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CC2420RGZR

Texas Instruments

CC2420RGZR by Texas Instruments

CC2420RGZR by Texas Instruments is a cellphone IC with 48 terminals and operates at temperatures ranging from -40 to 85°C. It features a CMOS technology, RF and baseband circuit for telecom applications, and a nominal voltage of 3.3V. This chip carrier package with a square shape is suitable for industrial use due to its low profile design and surface mount capability.

Median Price

$9.142

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 1,079 parts In-Stock

1+ parts

$6.720

100+ parts

$5.040

1k+ parts

$3.820

10k+ parts

-

1,079

$6.720

$5.040

$3.820

-

Texas Instruments

USA . 18,685 parts In-Stock

1+ parts

$7.724

100+ parts

$6.297

1k+ parts

$4.198

10k+ parts

-

18,685

$7.724

$6.297

$4.198

-

DigiKey

USA . 4,359 parts In-Stock

1+ parts

$10.560

100+ parts

$8.029

1k+ parts

$7.089

10k+ parts

$6.764

4,359

$10.560

$8.029

$7.089

$6.764

Element14

Singapore . 1,079 parts In-Stock

1+ parts

$13.710

100+ parts

$10.260

1k+ parts

$7.790

10k+ parts

-

1,079

$13.710

$10.260

$7.790

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 121 parts In-Stock

1+ parts

$3.180

100+ parts

-

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-

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121

$3.180

-

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EXC GmbH

Germany . 2,500 parts In-Stock

1+ parts

$6.300

100+ parts

-

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-

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2,500

$6.300

-

-

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Digiode

USA . 3,446 parts In-Stock

1+ parts

$6.384

100+ parts

-

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3,446

$6.384

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Chip Stock

USA . 11,235 parts In-Stock

1+ parts

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11,235

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Velocity Electronics

USA . 1 parts In-Stock

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-

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-

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1

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 853 parts In-Stock

1+ parts

$6.048

100+ parts

-

1k+ parts

-

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853

$6.048

-

-

-

Continental Prestige Electronics

USA . 1,079 parts In-Stock

1+ parts

$6.720

100+ parts

$5.040

1k+ parts

-

10k+ parts

-

1,079

$6.720

$5.040

-

-

Parana Technologies

USA . 475 parts In-Stock

1+ parts

$14.871

100+ parts

-

1k+ parts

$15.302

10k+ parts

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475

$14.871

-

$15.302

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DigiPath Technology Company

USA . 1,576 parts In-Stock

1+ parts

$16.375

100+ parts

$15.065

1k+ parts

-

10k+ parts

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1,576

$16.375

$15.065

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IDEA Electronic Components Group

UK . 1,195 parts In-Stock

1+ parts

$16.709

100+ parts

$15.874

1k+ parts

$15.038

10k+ parts

-

1,195

$16.709

$15.874

$15.038

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ChromeModa Solutions

Germany . 1,100 parts In-Stock

1+ parts

$16.709

100+ parts

$13.701

1k+ parts

-

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1,100

$16.709

$13.701

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Component Stockers USA

USA . 17,578 parts In-Stock

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17,578

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Lixinc

USA . 10,245 parts In-Stock

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10,245

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,342 parts In-Stock

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6,342

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Epart123

USA . 5,000 parts In-Stock

1+ parts

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$4.880

10k+ parts

$4.880

5,000

-

-

$4.880

$4.880

Futuretech Components

Singapore . 2,500 parts In-Stock

1+ parts

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2,500

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Kepictronics

USA . 2,000 parts In-Stock

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2,000

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Northwest PG Solutions

USA . 1,941 parts In-Stock

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1,941

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Native Components

USA . 510 parts In-Stock

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510

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GreenTree Electronics

Israel . 32 parts In-Stock

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32

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Overview

Unlock the power of seamless communication with the Texas Instruments CC2420RGZR cellphone IC. Manufactured by industry leader Texas Instruments, this high-quality chip offers unparalleled performance and reliability. Ideal for a wide range of applications, this IC delivers exceptional value and benefits to customers looking for cutting-edge technology. Experience the advantages of the CC2420RGZR and elevate your products to the next level of connectivity and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good durability and protection for the internal components of the cellphone IC, ensuring reliability and longevity.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly of the cellphone IC onto circuit boards, saving time and cost in the manufacturing process.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, this cellphone IC can withstand harsh environments and prolonged use without overheating or malfunctioning.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this cellphone IC energy-efficient and reliable for use in mobile devices.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3 V, this cellphone IC is compatible with standard power sources and ensures stable performance.

Technical Specifications

Cellphone ICs CC2420RGZR attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,1.8/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

CC2420RGZR Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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