Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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RF AND BASEBAND CIRCUIT; JESD-609 Code: e3; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Terminal Finish: MATTE TIN;
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Cellphone ICs ST25R3911B-AQWT attributes and parameters. Explore more Cellphone ICs devices from STMicroelectronics
JESD-609 Code:
Moisture Sensitivity Level (MSL):
Peak Reflow Temperature (C):
Telecom IC Type:
Terminal Finish:
ST25R3911B-AQWT Telecommunications trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.
President, CEO
Jean-Marc Chery
President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience
Lorenzo Grandi
President, Sales & Marketing
Jerome Roux
Castelletto
Fabrication
Fab Initiation
1968
Italy
Wafer Capacity
SGFAB AMK 6
2000
Singapore
29,000
AG200
Agrate Brianza
14,000
RST 8
France
Rousset
35,000
Crolles 1
1993
Crolles
30,000
Crolles 2-ext. mod 5
Crolles 2-ext. mod 2
2022
Crolles 2-ext. mod 3
2023
Crolles 2
2004
28,000
1985
SiC Fab
2006
Sweden
Norrköping
10,000
Fab 3
2005
Tours
2,000
Fab 1 & Fab 2
1978
55,000
Fab 2
1997
Catania
SGFAB-AMK 6E
2003
145,000
SGFAB-AMJ 9
1984
152,000
AG300 (R3)
1980
25,000
1987
34,000
AG300
2024
Crolles 2-ext. mod 1
2020
Fab 1 6-inch fab
2013
11,000
SiC 6-inch line
2021
2,500
200mm GaN
2018
SGFAB-AMK 8
2001
Crolles 2- JV Fab
SGFAB-AMK 6
2016
38,125
SGFAB-AMK 2E
2010
20,000
Silicon Carbide A.B.
SiC wafer/EPI Fab
SiC Device Fab
2025
USBLC6-2SC6
STMicroelectronics
USBLC6-2SC6 by STMicroelectronics is a unidirectional transient voltage suppressor diode with a breakdown voltage of 6V. It has a max clamping voltage of 17V and operates in temperatures ranging from -40 to 125°C. This device, with dual terminals and matte tin finish, is ideal for protecting sensitive electronics from voltage spikes in various applications.
2N7002
Diotec Semiconductor Ag
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Time At Peak Reflow Temperature (s): 10; Terminal Finish: MATTE TIN;
BSS123LT1G
Onsemi
BSS123LT1G by Onsemi is a N-CHANNEL FET with 100V DS breakdown voltage, 0.17A drain current, and 6 ohm on resistance. Ideal for switching applications, it operates in enhancement mode with a max power dissipation of 0.225W. It comes in a small outline package with gull wing terminals and can withstand temperatures from -55 to 150°C.
BAV99
Weitronic Enterprise
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
STM32F405RGT6
STM32F405RGT6 by STMicroelectronics is a 32-bit microcontroller with 2/3.3V power supplies, 16 external interrupts, and 196608 RAM bytes. Ideal for industrial applications, it features CAN(2), I2C(3), SPI(3) connectivity options and operates at a max clock frequency of 26 MHz. With low power mode and DMA support, it offers versatile performance in compact dimensions.
2N2222A
Texas Instruments
2N2222A by Texas Instruments is a small signal NPN bipolar junction transistor (BJT) with a max collector-emitter voltage of 40V and a max collector current of 0.8A. It is commonly used for switching applications due to its fast turn on/off times (35ns/285ns) and high transition frequency (300MHz).
LM107H/883
Rochester Electronics
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Maximum Average Bias Current (IIB): .1 uA;
BSS138K-13
Diodes Incorporated
BSS138K-13 by Diodes Inc. is a N-channel FET with 50V DS breakdown voltage, ideal for switching applications. It features single configuration with built-in diode, operating in enhancement mode. With 3 terminals and 0.31A max drain current, it offers high performance in small outline package style.
Transys Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Minimum DS Breakdown Voltage: 60 V; Maximum Operating Temperature: 150 Cel;
Unisonic Technologies
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Package Body Material: PLASTIC/EPOXY; Package Shape: RECTANGULAR;
BSS84PH6327XTSA2
Infineon Technologies
BSS84PH6327XTSA2 by Infineon is a P-CHANNEL FET with 60V DS breakdown voltage, ideal for switching applications. It features a single configuration with built-in diode and operates in enhancement mode. With a max drain current of 0.17A and on-resistance of 8 ohm, it offers reliable performance in small outline packages.
RC0402FR-0710KL
Yageo
Yageo's RC0402FR-0710KL is a 10000 ohm SMT fixed resistor with 1% tolerance, suitable for applications requiring a rated power dissipation of 0.0625 W. With a temperature coefficient of 100 ppm/°C, it operates b/w -55 to 155 °C, making it ideal for various electronic circuits.
Fairchild Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Time At Peak Reflow Temperature (s): 30; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
BSS138
Micro Commercial Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Package Shape: RECTANGULAR; Terminal Position: DUAL;
Central Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Transistor Application: SWITCHING; Transistor Element Material: SILICON;
FDN306P
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .5 W; Maximum Drain Current (Abs) (ID): 2.6 A; Operating Mode: ENHANCEMENT MODE;
Small Signal Bipolar Transistors; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; JESD-609 Code: e0;
National Semiconductor
LM358AN
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
SPC TECHNOLOGY/ MULTICOMP
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
TRF6901PT
TRF6901PT by Texas Instruments is a cellphone IC with 48 terminals, operating at -40 to 85°C. It has a supply voltage of 2/3.3V and low profile flatpack package style. Ideal for RF and baseband circuits in industrial telecom applications.
MAX2046ETJ+T
Analog Devices
MAX2046ETJ+T by Analog Devices is a cellphone IC with 32 terminals in a square chip carrier package. Operating temperature ranges from -40 to 85 °C, suitable for industrial use. It features a nominal voltage of 5V and is ideal for baseband circuit applications.
MAX2059ETL+T
MAX2059ETL+T by Analog Devices is a 40-terminal cellphone IC with BICMOS tech. Operating temp range -40 to 85 °C, peak reflow temp 260°C. Used in RF and baseband circuits for telecom applications due to its compact square chip carrier package.
MAX2606EUT-T
Maxim Integrated
MAX2606EUT-T by Maxim Integrated is a small outline, low profile cellphone IC with 6 terminals. Operating temperature ranges from -40 to 85°C. Ideal for baseband circuits in telecom applications due to its compact size and industrial temperature grade suitability.
CC1050-RTR1
CC1050-RTR1 by Texas Instruments is a cellphone IC with 24 terminals in a small outline, thin profile package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 3V and terminal pitch of 0.65mm.
AD8348ARUZ
AD8348ARUZ by Analog Devices is a Cellphone IC with 28 terminals, operating at -40 to 85°C. It has a supply voltage of 5V and uses BIPOLAR technology for BASEBAND CIRCUIT in telecom applications. The package is RECTANGULAR, PLASTIC/EPOXY material, with GULL WING terminals and a small outline of 9.7mm x 4.4mm x 1.2mm dimensions.
CC2511F16RSPR
The Texas Instruments CC2511F16RSPR is a cellphone IC with 36 terminals in a square chip carrier package. It operates at temperatures from 0 to 85°C, with a supply voltage of 3.3V. This RF and baseband circuit features CMOS technology and has a terminal pitch of 0.5mm, making it suitable for various wireless communication applications.
TRF370317IRGERG4
TRF370317IRGERG4 by Texas Instruments is a cellphone IC with 24 terminals, operating at -40 to 85°C. It features a supply voltage of 5V, RF and baseband circuit for telecom applications, and terminal finish in nickel palladium gold.
ADL5592ACPZ-R7
ADL5592ACPZ-R7 by Analog Devices is a cellphone IC with 40 terminals in a square chip carrier package. It operates b/w -40 to 85 °C, suitable for industrial use. With a nominal voltage of 5V, it's ideal for baseband circuit applications in telecommunications.
TRF370317IRGER
TRF370317IRGER by Texas Instruments is a cellphone IC with 24 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with a supply voltage of 5V and max current of 0.245mA. Ideal for RF and baseband circuits in industrial telecom applications.
AD8341ACP
AD8341ACP by Analog Devices is a cellphone IC with 24 terminals in a square package. It operates at -40 to 85 °C, with a supply voltage of 5V. This RF and baseband circuit technology is ideal for telecom applications.
CC2511F8RSPG3
CC2511F8RSPG3 by Texas Instruments is a cellphone IC with 36 terminals in a square chip carrier package. Operating temperature range from -40 to 85°C, suitable for industrial use. Features RF and baseband circuit technology, with a nominal voltage of 3V for telecom applications.
ADF4360-7BCPZRL7
ADF4360-7BCPZRL7 by Analog Devices is a cellphone IC with a square package shape and 24 terminals. It operates at a voltage of 3.3V and has an industrial temperature grade. This baseband circuit is suitable for telecom applications.
TOBY-L210-03S-03
U-blox Ag
TOBY-L210-03S-03 by U-blox Ag is a Cellphone IC with 152 terminals in a rectangular grid array package. Operating b/w -20°C to 65°C, it integrates RF and baseband circuits for telecom applications. With a compact size of 24.8mm x 35.6mm and low seated height of 2.87mm, it's ideal for mobile device designs.
MAX2041ETP+
MAX2041ETP+ by Analog Devices is a Cellphone IC with 20 terminals in a square package. Operating temperature ranges from -40 to 85 °C, with supply voltage of 5V. It's a BICMOS technology RF and baseband circuit suitable for telecom applications.
CC113LRGPR
The Texas Instruments CC113LRGPR is a cellphone IC with 20 terminals in a square chip carrier package. Operating at temperatures from -40 to 85°C, it has a supply voltage of 1.8/3.6V and data rate of 0.6 Mbps. Ideal for RF and baseband circuits, this IC is surface mountable and features a moisture sensitivity level of 3.
NINA-B222-03B
RF AND BASEBAND CIRCUIT; Moisture Sensitivity Level (MSL): 4;
ST25R3912-AWLT
ST25R3912-AWLT by STMicroelectronics is a CELLPHONE IC with 30 terminals in a GRID ARRAY package. It operates b/w -40 to 125°C, suitable for AUTOMOTIVE applications. This RF and BASEBAND CIRCUIT has a nominal voltage of 3.3V, making it ideal for telecom use.
TRF4903PWRG4
TRF4903PWRG4 by Texas Instruments is a cellphone IC with 24 terminals, operating at -40 to 85°C. It features a supply voltage of 2.7V and low current consumption of 0.043mA. Ideal for RF and baseband circuits in telecom applications due to its compact size and dual terminal position.
TCM8000FR
Texas Instruments TCM8000FR is a Cellphone IC with BICMOS technology, 44 terminals in a square package. Operating temp range -25 to 80°C, suitable for baseband circuits. Package style: flatpack, terminal form: gull wing, and nominal voltage of 5V make it ideal for telecom applications.
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ST25R3911B-AQFT
RF AND BASEBAND CIRCUIT; Terminal Finish: MATTE TIN; JESD-609 Code: e3; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;
ST25R3916-AQWT
RF AND BASEBAND CIRCUIT; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;
RF AND BASEBAND CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 30; Package Code: VFBGA; Package Shape: RECTANGULAR;
ST25R3920B-AQWT
RF AND BASEBAND CIRCUIT;
ST25R3918AQWT
ST25R3912-AQWT
RF AND BASEBAND CIRCUIT; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
ST25R3911B-ASWB
ST25R3920AQWT
ST25R36911B-AQFT
ST25R3911B-AQFB
RF AND BASEBAND CIRCUIT; Peak Reflow Temperature (C): 260; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 3; Terminal Finish: MATTE TIN;
ST25R3911B-AQWB
RF AND BASEBAND CIRCUIT; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; JESD-609 Code: e3; Terminal Finish: MATTE TIN;
ST25R3911B-ASWT
RF AND BASEBAND CIRCUIT; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e3; Peak Reflow Temperature (C): 260; Terminal Finish: MATTE TIN;
ST25R3912-AQFT
RF AND BASEBAND CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
ST25R3913-AQFT
ST25R3913-AQWT
ST25R3913-AWLT
Supply Digital Components
$106.00
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12,000 In-Stock
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