Semicontronic

India . 1,622 parts In-Stock

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$649.000

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$632.775

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$629.530

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1,622

$649.000

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$629.530

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One Stop Electronics

USA . 459 parts In-Stock

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$699.000

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459

$699.000

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Corphita

USA . 2,215 parts In-Stock

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Corohmni

South Africa . 192 parts In-Stock

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Overview

Unlock the power of seamless communication with the TCM320AC57DWR by Texas Instruments. As a leader in cellphone ICs, Texas Instruments delivers top-quality products that guarantee reliability and performance. This versatile component is perfect for a wide range of applications, offering customers exceptional value and benefits. Whether you're looking to enhance your mobile device's capabilities or optimize your telecom systems, the TCM320AC57DWR is the ideal solution. Trust Texas Instruments to provide cutting-edge technology that meets your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and helps in reducing the overall weight of the cellphone IC, making it suitable for portable devices.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of the IC onto the circuit board, optimizing manufacturing processes.

Package Shape: RECTANGULAR

The rectangular shape enables easy integration and placement of the IC within the design of the cell phone, saving space and enhancing overall design aesthetics.

Terminal Position: DUAL

Dual terminal position provides additional stability and better connectivity, ensuring reliable performance of the IC within the cellphone for seamless operation.

Nominal Supply Voltage: 5 V

Having a nominal supply voltage of 5V ensures compatibility with standard power sources, making it easier for integration into existing systems without the need for additional voltage regulation.

Technical Specifications

Cellphone ICs TCM320AC57DWR attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

TCM320AC57DWR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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