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HMC682LP6CTR

Analog Devices

HMC682LP6CTR by Analog Devices

Analog Devices' HMC682LP6CTR is a 40-terminal cellphone IC with a package style of chip carrier, heat sink/slug, and very thin profile. Operating temperature ranges from -40 to 85 °C, making it suitable for industrial telecom applications requiring RF and baseband circuit integration at a nominal voltage of 5V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,201 parts In-Stock

1+ parts

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6,201

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Digiode

USA . 824 parts In-Stock

1+ parts

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824

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,113 parts In-Stock

1+ parts

$7.082

100+ parts

-

1k+ parts

$6.586

10k+ parts

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2,113

$7.082

-

$6.586

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IDEA Electronic Components Group

UK . 1,296 parts In-Stock

1+ parts

$7.615

100+ parts

-

1k+ parts

$7.234

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1,296

$7.615

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$7.234

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DigiPath Technology Company

USA . 1,913 parts In-Stock

1+ parts

$11.879

100+ parts

$11.404

1k+ parts

-

10k+ parts

$11.404

1,913

$11.879

$11.404

-

$11.404

AZTECH Wire

Italy . 612 parts In-Stock

1+ parts

$12.692

100+ parts

-

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612

$12.692

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One Stop Electronics

USA . 393 parts In-Stock

1+ parts

$241.000

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393

$241.000

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Semicontronic

India . 662 parts In-Stock

1+ parts

$697.000

100+ parts

$679.575

1k+ parts

$676.090

10k+ parts

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662

$697.000

$679.575

$676.090

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Corphita

USA . 529 parts In-Stock

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529

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Overview

Enhance the performance of your cellphone with the HMC682LP6CTR by Analog Devices. Crafted with precision and expertise, this cutting-edge Cellphone IC offers unmatched quality and reliability. Perfect for RF and baseband circuits, this product guarantees seamless integration and superior functionality. Experience the value of smooth communication and optimized efficiency with Analog Devices' HMC682LP6CTR. Upgrade your device today and witness the difference in performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material provides durability and resistance to impact, making the product suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving space and simplifying assembly.

Package Shape: SQUARE

Square shape makes the product compact and helps in optimizing space on the circuit board.

No. of Terminals: 40

Having 40 terminals provides ample connectivity options for various functions, making the product versatile and compatible with different systems.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile design helps in heat dissipation, compactness, and efficient performance of the product.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand challenging environmental conditions and maintain stable performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the product can function even in cold environments without compromising its performance.

Terminal Position: QUAD

Quad terminal position enables efficient connectivity and signal transmission, contributing to the overall functionality of the product.

Maximum Seated Height: 0.9 mm

Low maximum seated height helps in compact design and space-saving on the circuit board.

Width: 6 mm

Narrow width allows for easy integration in tight spaces or densely populated circuit boards.

Length: 6 mm

Short length contributes to the overall compactness and efficiency of the product.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliability and performance even in harsh industrial environments.

Terminal Form: NO LEAD

No lead terminals reduce the risk of contamination and ensure a clean and reliable connection.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Support for RF and baseband circuits enables diverse functionality and compatibility with different communication systems.

Nominal Supply Voltage: 5 V

Stable 5V nominal supply voltage ensures consistent and reliable operation of the product.

Terminal Pitch: 0.5 mm

With a small terminal pitch, the product can accommodate more terminals in a compact space, enhancing its functionality and connectivity options.

Technical Specifications

Cellphone ICs HMC682LP6CTR attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PQCC-N40

Length:

6 mm

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

.9 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

6 mm

Trade Compliance

HMC682LP6CTR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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