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MAX2690EUB+

Analog Devices

MAX2690EUB+ by Analog Devices

MAX2690EUB+ by Analog Devices is a cellphone IC with 10 terminals in a small outline package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 3V, making it ideal for telecom applications.

Median Price

$6.370

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

MAX2690EUB+ by Analog Devices
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Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Analog Devices Inc

USA . 1,414 parts In-Stock

1+ parts

$6.370

100+ parts

$4.121

1k+ parts

$3.715

10k+ parts

$3.614

1,414

$6.370

$4.121

$3.715

$3.614

Mouser Electronics

USA . 113 parts In-Stock

1+ parts

$6.920

100+ parts

$4.490

1k+ parts

$3.890

10k+ parts

-

113

$6.920

$4.490

$3.890

-

Verical

USA . 300 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.315

10k+ parts

-

300

-

-

$3.315

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,397 parts In-Stock

1+ parts

$6.754

100+ parts

-

1k+ parts

-

10k+ parts

-

2,397

$6.754

-

-

-

Vyrian

USA . 4,282 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,282

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-

-

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Anansix

USA . 2,168 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,168

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,098 parts In-Stock

1+ parts

$6.399

100+ parts

-

1k+ parts

-

10k+ parts

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1,098

$6.399

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-

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Semicontronic

India . 122 parts In-Stock

1+ parts

$6.740

100+ parts

$6.572

1k+ parts

$6.538

10k+ parts

-

122

$6.740

$6.572

$6.538

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MARBEL Systems

Belgium . 1,010 parts In-Stock

1+ parts

$12.766

100+ parts

-

1k+ parts

-

10k+ parts

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1,010

$12.766

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-

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Texas Native Microelectronics

USA . 625 parts In-Stock

1+ parts

$14.674

100+ parts

$14.087

1k+ parts

$13.647

10k+ parts

$12.913

625

$14.674

$14.087

$13.647

$12.913

Microchip USA

USA . 2,247 parts In-Stock

1+ parts

$16.720

100+ parts

$16.480

1k+ parts

$16.360

10k+ parts

$16.240

2,247

$16.720

$16.480

$16.360

$16.240

Kenton Components

USA . 5,633 parts In-Stock

1+ parts

$17.609

100+ parts

-

1k+ parts

-

10k+ parts

$15.496

5,633

$17.609

-

-

$15.496

Qasali Group International

UK . 3,361 parts In-Stock

1+ parts

$39.620

100+ parts

-

1k+ parts

-

10k+ parts

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3,361

$39.620

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-

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QUARKTWIN TECHNOLOGY LTD

USA . 19,810 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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19,810

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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2,500

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-

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Kepictronics

USA . 1,200 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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1,200

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-

-

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Overview

Discover the MAX2690EUB+ by Analog Devices, a top-of-the-line Cellphone IC that guarantees unparalleled quality and performance. Manufactured by industry leader Analog Devices, this product offers cutting-edge technology for various applications in the telecommunications sector. With a compact design and reliable construction, the MAX2690EUB+ provides customers with unmatched value and benefits, making it a must-have component for any project. Experience the advantages of superior functionality and seamless integration with the MAX2690EUB+ today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability to the product, making it ideal for long-term use.

Surface Mount: YES

Surface mount technology ensures easy installation and space-saving design for compact devices.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient placement on circuit boards and helps optimize space utilization.

No. of Terminals: 10

Having 10 terminals provides ample connection points for various functions, enhancing versatility.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product is suitable for industrial applications where heat resistance is crucial.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the product can withstand harsh environmental conditions, enhancing its reliability in different climates.

Terminal Finish: Matte Tin (Sn) - annealed

Matte Tin finish improves solderability and corrosion resistance, ensuring stable connections for optimal performance.

Terminal Position: DUAL

Having dual terminal positions allows for flexibility in circuit design and integration, accommodating various configurations.

Maximum Seated Height: 1.092 mm

The low seated height profile helps in reducing overall package size and enables slim and compact device designs.

Width: 2.9465 mm

Narrow width dimension contributes to the compactness of the product, making it suitable for space-constrained applications.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time ensures efficient soldering process, reducing the risk of heat damage to sensitive components.

Peak Reflow Temperature °C: 260

High peak reflow temperature enables reliable solder joints and prevents component warping during assembly.

Length: 3 mm

Compact length dimension contributes to the overall small form factor of the product, making it suitable for portable devices.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures the product can withstand harsh operating conditions in demanding environments.

Terminal Form: GULL WING

Gull wing terminal form provides secure solder joints and ease of inspection during manufacturing, ensuring robust connections.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Designed for telecom applications, this product integrates RF and baseband circuits, offering comprehensive functionality in communication devices.

Nominal Supply Voltage: 3 V

Stable 3V supply voltage ensures consistent performance and compatibility with common power sources in electronic devices.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting, enabling more functionalities in limited board space for enhanced capability.

Technical Specifications

Cellphone ICs MAX2690EUB+ attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

R-PDSO-G10

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.092 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2.9465 mm

Trade Compliance

MAX2690EUB+ Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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