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MAX2031ETP/-T

Analog Devices

MAX2031ETP/-T by Analog Devices

MAX2031ETP/-T by Analog Devices is a Cellphone IC with 20 terminals, operating at -40 to 85 °C. It features BICMOS technology, RF and baseband circuit for telecom applications, and requires 5V supply voltage with a max current of 0.1mA.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,534 parts In-Stock

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2,534

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Vyrian

USA . 2,427 parts In-Stock

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2,427

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Digiode

USA . 2,124 parts In-Stock

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2,124

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Distributors (Availability)

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MARBEL Systems

Belgium . 3,222 parts In-Stock

1+ parts

$11.092

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$11.092

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Texas Native Microelectronics

USA . 291 parts In-Stock

1+ parts

$12.750

100+ parts

$12.240

1k+ parts

$11.858

10k+ parts

$11.220

291

$12.750

$12.240

$11.858

$11.220

AZTECH Wire

Italy . 761 parts In-Stock

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$13.626

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761

$13.626

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Kenton Components

USA . 3,275 parts In-Stock

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$15.300

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$13.464

3,275

$15.300

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$13.464

Qasali Group International

UK . 2,969 parts In-Stock

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$34.425

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$32.015

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$30.294

2,969

$34.425

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$32.015

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One Stop Electronics

USA . 1,965 parts In-Stock

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$489.000

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1,965

$489.000

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Semicontronic

India . 1,323 parts In-Stock

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$897.000

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$874.575

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$870.090

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1,323

$897.000

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$870.090

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Corphita

USA . 2,617 parts In-Stock

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Overview

Unleash the power of your cellphone with the MAX2031ETP/-T by Analog Devices. Designed with precision and expertise, this Cellphone IC offers unparalleled performance and reliability. From RF to baseband circuits, this cutting-edge technology ensures seamless communication. With a compact square package, very thin profile, and industrial-grade temperature rating, the MAX2031ETP/-T is perfect for all your telecom needs. Elevate your device's capabilities and experience the difference with Analog Devices.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient deployment on printed circuit boards, making it convenient for manufacturers to assemble and mass produce these cellphone ICs.

Package Shape: SQUARE

The square package shape provides a compact and space-saving design, ideal for modern mobile devices where size and weight are crucial factors.

Power Supplies (V): 5

Operating at 5 volts allows for compatibility with standard power sources and ensures stable performance for the cellphone ICs.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, these cellphone ICs can withstand demanding usage conditions without compromising on performance.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides excellent conductivity and solderability, ensuring reliable connections and long-term functionality of the cellphone ICs.

Technology: BICMOS

Utilizing Bipolar-CMOS (BICMOS) technology offers a balance between speed and power consumption, making these cellphone ICs efficient and high-performing.

Technical Specifications

Cellphone ICs MAX2031ETP/-T attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N20

JESD-609 Code:

e0

Length:

5 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC20,.20SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.1 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

5 mm

Trade Compliance

MAX2031ETP/-T Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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