Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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CC2420-RTB1 by Texas Instruments is a cellphone IC with 48 terminals, operating at -40 to 85°C. It features a supply voltage of 1.8V, RF and baseband circuitry, and CMOS technology. This chip carrier has a square shape, very thin profile, and nickel palladium gold finish for industrial-grade applications.
Median Price
$6.970
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Suppliers In-Stock
5
In-Stock Inventory
1k+
Rochester
1+ parts
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100+ parts
1k+ parts
$6.240
10k+ parts
$5.870
Digiode
$7.362
Vyrian
ACDS - Activité Composants Distribution Service
North Shore Components
Corphita
$6.975
Parana Technologies
$14.084
$14.549
DigiPath Technology Company
$15.508
$14.268
ChromeModa Solutions
$15.825
$12.976
IDEA Electronic Components Group
$15.034
$14.242
Native Components
$22.107
AZTECH Wire
$22.120
Northwest PG Solutions
$24.318
$21.886
Perfect Parts
Cyclops Electronics Ltd (Excess)
Surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and labor costs.
Square packages are more space-efficient and can easily fit onto compact circuit boards.
Support for multiple power supply voltages allows for greater flexibility in integrating the IC into various systems.
A higher number of terminals provides more connectivity options and functionality in the device.
With a high maximum operating temperature, this IC can withstand challenging environmental conditions and maintain stable performance.
The wide temperature range ensures reliability in both extreme cold and hot conditions.
This terminal finish offers excellent corrosion resistance and ensures long-term reliability of the connections.
Compact width allows for space-efficient placement on a circuit board and enables the design of smaller and sleeker devices.
The high peak reflow temperature enables proper soldering of the IC during manufacturing, ensuring a strong and reliable connection.
CMOS technology offers low power consumption, high noise immunity, and compatibility with various digital systems.
Cellphone ICs CC2420-RTB1 attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments
JESD-30 Code:
JESD-609 Code:
Length:
Moisture Sensitivity Level (MSL):
No. of Functions:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Power Supplies (V):
Qualification:
Maximum Seated Height:
Sub-Category:
Nominal Supply Voltage:
Surface Mount:
Technology:
Telecom IC Type:
Temperature Grade:
Terminal Finish:
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Maximum Time At Peak Reflow Temperature (s):
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CC2420-RTB1 Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.
President, CEO
Haviv Ilan
Chairman
Richard K. Templeton
Senior VP, CFO
Rafael R. Lizardi
M - Fab
Fabrication
Fab Initiation
1997
USA
South Portland
Wafer Capacity
32,000
D - FAB
1966
Dallas
42,000
D MOS - 6
2002
25,000
D MOS - 5
1995
75,000
Miho - 8
1980
Japan
Inashiki
43,000
S FAB 1
Sherman
91,000
F - FAB
2001
Germany
Freising
37,000
R Fab 1
2010
Richardson
40,000
D HC Line
1999
2,000
JV3
Aizu Wakamatsu
45,000
C - FAB
2007
China
Chengdu
30,000
L - Fab
2015
Lehi
70,000
R - Fab 2
2022
S - FAB 2
2025
S - FAB 3
2028
2N7002
Sipex
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Peak Reflow Temperature (C): 240; Terminal Finish: TIN LEAD;
2N2222A
Infineon Technologies
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Solid State Devices
Promax-johnton
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Terminal Form: GULL WING; Maximum Drain-Source On Resistance: 7.5 ohm; Minimum DS Breakdown Voltage: 60 V;
Secos
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .3 W; Maximum Drain Current (ID): .115 A; Maximum Drain-Source On Resistance: 7.5 ohm;
1N4148WS
Sangdest Microelectronics (Nanjing)
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
STM8S003F3P6TR
STMicroelectronics
STM8S003F3P6TR by STMicroelectronics is an 8-bit microcontroller with a max clock frequency of 16 MHz. It features 1024 RAM bytes, 128 data EEPROM size, and 5-ch 10-bit ADC channels. Ideal for industrial applications requiring low power mode and connectivity via I2C, SPI, and UART interfaces.
BAV99
Diodes Incorporated
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
FSMLF327
Fox Electronics
FSMLF327 by Fox Electronics is a crystal oscillator with 20 ppm frequency tolerance, 144% stability, and 50000 ohm series resistance. Ideal for applications requiring precise timing such as communication systems, industrial automation, and consumer electronics. Operating temperature range from -40 to 85 °C.
NE555D
NXP Semiconductors
SQUARE; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: LSOP; Package Shape: RECTANGULAR; Surface Mount: YES;
SMBJ18CA
Yangzhou Yangjie Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.05 V; Maximum Repetitive Peak Reverse Voltage: 18 V; Polarity: BIDIRECTIONAL;
LM317T
Micro Commercial Components
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; Moisture Sensitivity Level (MSL): 1; Maximum Output Current-1: 1.5 A; Operating Temperature (TJ-Min): 0 Cel;
BSS123NH6327XTSA1
Infineon BSS123NH6327XTSA1 is a N-CHANNEL FET with 100V DS breakdown voltage, 0.19A ID, and 6 ohm RDS(on). Ideal for small outline applications requiring high drain current and low on-resistance. AEC-Q101 compliant for automotive use.
CRG0805F10R
TE Connectivity
TE Connectivity's CRG0805F10R is a 10 ohm fixed resistor with 1% tolerance and 0.125 W power dissipation. It features thick film technology, SMT package style, and matte tin over nickel terminal finish. Ideal for surface mount applications in electronics, offering a temperature coefficient of 200 ppm/°C and operating voltage of 150 V.
ULN2803ADWG4
Texas Instruments
ULN2803ADWG4 by Texas Instruments is a peripheral driver with 8 functions, open-collector output characteristics, and built-in transient protections. It operates at temperatures ranging from -40 to 85°C and has a max supply voltage of 3V. Ideal for applications requiring sink current flow direction in a small outline package style.
LM358M
Raytheon Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
LM358N
LM358N by Texas Instruments is an operational amplifier with 2 functions, offering a max input offset voltage of 9000 uV and a nominal common mode reject ratio of 85 dB. Widely used in commercial applications, it operates at temperatures ranging from 0 to 70 °C and has a unity gain bandwidth of 1000 kHz.
LM555CN
Rochester Electronics
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Shape: RECTANGULAR; Surface Mount: NO; No. of Functions: 1;
BSS138
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Moisture Sensitivity Level (MSL): 1; Peak Reflow Temperature (C): 240;
1N4148
Hitachi
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
BG77LA-64-SGNS
Quectel Wireless Solutions
BG77LA-64-SGNS by Quectel Wireless Solutions is a BASEBAND CIRCUIT Telecom IC with 94 terminals, RECTANGULAR package shape, and 3.3V supply voltage. It operates b/w -35°C to 75°C, making it suitable for cellphone applications requiring compact design and surface mount capability.
BGC100GN6E6327XTSA1
Infineon's BGC100GN6E6327XTSA1 is a CMOS Cellphone IC with 6 terminals in a rectangular chip carrier package. It features RF and baseband circuitry, suitable for telecom applications. This surface-mount IC has terminals at the bottom and a butt terminal form.
TCM320AC57CPT
TCM320AC57CPT by Texas Instruments is a 48-terminal cellphone IC with 5V power supply, operating b/w 0-70°C. It features A-LAW companding law, 13-bit linear coding, and a baseband circuit for telecom applications. The package is a square flatpack with low profile and fine pitch, suitable for surface mount assembly.
ADL5561ACPZ-R7
Analog Devices
ADL5561ACPZ-R7 by Analog Devices is a 16-terminal cellphone IC with a square shape and chip carrier package style. It operates b/w -40 to 85°C, suitable for industrial telecom applications. With a nominal voltage of 3.3V, it features RF and baseband circuits for high-performance communication systems.
ME310G1WW01T010100
Telit Communications Plc
Telit ME310G1WW01T010100 is a 94-terminal RF & baseband circuit IC with 3.8V supply voltage, ideal for cellphone applications. With a compact size of 15x18mm and seated height of 2.6mm, it operates b/w -40°C to 85°C temperature range efficiently. The no-lead terminal form in MICROELECTRONIC ASSEMBLY package makes it suitable for modern mobile devices.
MAX4003EBL
Maxim Integrated
MAX4003EBL by Maxim Integrated is a CELLPHONE IC with 8 terminals in a SQUARE package. It features GRID ARRAY style, operates b/w -40 to 85°C, and has RF & BASEBAND CIRCUIT applications. The IC has a very thin profile of 0.67mm, uses TIN LEAD finish, and requires 3V supply voltage for operation.
LMV228URX
LMV228URX by Texas Instruments is a cellphone IC with a package style of grid array, very thin profile, and fine pitch. It operates in industrial temperature grades from -40 to 85°C and has a nominal voltage of 2.7V. This RF and baseband circuit IC is designed for telecom applications requiring precise performance in compact spaces.
MAX5865ETM+T
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;
ADL5811ACPZ-R7
ADL5811ACPZ-R7 by Analog Devices is a 32-terminal cellphone IC with BICMOS technology. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a square shape, 0.8mm height, and matte tin finish, making it ideal for telecom applications.
AT86RF231-ZF
Microchip Technology
AT86RF231-ZF by Microchip Technology is a cellphone IC with surface mount capability. It has 1 function and comes in a square package shape. With a temperature range of -40 to 85 °C, it is suitable for industrial applications as an RF and baseband circuit.
TLV320AC57IDWR
TLV320AC57IDWR by Texas Instruments is a Cellphone IC with 20 terminals, CMOS technology, and 3V supply voltage. It operates b/w -40 to 85°C, suitable for industrial use in baseband circuits. The small outline package measures 7.5mm x 12.8mm with a seated height of 2.65mm, making it ideal for compact cellphone designs.
TLV320AC57IDW
TLV320AC57IDW by Texas Instruments is a 20-terminal IC with 3V supply voltage, operating b/w -40 to 85°C. It features A-LAW companding law, 13-bit linear coding, and includes a filter. Ideal for cellphone applications due to its small outline package style and telecom baseband circuit type.
TRF3701IRHCRG4
TRF3701IRHCRG4 by Texas Instruments is a cellphone IC with 16 terminals, operating at -40 to 85°C. It features a 5V supply voltage, RF and baseband circuit for telecom applications. The chip carrier package has a square shape, measures 4x4mm in size, and is surface mountable.
HMC686LP4TR
Analog Devices' HMC686LP4TR is a 24-terminal cellphone IC in a square chip carrier package. Operating temperature range from -40 to 85 °C, suitable for industrial use. Features BICMOS technology for RF and baseband circuits with a nominal voltage of 5V.
AD6634XBC
AD6634XBC by Analog Devices is a Cellphone IC with 196 terminals in a square GRID ARRAY package. Operating temp range -40 to 70 °C, CMOS tech, and 2.5V supply voltage make it ideal for BASEBAND CIRCUIT applications.
SARA-R422M8S-00B
U-blox Ag
RF AND BASEBAND CIRCUIT;
ADL5360XCPZ-R7
ADL5360XCPZ-R7 by Analog Devices is a Cellphone IC with BICMOS technology. It operates b/w -40 to 85 °C, suitable for industrial use. This RF front-end circuit has 36 terminals in a square chip carrier package, measuring 6x6 mm, with a terminal pitch of 0.5mm.
CC1070RGWT
CC1070RGWT by Texas Instruments is a cellphone IC with 20 terminals in a square chip carrier package. It operates at temperatures ranging from -40 to 105°C, suitable for industrial use. This RF and baseband circuit has a supply voltage of 3V and terminal pitch of 0.635mm, making it ideal for telecom applications.
MAX4003EUA+
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: TSSOP; Package Shape: SQUARE;
BGS14MPA9E6327XTSA1
RF AND BASEBAND CIRCUIT; Moisture Sensitivity Level (MSL): 1;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
TPS7A4301DGQR
TPS7A4301DGQR by Texas Instruments is an adjustable positive single output LDO regulator with a max output voltage of 14.5V and a dropout voltage of 0.6V. It operates in temperatures ranging from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
DRV3255EPAPRQ1
DRV3255EPAPRQ1 by Texas Instruments is a Motion Control IC with 64 terminals, operating at -40 to 150°C. It is an AEC-Q100 compliant automotive-grade IC for Brushless DC Motor control, supporting supply voltages from 5V to 90V and output currents up to 3.5A. The package style includes a flatpack with heat sink/slug, suitable for surface mount applications in automotive systems.
DRV8316RRGFR
DRV8316RRGFR by Texas Instruments is a motion control IC with a rectangular package and a terminal form of gull wing. It has a max output current of 8A and can operate at temperatures ranging from -40 to 125°C. This IC is commonly used as a brushless DC motor controller in automotive applications.
UCC27284DRCR
UCC27284DRCR by Texas Instruments is a MOSFET gate driver with 2 channels, capable of handling a max output current of 3.5A. It operates in automotive-grade temperatures (-40 to 125°C) and has a turn-on/off time of 30µs. This chip carrier package with very thin profile is suitable for high side driver applications requiring fast switching speeds.
DS160PT801ACBR
DS160PT801ACBR by Texas Instruments is a bus controller IC with 339 terminals, operating at -40 to 85°C. It supports PCI bus compatibility with a data transfer rate of 2000 MBps. This CMOS technology device has a thin profile and fine pitch package suitable for industrial applications.
LMR43610MSC3RPERQ1
LMR43610MSC3RPERQ1 by Texas Instruments is a 9-terminal switching regulator with a max output voltage of 32V and max output current of 1A. Ideal for automotive applications, it operates b/w -40 to 150°C, featuring a buck switcher config and PWM control mode at up to 2200kHz frequency.
CC2662R1FTWRGZRQ1
CC2662R1FTWRGZRQ1 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 48 MHz clock frequency, and 81920 bytes of RAM. Ideal for industrial applications, it features 8 ADC channels, 32 DMA channels, and peripherals like AES and PWM for efficient system integration.
CC2420ZRTCR
CC2400-STB1
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: VQCCN; Package Shape: SQUARE;
CC2420Z-RTB1
CC2420RTC
CC2420RGZR
CC2420Z-RTR1
CC2400RSUR
CC2420-RTB2
CC2400-STR1
CC2420-RTR2
CC2420RTCR
CC2420RGZ
RF AND BASEBAND CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; No. of Functions: 1;
CC2420ZRTC
CC2400-RTR1
CC2420RGZT
CC2400RSU
CC2400-RTB1
CC2420
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HQCCN; Package Shape: SQUARE;
CC2420-RTR1
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