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LMV228TL/NOPB

Texas Instruments

LMV228TL/NOPB by Texas Instruments

LMV228TL/NOPB by Texas Instruments is a cellphone IC with surface mount capability. It features a max operating temperature of 85°C and min of -40°C, making it suitable for industrial applications. With a max supply current of 8mA, it is designed for RF and baseband circuit use in telecommunications.

Median Price

$1.810

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,008 parts In-Stock

1+ parts

$1.440

100+ parts

$1.108

1k+ parts

$0.583

10k+ parts

-

3,008

$1.440

$1.108

$0.583

-

Mouser Electronics

USA . 532 parts In-Stock

1+ parts

$2.180

100+ parts

$1.450

1k+ parts

$1.040

10k+ parts

$0.968

532

$2.180

$1.450

$1.040

$0.968

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,691 parts In-Stock

1+ parts

$0.550

100+ parts

-

1k+ parts

-

10k+ parts

-

3,691

$0.550

-

-

-

Digiode

USA . 3,085 parts In-Stock

1+ parts

$1.368

100+ parts

-

1k+ parts

-

10k+ parts

-

3,085

$1.368

-

-

-

Anansix

USA . 1,006 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,006

-

-

-

-

Bristol Electronics

USA . 396 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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396

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 948 parts In-Stock

1+ parts

$1.296

100+ parts

-

1k+ parts

-

10k+ parts

-

948

$1.296

-

-

-

Parana Technologies

USA . 2,363 parts In-Stock

1+ parts

$15.199

100+ parts

-

1k+ parts

$15.595

10k+ parts

-

2,363

$15.199

-

$15.595

-

DigiPath Technology Company

USA . 741 parts In-Stock

1+ parts

$16.735

100+ parts

$15.397

1k+ parts

-

10k+ parts

-

741

$16.735

$15.397

-

-

IDEA Electronic Components Group

UK . 1,334 parts In-Stock

1+ parts

$17.077

100+ parts

$16.223

1k+ parts

$15.369

10k+ parts

-

1,334

$17.077

$16.223

$15.369

-

ChromeModa Solutions

Germany . 89 parts In-Stock

1+ parts

$17.077

100+ parts

$14.003

1k+ parts

-

10k+ parts

-

89

$17.077

$14.003

-

-

Perfect Parts

USA . 560 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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560

-

-

-

-

Overview

Unlock the potential of your cellphone with the LMV228TL/NOPB by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-quality products that deliver superior performance and reliability. Designed for cellphone ICs, this surface-mount package boasts a grid array with a very thin profile and fine pitch. With an industrial temperature grade and low supply current, the LMV228TL/NOPB is perfect for RF and baseband circuits. Experience seamless communication and enhanced functionality with this cutting-edge technology at your fingertips.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy installation and space-saving design, making this product suitable for modern compact devices.

Package Shape: RECTANGULAR

Rectangular package shape is common and easy to handle during assembly, ensuring compatibility with a wide range of devices.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability and performance under varying environmental conditions.

Minimum Operating Temperature: -40 °C

Wide range of operating temperature allows for usage in extreme cold environments, increasing the product's versatility.

Terminal Finish: TIN SILVER COPPER

Terminal finish with a combination of Tin, Silver, and Copper provides excellent conductivity and reliability, enhancing the overall performance of the product.

Maximum Time At Peak Reflow Temperature (s): 30

Short time at peak reflow temperature helps prevent overheating and ensures the integrity of the components during manufacturing processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature allows for proper soldering of the components, ensuring strong and reliable electrical connections.

Temperature Grade: INDUSTRIAL

Industrial temperature grade indicates high durability and reliability, making this product suitable for rugged industrial applications.

Terminal Form: BALL

Ball terminal form offers excellent soldering reliability and electrical performance, making it a suitable choice for high-speed and high-frequency applications.

Maximum Supply Current: 8 mA

Low maximum supply current helps in power efficiency and extends battery life in portable devices.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Combination of RF and Baseband circuit makes this product versatile and capable of handling both wireless communication and signal processing tasks effectively.

Technical Specifications

Cellphone ICs LMV228TL/NOPB attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-XBGA-B4

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Supply Current:

8 mA

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

LMV228TL/NOPB Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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