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TCM4400EPETR

Texas Instruments

TCM4400EPETR by Texas Instruments

TCM4400EPETR by Texas Instruments is a cellphone IC with 80 terminals in a square flatpack package. It operates b/w -25°C to 85°C, with a nominal voltage of 3V. This baseband circuit has gull wing terminals and is suitable for telecom applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,699 parts In-Stock

1+ parts

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8,699

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Digiode

USA . 3,397 parts In-Stock

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3,397

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 656 parts In-Stock

1+ parts

$9.034

100+ parts

-

1k+ parts

$9.699

10k+ parts

-

656

$9.034

-

$9.699

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IDEA Electronic Components Group

UK . 1,983 parts In-Stock

1+ parts

$10.150

100+ parts

$9.642

1k+ parts

$9.135

10k+ parts

-

1,983

$10.150

$9.642

$9.135

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ChromeModa Solutions

Germany . 1,149 parts In-Stock

1+ parts

$10.150

100+ parts

$8.323

1k+ parts

-

10k+ parts

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1,149

$10.150

$8.323

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AZTECH Wire

Italy . 791 parts In-Stock

1+ parts

$13.271

100+ parts

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791

$13.271

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One Stop Electronics

USA . 1,465 parts In-Stock

1+ parts

$180.000

100+ parts

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1,465

$180.000

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DigiPath Technology Company

USA . 1,416 parts In-Stock

1+ parts

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100+ parts

$9.151

1k+ parts

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1,416

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$9.151

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Corphita

USA . 507 parts In-Stock

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507

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Overview

Unleash the potential of your cellphone with the TCM4400EPETR by Texas Instruments. Crafted with precision and expertise, this high-quality Cellphone IC offers unparalleled performance and reliability. From enhanced communication to seamless connectivity, this innovative product caters to a diverse range of applications in the telecom industry. Elevate your user experience with the value, benefits, and advantages that only Texas Instruments can deliver. Upgrade to excellence with the TCM4400EPETR today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, making it ideal for portable devices.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto circuit boards, saving time and space.

Package Shape: SQUARE

Square package shape allows for efficient use of space on the circuit board, maximizing component density.

No. of Terminals: 80

Having 80 terminals provides flexibility in connectivity options, allowing for a wide range of functions and features to be integrated.

Package Style (Meter): FLATPACK

The flatpack package style offers a low profile design, making it suitable for compact devices where space is limited.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can endure demanding conditions without compromising performance.

Minimum Operating Temperature: -25 °C

The low minimum operating temperature allows the product to function effectively in a wide range of environments, including cold temperatures.

Terminal Position: QUAD

Quad terminal position ensures secure connections, reducing the risk of signal interference or loss.

Maximum Seated Height: 1.2 mm

The low maximum seated height helps in achieving a compact overall design while maintaining optimal performance.

Width: 10 mm

The narrow width of the product allows for efficient placement on the circuit board, enabling more components to be integrated in a limited space.

Length: 10 mm

The compact length of the product contributes to a space-saving design, ideal for miniaturized devices.

Terminal Form: GULL WING

Gull wing terminal form provides reliable solder joints and facilitates automated assembly processes, improving manufacturing efficiency.

Telecom IC Type: BASEBAND CIRCUIT

As a baseband circuit, the product is crucial for processing and managing communication signals, ensuring smooth and efficient operation of the device.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3V is common and compatible with many devices, making the product versatile and widely applicable.

Terminal Pitch: 0.4 mm

With a small terminal pitch of 0.4mm, the product offers high density interconnects, enabling complex functionalities in a compact form factor.

Technical Specifications

Cellphone ICs TCM4400EPETR attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQFP-G80

Length:

10 mm

No. of Functions:

1

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

TCM4400EPETR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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