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MAX2055EUP+D

Analog Devices

MAX2055EUP+D by Analog Devices

MAX2055EUP+D by Analog Devices is a BICMOS technology Cellphone IC with 20 terminals in a small outline package. It operates b/w -40 to 85 °C, suitable for industrial telecom applications. The package is rectangular, surface-mountable, and has a terminal pitch of 0.65mm.

Median Price

$17.115

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

MAX2055EUP+D by Analog Devices
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Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Analog Devices Inc

USA . 1,546 parts In-Stock

1+ parts

$14.780

100+ parts

-

1k+ parts

$9.110

10k+ parts

-

1,546

$14.780

-

$9.110

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DigiKey

USA . 696 parts In-Stock

1+ parts

$19.450

100+ parts

$15.129

1k+ parts

$13.641

10k+ parts

-

696

$19.450

$15.129

$13.641

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 657 parts In-Stock

1+ parts

$16.644

100+ parts

-

1k+ parts

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657

$16.644

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Vyrian

USA . 1,522 parts In-Stock

1+ parts

$17.520

100+ parts

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1k+ parts

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1,522

$17.520

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-

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Anansix

USA . 744 parts In-Stock

1+ parts

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1k+ parts

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744

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

MARBEL Systems

Belgium . 5,605 parts In-Stock

1+ parts

$6.534

100+ parts

-

1k+ parts

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10k+ parts

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5,605

$6.534

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-

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Texas Native Microelectronics

USA . 100 parts In-Stock

1+ parts

$7.510

100+ parts

$7.210

1k+ parts

$6.984

10k+ parts

$6.609

100

$7.510

$7.210

$6.984

$6.609

Kenton Components

USA . 25 parts In-Stock

1+ parts

$9.012

100+ parts

-

1k+ parts

-

10k+ parts

$7.931

25

$9.012

-

-

$7.931

Advanced Electronics

New Zealand . 10 parts In-Stock

1+ parts

$9.634

100+ parts

$8.767

1k+ parts

$7.900

10k+ parts

-

10

$9.634

$8.767

$7.900

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Semicontronic

India . 879 parts In-Stock

1+ parts

$11.820

100+ parts

$11.524

1k+ parts

$11.465

10k+ parts

-

879

$11.820

$11.524

$11.465

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Component Stockers USA

USA . 4,375 parts In-Stock

1+ parts

$12.870

100+ parts

$10.730

1k+ parts

$7.290

10k+ parts

-

4,375

$12.870

$10.730

$7.290

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Corphita

USA . 2,194 parts In-Stock

1+ parts

$15.768

100+ parts

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1k+ parts

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10k+ parts

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2,194

$15.768

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Qasali Group International

UK . 9,074 parts In-Stock

1+ parts

$20.277

100+ parts

-

1k+ parts

$18.858

10k+ parts

$17.844

9,074

$20.277

-

$18.858

$17.844

QUARKTWIN TECHNOLOGY LTD

USA . 10,149 parts In-Stock

1+ parts

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10,149

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

1+ parts

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4,000

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Glotronic Ltd.

UK . 2,117 parts In-Stock

1+ parts

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2,117

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Perfect Parts

USA . 1,276 parts In-Stock

1+ parts

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1,276

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A-Z Elektronik GmbH

Germany . 519 parts In-Stock

1+ parts

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100+ parts

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519

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-

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Kepictronics

USA . 346 parts In-Stock

1+ parts

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100+ parts

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346

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Overview

Upgrade your cellphone's performance with the MAX2055EUP+D by Analog Devices. Designed with top-quality materials and cutting-edge technology, this Baseband Circuit IC offers unmatched reliability and efficiency. Experience seamless communication and enhanced functionality with this Telecom IC, perfect for a wide range of applications. Trust Analog Devices to deliver superior products that surpass industry standards. Elevate your mobile experience with the MAX2055EUP+D today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection against environmental factors, making the product reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, reducing production time and costs.

Package Shape: RECTANGULAR

Rectangular shape offers compatibility with standard electronic components and circuit board layouts, ensuring easy integration into various devices.

No. of Terminals: 20

Having 20 terminals provides ample connectivity options for the IC, enabling it to support complex functions and features in cellphones.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, the IC can withstand heat generated during operation without compromising performance or reliability.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40 °C ensures the IC can function in extreme cold environments without any issues, making it versatile for various applications.

Terminal Finish: Matte Tin (Sn) - annealed

Matte Tin finish provides excellent solderability and electrical conductivity, ensuring secure connections and reliable performance.

Terminal Position: DUAL

Dual terminal position offers redundancy and flexibility in circuit design, allowing for improved signal routing and functionality in cellphones.

Maximum Seated Height: 1.1 mm

Low seated height of 1.1 mm allows for compact and slim designs in cellphones, saving space and enabling sleek aesthetics.

Width: 4.4 mm

Narrow width of 4.4 mm facilitates efficient board layout and space utilization, making the IC suitable for compact cellphone designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures the IC can operate reliably in harsh industrial environments, providing robust performance in demanding conditions.

Technology: BICMOS

BICMOS technology combines the advantages of both bipolar and CMOS technologies, offering high-speed operation and low power consumption for enhanced cellphone performance.

Telecom IC Type: BASEBAND CIRCUIT

Baseband circuit type is essential for processing and managing communication signals in cellphones, enabling seamless connectivity and network performance.

Nominal Supply Voltage: 5 V

Stable 5V supply voltage ensures consistent and reliable operation of the IC, supporting its performance in various cellphone applications.

Terminal Pitch: 0.65 mm

Small terminal pitch of 0.65 mm allows for high-density component placement on circuit boards, maximizing functionality and performance in cellphones.

Technical Specifications

Cellphone ICs MAX2055EUP+D attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

MAX2055EUP+D Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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