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MAX2041ETP+

Analog Devices

MAX2041ETP+ by Analog Devices

MAX2041ETP+ by Analog Devices is a Cellphone IC with 20 terminals in a square package. Operating temperature ranges from -40 to 85 °C, with supply voltage of 5V. It's a BICMOS technology RF and baseband circuit suitable for telecom applications.

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1k+

MAX2041ETP+ by Analog Devices
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Analog Devices Inc

USA . 4,293 parts In-Stock

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Digiode

USA . 3,177 parts In-Stock

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Chip Stock

USA . 2,780 parts In-Stock

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Anansix

USA . 2,366 parts In-Stock

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Vyrian

USA . 909 parts In-Stock

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Bristol Electronics

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Inventory MP

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MARBEL Systems

Belgium . 1,848 parts In-Stock

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$10.438

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Texas Native Microelectronics

USA . 680 parts In-Stock

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$11.998

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$11.518

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$11.158

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$10.558

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Kenton Components

USA . 500 parts In-Stock

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$14.398

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$12.670

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Qasali Group International

UK . 741 parts In-Stock

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$30.127

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$28.507

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Semicontronic

India . 1,651 parts In-Stock

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$38.000

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$37.050

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$36.860

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Component Stockers USA

USA . 608 parts In-Stock

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Ampacity Inc.

Singapore . 1,786 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 12,581 parts In-Stock

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Corphita

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Authorized Procurement Solutions

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Overview

Unlock the potential of your cellphone with the MAX2041ETP+ from Analog Devices. This cutting-edge Cellphone IC boasts superior quality and reliability, making it a top choice for telecom applications. With its innovative technology and industrial-grade temperature range, this RF and baseband circuit delivers exceptional performance. Experience seamless connectivity and optimal power efficiency with the MAX2041ETP+, setting a new standard in telecommunications. Elevate your device's capabilities with Analog Devices' industry-leading solutions.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of the product onto a circuit board, making it a convenient and reliable choice.

Package Shape: SQUARE

The square package shape provides a compact design, saving space on the circuit board and improving overall efficiency.

Power Supplies (V): 5

Operates on a standard 5V power supply, compatible with most circuit boards and power sources.

No. of Terminals: 20

Having 20 terminals allows for a versatile range of connectivity options, making it suitable for various applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this product can withstand high temperatures, ensuring stability and reliability in challenging environments.

Minimum Operating Temperature: -40 °C

Operates at temperatures as low as -40 °C, making it suitable for a wide range of operating conditions.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides good solderability and conductivity, ensuring secure connections and reliable performance.

Terminal Position: QUAD

The quad terminal position offers stable and secure connections, reducing the risk of signal interference or loss.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this product is built to withstand harsh environmental conditions and ensure long-term performance.

Technology: BICMOS

Utilizing BiCMOS technology combines the benefits of both bipolar and CMOS technologies, offering high-speed performance and low power consumption.

Maximum Supply Current: 0.145 mA

With a maximum supply current of 0.145 mA, this product consumes minimal power, making it energy-efficient and cost-effective.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Being designed for RF and baseband circuits, this product is ideal for telecommunications applications, providing reliable signal processing and communication capabilities.

Technical Specifications

Cellphone ICs MAX2041ETP+ attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N20

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC20,.20SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.145 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

MAX2041ETP+ Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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