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HMC689LP4TR

Analog Devices

HMC689LP4TR by Analog Devices

Analog Devices' HMC689LP4TR is a BICMOS technology Cellphone IC with 24 terminals in a square chip carrier package. It operates b/w -40 to 85 °C, suitable for industrial applications. This RF and baseband circuit has a nominal voltage of 5V, making it ideal for telecom systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,052 parts In-Stock

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2,052

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Digiode

USA . 274 parts In-Stock

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274

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Distributors (Availability)

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AZTECH Wire

Italy . 831 parts In-Stock

1+ parts

$6.131

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831

$6.131

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Parana Technologies

USA . 4,320 parts In-Stock

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$10.866

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$10.105

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4,320

$10.866

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$10.105

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IDEA Electronic Components Group

UK . 2,353 parts In-Stock

1+ parts

$11.684

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$11.100

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$11.100

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2,353

$11.684

$11.100

$11.100

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DigiPath Technology Company

USA . 519 parts In-Stock

1+ parts

$18.227

100+ parts

$17.498

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$17.498

519

$18.227

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$17.498

One Stop Electronics

USA . 1,405 parts In-Stock

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$701.000

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1,405

$701.000

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Semicontronic

India . 1,378 parts In-Stock

1+ parts

$999.000

100+ parts

$974.025

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$969.030

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1,378

$999.000

$974.025

$969.030

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Corphita

USA . 224 parts In-Stock

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Overview

Elevate your cellphone performance with the HMC689LP4TR by Analog Devices, a cutting-edge RF and baseband circuit designed to optimize communication capabilities. Manufactured with precision and expertise, this product delivers unparalleled quality and reliability for seamless integration into your device. With a sleek square package style and advanced BICMOS technology, this IC offers exceptional value and benefits for improved functionality and efficiency. Upgrade your smartphone experience with the HMC689LP4TR and stay connected like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and reliability for long-term usage.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards.

Package Shape: SQUARE

Square package shape helps in efficient utilization of space on the PCB.

No. of Terminals: 24

More terminals provide greater functionality and connectivity options for the cellphone ICs.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Various package styles offer flexibility in design and thermal management for optimal performance.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures stability and reliability in different environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for usage in a wide range of environments.

Terminal Position: QUAD

Quad terminal position provides efficient signal routing and connectivity within the IC.

Maximum Seated Height: 1 mm

Low seated height allows for slim and compact designs in cellphones.

Width: 4 mm

Narrow width enables space-saving integration of the IC in the cellphone's circuitry.

Length: 4 mm

Compact length facilitates easy placement and routing of the IC on the PCB.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliability and performance in harsh operating conditions.

Technology: BICMOS

BiCMOS technology combines the advantages of bipolar and CMOS technologies for efficient power management and high-speed operation.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and ensures safer handling of the IC.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Combination of RF and baseband circuitry supports seamless communication and data processing in cellphones.

Nominal Supply Voltage: 5 V

Stable 5V supply voltage ensures consistent performance of the IC in the cellphone.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density integration of the IC on the PCB for enhanced functionality.

Technical Specifications

Cellphone ICs HMC689LP4TR attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PQCC-N24

Length:

4 mm

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

4 mm

Trade Compliance

HMC689LP4TR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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