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CC2420Z-RTB1

Texas Instruments

CC2420Z-RTB1 by Texas Instruments

CC2420Z-RTB1 by Texas Instruments is a cellphone IC with 48 terminals, operating temperature range of -40 to 85°C. It features a supply voltage of 1.8V, RF and baseband circuit for telecom applications, and CMOS technology. The package style includes chip carrier and heat sink/slug, making it suitable for industrial use in compact devices.

Median Price

$6.525

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 59 parts In-Stock

1+ parts

-

100+ parts

$6.050

1k+ parts

$5.410

10k+ parts

$5.100

59

-

$6.050

$5.410

$5.100

DigiKey

USA . 59 parts In-Stock

1+ parts

-

100+ parts

$7.000

1k+ parts

-

10k+ parts

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59

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$7.000

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 915 parts In-Stock

1+ parts

$6.394

100+ parts

-

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-

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915

$6.394

-

-

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Vyrian

USA . 2,875 parts In-Stock

1+ parts

-

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-

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2,875

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-

-

DigiKey Marketplace

USA . 59 parts In-Stock

1+ parts

-

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-

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59

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,651 parts In-Stock

1+ parts

$6.057

100+ parts

-

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-

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-

2,651

$6.057

-

-

-

Parana Technologies

USA . 1,725 parts In-Stock

1+ parts

$15.401

100+ parts

-

1k+ parts

$15.785

10k+ parts

-

1,725

$15.401

-

$15.785

-

ChromeModa Solutions

Germany . 2,303 parts In-Stock

1+ parts

$17.304

100+ parts

$14.189

1k+ parts

-

10k+ parts

-

2,303

$17.304

$14.189

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IDEA Electronic Components Group

UK . 1,542 parts In-Stock

1+ parts

$17.304

100+ parts

$16.439

1k+ parts

$15.574

10k+ parts

-

1,542

$17.304

$16.439

$15.574

-

DigiPath Technology Company

USA . 2,170 parts In-Stock

1+ parts

-

100+ parts

$15.601

1k+ parts

-

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2,170

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$15.601

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Northwest PG Solutions

USA . 2,115 parts In-Stock

1+ parts

-

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2,115

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Native Components

USA . 943 parts In-Stock

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943

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Computer Components Inc. - USA

USA . 1 parts In-Stock

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1

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Overview

Enhance your cellphone's performance with the CC2420Z-RTB1 from Texas Instruments. Designed with precision and quality in mind, this cellphone IC offers unmatched reliability and efficiency. Whether you're looking to upgrade your current device or enhance a new project, this product is perfect for a wide range of applications. With its advanced technology and industrial-grade components, customers can expect seamless integration and optimal performance. Invest in the CC2420Z-RTB1 today and experience the difference that Texas Instruments brings to the table.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly on circuit boards, making this product suitable for automated production processes.

Package Shape: SQUARE

The square package shape helps in better utilization of space on the circuit board, ensuring efficient layout and allowing for compact designs.

Power Supplies (V): 1.8, 1.8/3.3

Support for multiple power supply voltages offers flexibility in design and compatibility with a variety of systems, enhancing the versatility of this product.

No. of Terminals: 48

Having a high number of terminals allows for the connection of multiple components, enabling complex functionalities and improving the overall performance of the product.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions, ensuring reliable performance in industrial settings.

Width: 7 mm

The compact width of this product enables space-saving designs, making it suitable for applications where size constraints are a consideration.

Technical Specifications

Cellphone ICs CC2420Z-RTB1 attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,1.8/3.3

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

CC2420Z-RTB1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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