Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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ST25R3912-AQFT by STMicroelectronics is a compact RF and baseband circuit IC designed for automotive applications. It operates within -40 °C to 125 °C, features a 3.3V supply, and comes in a very thin profile with 32 terminals. Ideal for cellphone integration, it ensures reliable performance in demanding environments.
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Vyrian
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Digiode
Anansix
IDEA Electronic Components Group
$8.845
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MKK Technologies
$16.632
DigiPath Technology Company
AZTECH Wire
$19.920
Corphita
Parana Technologies
$10.575
This surface mount capability allows for compact design and improved thermal performance, making it suitable for space-constrained applications.
The square package shape provides even distribution of thermal characteristics and facilitates easier PCB layout, contributing to overall efficiency.
Having 32 terminals allows for more complex connections and functionality, supporting advanced designs in cellular technology.
This style combines minimal space usage with excellent heat dissipation, ensuring higher reliability and performance in demanding environments.
The high maximum operating temperature ensures adaptability in high-temperature automotive environments, enhancing longevity and reliability.
The -40 °C minimum operating temperature makes this IC suitable for extreme climate conditions, enabling reliable performance in outdoor and automotive applications.
Quad terminal positioning aids in better signal integrity and minimizes electromagnetic interference, which is crucial for RF and baseband circuit operations.
With a low seated height, this IC supports designs that demand slim profiles, which are essential in modern, compact mobile devices.
A compact width facilitates easy integration into small form-factor devices, maintaining design flexibility.
The short length complements its width in creating space-efficient solutions without sacrificing performance.
With an automotive temperature grade, this IC is built for durability and reliability, suitable for use in vehicles under varying environmental conditions.
No lead terminals reduce the risk of solder joint fatigue and enhance overall reliability, ideal for high-performance applications.
Designed for both RF and baseband functionality, this IC supports versatile telecommunications applications, crucial for modern cellular technologies.
Operating at a nominal supply voltage of 3.3 V enhances power efficiency, making it compatible with a wide range of mobile components.
The 0.5 mm terminal pitch allows for denser mounting on PCBs, saving valuable space and making the design more efficient.
Cellphone ICs ST25R3912-AQFT attributes and parameters. Explore more Cellphone ICs devices from STMicroelectronics
JESD-30 Code:
Length:
No. of Functions:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Maximum Seated Height:
Nominal Supply Voltage:
Surface Mount:
Telecom IC Type:
Temperature Grade:
Terminal Form:
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Maximum Time At Peak Reflow Temperature (s):
Width:
ST25R3912-AQFT Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.
President, CEO
Jean-Marc Chery
President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience
Lorenzo Grandi
President, Sales & Marketing
Jerome Roux
Castelletto
Fabrication
Fab Initiation
1968
Italy
Wafer Capacity
SGFAB AMK 6
2000
Singapore
29,000
AG200
Agrate Brianza
14,000
RST 8
France
Rousset
35,000
Crolles 1
1993
Crolles
30,000
Crolles 2-ext. mod 5
Crolles 2-ext. mod 2
2022
Crolles 2-ext. mod 3
2023
Crolles 2
2004
28,000
1985
SiC Fab
2006
Sweden
Norrköping
10,000
Fab 3
2005
Tours
2,000
Fab 1 & Fab 2
1978
55,000
Fab 2
1997
Catania
SGFAB-AMK 6E
2003
145,000
SGFAB-AMJ 9
1984
152,000
AG300 (R3)
1980
25,000
1987
34,000
AG300
2024
Crolles 2-ext. mod 1
2020
Fab 1 6-inch fab
2013
11,000
SiC 6-inch line
2021
2,500
200mm GaN
2018
SGFAB-AMK 8
2001
Crolles 2- JV Fab
SGFAB-AMK 6
2016
38,125
SGFAB-AMK 2E
2010
20,000
Silicon Carbide A.B.
SiC wafer/EPI Fab
SiC Device Fab
2025
LM358AN
Signetics
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
LM317T
Sgs-ates Componenti Electronici S P A
Other Regulators; No. of Terminals: 3; JESD-609 Code: e0; Terminal Position: SINGLE; Adjustability: ADJUSTABLE; Maximum Load Regulation (%): 1.5 %;
2N7002
Changzhou Galaxy Century Microelectronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Minimum DS Breakdown Voltage: 60 V; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; No. of Terminals: 3;
SMBJ18CA
General Instrument
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358ADR
Texas Instruments
LM358ADR by Texas Instruments is an operational amplifier with 2 functions, featuring a max input offset voltage of 5000 uV and nominal voltage of 5V. Widely used in applications requiring high voltage gain, it operates within a temperature range of 0-70°C and offers frequency compensation for stability.
LL4148
Panjit International
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
BAV99
Taiwan Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138
Philips Semiconductors
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Operating Mode: ENHANCEMENT MODE; Maximum Operating Temperature: 150 Cel;
2N2222A
Rectron
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; Package Shape: ROUND;
Semtech Electronics
DS18B20Z/T&R
Maxim Integrated
DS18B20Z/T&R by Maxim Integrated is a 12-bit digital temperature sensor with a max supply voltage of 5.5V and an accuracy of 0.50°C. It features a 1-Wire interface, operates b/w -55°C to 125°C, and is ideal for applications requiring precise temperature monitoring in compact spaces.
RECTIFIER DIODE; Surface Mount: YES; Maximum Output Current: .1 A; Peak Reflow Temperature (C): 260; Terminal Finish: MATTE TIN; Maximum Reverse Recovery Time: .006 us;
SPC TECHNOLOGY/ MULTICOMP
1N4148
Vishay Intertechnology
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
DS18B20+
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: THROUGH HOLE MOUNT; No. of Terminals: 3; Package Shape or Style: RECTANGULAR; Maximum Operating Current: 1.5 mA; Package Equivalence Code: SIP3,.1,50;
Micronas Semiconductor Holding Ag
RECTIFIER DIODE; Surface Mount: YES; No. of Phases: 1; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Output Current: .2 A; Maximum Forward Voltage (VF): 1.2 V;
RECTIFIER DIODE; Surface Mount: NO; Config: SINGLE; Peak Reflow Temperature (C): 260; No. of Phases: 1; Diode Element Material: SILICON;
Weitron Technology
Diodes Incorporated
Excel (Suzhou) Semiconductor
HMC689LP4
Analog Devices
Analog Devices' HMC689LP4 is a BICMOS technology Cellphone IC with 24 terminals in a square chip carrier package. Operating temperature range from -40 to 85 °C, suitable for RF and baseband circuits in telecom applications. Features include tin/lead terminal finish, 5V supply voltage, and compact 4x4mm dimensions.
LT5526EUF#PBF
LT5526EUF#PBF by Analog Devices is a 16-terminal cellphone IC with a package style of chip carrier, heat sink/slug. It operates b/w -40 to 85°C and has a peak reflow temperature of 260°C. Ideal for RF and baseband circuits in telecom applications due to its compact size and industrial temperature grade.
SARA-R510M8S-00B
U-blox Ag
RF AND BASEBAND CIRCUIT;
MAX2609EUT+T
MAX2609EUT+T by Analog Devices is a cellphone IC in a small outline package with 6 terminals. It operates b/w -40 to 85°C, with a peak reflow temperature of 260°C. Ideal for baseband circuits, it has a nominal voltage of 2.75V and terminal pitch of 0.95mm.
CC1100RTKG3
CC1100RTKG3 by Texas Instruments is a cellphone IC with 20 terminals, operating at temperatures from -40 to 85°C. It features a supply voltage of 1.8/3.6V, CMOS technology, and RF/baseband circuitry for telecom applications. This surface-mount chip carrier has a square shape and very thin profile, making it suitable for industrial use in compact devices.
CC1101RGP
CC1101RGP by Texas Instruments is a cellphone IC with 20 terminals, operating at 1.8/3.6V and supporting data rates up to 0.5 Mbps. It features a square chip carrier package style suitable for RF and baseband circuits in industrial temperature environments. The IC is surface mountable, with a compact size of 4x4mm and terminal pitch of 0.5mm, making it ideal for mobile communication applications.
TLV321AC36CPT
TLV321AC36CPT by Texas Instruments is a 48-terminal cellphone IC with CMOS technology. It operates b/w 0-70°C, suitable for baseband circuits. The flatpack package has low profile and fine pitch, making it ideal for compact mobile devices.
AD6688BBPZRL-3000
AD6688BBPZRL-3000 by Analog Devices is a CELLPHONE IC with 196 terminals in a GRID ARRAY package. It operates b/w -40 to 85 °C, suitable for INDUSTRIAL telecom applications. Features include 0.975V supply voltage, RF and baseband circuitry, and low profile design for compact devices.
CC1101RTK
CC1101RTK by Texas Instruments is a cellphone IC with 20 terminals, operating at -40 to 85°C. It features a supply voltage of 3V, RF and baseband circuitry, and a package style of chip carrier. Ideal for industrial applications requiring RF communication in compact form factors.
AD6636CBCZ
AD6636CBCZ by Analog Devices is a Cellphone IC with 256 terminals in a GRID ARRAY package. It operates b/w -40 to 85 °C, suitable for industrial use. This RF and baseband circuit has a supply voltage of 1.8V, making it ideal for cellphone applications.
CC1070-RTR1
CC1070-RTR1 by Texas Instruments is a cellphone IC with 20 terminals in a square package. It operates b/w -40 to 105°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 3V, making it ideal for telecom applications.
CC1101TRHBRG4Q1
CC1101TRHBRG4Q1 by Texas Instruments is a cellphone IC with 32 terminals, operating at -40 to 105°C. It features a supply voltage of 3V, RF and baseband circuitry for telecom applications, and AEC-Q100 screening level for industrial use.
ADRF5547BCPZN-R7
Analog Devices' ADRF5547BCPZN-R7 is a cellphone IC with 40 terminals in a square chip carrier package. It operates b/w -40 to 105°C, suitable for industrial use. This RF front end circuit has a nominal voltage of 5V and terminal pitch of 0.5mm, making it ideal for telecom applications.
MC13142D
Motorola
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;
LT5558EUF#PBF
Linear Technology
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: SQUARE;
CC2510F32RSPRG3
CC2510F32RSPRG3 by Texas Instruments is a cellphone IC with 36 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with a supply voltage of 2.5/3.3V and peak reflow temperature of 260°C. Ideal for RF and baseband circuits in industrial telecom applications due to its CMOS technology and compact size.
AD8348ARUZ-REEL7
AD8348ARUZ-REEL7 by Analog Devices is a Cellphone IC with 28 terminals, operating at -40 to 85°C. It has a supply voltage of 5V and uses BIPOLAR technology for BASEBAND CIRCUIT in telecom applications. The package is SMALL OUTLINE, THIN PROFILE, RECTANGULAR shape with PLASTIC/EPOXY material.
CC1150RGVT
The Texas Instruments CC1150RGVT is a cellphone IC with a package style of chip carrier, suitable for RF and baseband circuits. It operates at temperatures ranging from -40 to 85°C, with a supply voltage of 3V and data rate of 0.5 Mbps. This surface-mount IC has 16 terminals in a square shape, ideal for industrial applications requiring compact design and high performance.
TCM320AC56IDW
TCM320AC56IDW by Texas Instruments is a Cellphone IC with 20 terminals, operating at 5V. It features a companding law of MU-LAW and a linear coding of 13-BIT. Ideal for telecom applications due to its BASEBAND CIRCUIT type and compact SMALL OUTLINE package style.
TRF4400PWG4
TRF4400PWG4 by Texas Instruments is a cellphone IC with 24 terminals, operating at 3V. It features CMOS technology, RF and baseband circuit for telecom applications. The package is small outline, thin profile, with shrink pitch, suitable for surface mount assembly.
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ST25R3911B-AQFT
STMicroelectronics
RF AND BASEBAND CIRCUIT; Terminal Finish: MATTE TIN; JESD-609 Code: e3; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;
ST25R3916-AQWT
RF AND BASEBAND CIRCUIT; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;
ST25R3911B-AQWT
RF AND BASEBAND CIRCUIT; JESD-609 Code: e3; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Terminal Finish: MATTE TIN;
ST25R3912-AWLT
RF AND BASEBAND CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 30; Package Code: VFBGA; Package Shape: RECTANGULAR;
ST25R3920B-AQWT
ST25R3918AQWT
ST25R3912-AQWT
RF AND BASEBAND CIRCUIT; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
ST25R3911B-ASWB
ST25R3920AQWT
ST25R36911B-AQFT
ST25R3911B-AQFB
RF AND BASEBAND CIRCUIT; Peak Reflow Temperature (C): 260; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 3; Terminal Finish: MATTE TIN;
ST25R3911B-AQWB
RF AND BASEBAND CIRCUIT; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; JESD-609 Code: e3; Terminal Finish: MATTE TIN;
ST25R3911B-ASWT
RF AND BASEBAND CIRCUIT; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e3; Peak Reflow Temperature (C): 260; Terminal Finish: MATTE TIN;
ST25R3913-AQFT
RF AND BASEBAND CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
ST25R3913-AQWT
ST25R3913-AWLT
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