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TCM320AC57CN

Texas Instruments

TCM320AC57CN by Texas Instruments

Texas Instruments TCM320AC57CN is a 20-terminal IC with 5V power supply, operating b/w 0-70°C. It features A-LAW companding law, 13-bit linear coding, and a filter. Ideal for cellphone applications due to its BASEBAND CIRCUIT technology and compact IN-LINE package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,024 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,024

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-

-

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Vyrian

USA . 3,941 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,941

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 150 parts In-Stock

1+ parts

$7.819

100+ parts

-

1k+ parts

$8.370

10k+ parts

-

150

$7.819

-

$8.370

-

DigiPath Technology Company

USA . 1,123 parts In-Stock

1+ parts

$8.609

100+ parts

$7.921

1k+ parts

-

10k+ parts

-

1,123

$8.609

$7.921

-

-

ChromeModa Solutions

Germany . 6,513 parts In-Stock

1+ parts

$8.785

100+ parts

$7.204

1k+ parts

-

10k+ parts

-

6,513

$8.785

$7.204

-

-

IDEA Electronic Components Group

UK . 2,024 parts In-Stock

1+ parts

$8.785

100+ parts

$8.346

1k+ parts

$7.906

10k+ parts

-

2,024

$8.785

$8.346

$7.906

-

AZTECH Wire

Italy . 804 parts In-Stock

1+ parts

$19.755

100+ parts

-

1k+ parts

-

10k+ parts

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804

$19.755

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-

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One Stop Electronics

USA . 552 parts In-Stock

1+ parts

$503.000

100+ parts

-

1k+ parts

-

10k+ parts

-

552

$503.000

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-

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Corphita

USA . 4,699 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,699

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Overview

Elevate your cellphone performance with the TCM320AC57CN from Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality Cellphone ICs that set the standard for excellence. This versatile component is designed to enhance your device's functionality, providing seamless communication and exceptional sound quality. Trust in Texas Instruments to bring you cutting-edge technology that exceeds expectations. Experience the difference with the TCM320AC57CN and unlock a world of possibilities for your mobile devices.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and light weight, making it ideal for mobile devices.

Power Supplies (V): 5

The standard 5V power supply simplifies compatibility with other components and power sources.

No. of Terminals: 20

Having 20 terminals allows for more connections and functionalities in the cell phone ICs.

Package Style (Meter): IN-LINE

The in-line package style saves space and makes it easier to integrate this IC into the circuit board.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this IC is suitable for use in a wide range of environments and conditions.

Technology: CMOS

The CMOS technology provides low power consumption and high noise immunity, making the IC efficient and reliable.

Technical Specifications

Cellphone ICs TCM320AC57CN attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

Companding Law:

A-LAW

Filter:

YES

Maximum Gain Tolerance:

1 dB

JESD-30 Code:

R-PDIP-T20

Length:

24.325 mm

Linear Coding:

13-BIT

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Codecs

Maximum Supply Current:

.0099 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

TCM320AC57CN Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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