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CC2420RGZ

Texas Instruments

CC2420RGZ by Texas Instruments

CC2420RGZ by Texas Instruments is a cellphone IC with 48 terminals in a square chip carrier package. Operating temperature ranges from -40 to 85°C, suitable for RF and baseband circuits. With CMOS technology and a nominal voltage of 1.8V, it's ideal for telecom applications requiring compact design and high performance.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,524 parts In-Stock

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Digiode

USA . 563 parts In-Stock

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563

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Bristol Electronics

USA . 90 parts In-Stock

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90

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Flex Direct, LLC

USA . 90 parts In-Stock

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90

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Native Components

USA . 225 parts In-Stock

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$0.086

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$0.083

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$0.086

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$0.083

Northwest PG Solutions

USA . 107 parts In-Stock

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$0.095

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$0.083

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AZTECH Wire

Italy . 762 parts In-Stock

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$5.458

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Parana Technologies

USA . 452 parts In-Stock

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$15.696

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$16.064

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452

$15.696

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DigiPath Technology Company

USA . 151 parts In-Stock

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$17.283

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ChromeModa Solutions

Germany . 2,972 parts In-Stock

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$17.636

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$14.462

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IDEA Electronic Components Group

UK . 429 parts In-Stock

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$17.636

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$16.754

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$15.872

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429

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One Stop Electronics

USA . 1,119 parts In-Stock

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Corphita

USA . 4,003 parts In-Stock

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Perfect Parts

USA . 1,120 parts In-Stock

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GreenTree Electronics

Israel . 1,000 parts In-Stock

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Overview

Enhance the performance of your cellphone with the CC2420RGZ from Texas Instruments. Known for their top-quality products, Texas Instruments brings you a Cellphone IC that is designed to optimize your device's functionality. With its advanced technology and reliable performance, this RF and baseband circuit ensures seamless communication. Say goodbye to connectivity issues and hello to a smoother user experience. Upgrade your cellphone with the CC2420RGZ and enjoy the benefits of superior quality and enhanced performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic body material is durable and cost-effective, making the product robust for everyday use.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly on PCBs, saving space and reducing costs.

Package Shape: SQUARE

Square package shape ensures uniformity and ease of placement on a PCB.

No. of Terminals: 48

Having 48 terminals allows for a higher level of integration and functionality in the cellphone IC.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style provides efficient heat dissipation and thin profile for compact design and thermal management in the device.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, the IC can withstand high temperature environments without compromising performance.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40°C enhances the product's reliability in various conditions.

Terminal Position: QUAD

Quad terminal position enables easy connection and compatibility with other components in the circuit.

Maximum Seated Height: 1 mm

The low seated height of 1mm allows for a slim and compact design of the cellphone IC.

Width: 7 mm

Narrow width of 7mm contributes to space-saving and efficient design of the IC.

Length: 7 mm

Compact length of 7mm ensures the IC can fit into smaller devices without compromising on performance.

Technology: CMOS

CMOS technology offers low power consumption and high speed, making the IC efficient and reliable for mobile applications.

Terminal Form: NO LEAD

Lead-free terminal form adheres to environmental regulations and ensures safety during use.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Combining RF and baseband circuit types in the telecom IC enhances communication capabilities and signal processing for better phone performance.

Nominal Supply Voltage: 1.8 V

Nominal supply voltage of 1.8V ensures compatibility with standard power sources and efficient power management.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm allows for high-density mounting and connectivity, contributing to a smaller overall footprint of the IC.

Technical Specifications

Cellphone ICs CC2420RGZ attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N48

Length:

7 mm

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

CC2420RGZ Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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