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CC1110F8RSPR

Texas Instruments

CC1110F8RSPR by Texas Instruments

The Texas Instruments CC1110F8RSPR is a cellphone IC with 36 terminals in a square chip carrier package. Operating temperature range from -40 to 85°C, CMOS technology, and RF/baseband circuit for telecom applications. Nominal voltage of 3V, terminal pitch of 0.5mm, and MSL level of 3 make it ideal for industrial use.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,591 parts In-Stock

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8,591

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Digiode

USA . 2,203 parts In-Stock

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2,203

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Distributors (Availability)

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Native Components

USA . 855 parts In-Stock

1+ parts

$0.176

100+ parts

-

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$0.169

855

$0.176

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$0.169

Northwest PG Solutions

USA . 2,007 parts In-Stock

1+ parts

$0.194

100+ parts

-

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$0.171

2,007

$0.194

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$0.171

AZTECH Wire

Italy . 610 parts In-Stock

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$5.635

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610

$5.635

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Parana Technologies

USA . 1,546 parts In-Stock

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$6.601

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$7.336

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1,546

$6.601

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$7.336

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DigiPath Technology Company

USA . 1,758 parts In-Stock

1+ parts

$7.269

100+ parts

$6.687

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1,758

$7.269

$6.687

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ChromeModa Solutions

Germany . 2,881 parts In-Stock

1+ parts

$7.417

100+ parts

$6.082

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2,881

$7.417

$6.082

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IDEA Electronic Components Group

UK . 1,408 parts In-Stock

1+ parts

$7.417

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$6.675

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1,408

$7.417

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$6.675

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One Stop Electronics

USA . 779 parts In-Stock

1+ parts

$419.000

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779

$419.000

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Kepictronics

USA . 50,000 parts In-Stock

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Lixinc

USA . 10,356 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,303 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,202 parts In-Stock

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Corphita

USA . 220 parts In-Stock

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220

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Overview

Elevate your cellphone's performance with the CC1110F8RSPR from Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments delivers cutting-edge technology in the field of Cellphone ICs. This surface mount device offers a compact package shape and a range of advanced features, making it ideal for various applications. With a nominal supply voltage of 3V and an industrial temperature grade, this Telecom IC Type promises exceptional performance in demanding environments. Experience seamless connectivity and enhanced functionality with the CC1110F8RSPR, setting a new standard in the world of cellphone technology.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and reducing manufacturing costs.

Package Shape: SQUARE

The square shape provides a compact and space-saving design, ideal for smaller electronic devices.

Power Supplies (V): 3

Operating at a voltage of 3V is common in many electronic devices, ensuring compatibility with a wide range of systems.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles allows for efficient heat dissipation and compact design.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliability and performance even in demanding conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows for operation in a wide range of environments, including extreme cold temperatures.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish of nickel palladium gold provides excellent conductivity and corrosion resistance, ensuring reliable connections.

Terminal Position: QUAD

The quad terminal position allows for easy and secure soldering onto the circuit board, improving stability and performance.

Width: 6 mm

The compact width of 6mm makes this product suitable for integration into small electronic devices with limited space.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this product can withstand high-temperature soldering processes without damage.

Technical Specifications

Cellphone ICs CC1110F8RSPR attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N36

JESD-609 Code:

e4

Length:

6 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC36,.25SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Trade Compliance

CC1110F8RSPR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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