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MAX2029ETP+T

Analog Devices

MAX2029ETP+T by Analog Devices

MAX2029ETP+T by Analog Devices is a Cellphone IC with BICMOS tech. It operates b/w -40 to 85 °C, has 20 terminals in a square package, and requires 5V supply voltage. Ideal for baseband circuits due to its small size (5x5mm) and quad terminal position.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,355 parts In-Stock

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Digiode

USA . 1,732 parts In-Stock

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Anansix

USA . 1,700 parts In-Stock

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Chip Stock

USA . 1,065 parts In-Stock

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MARBEL Systems

Belgium . 1,365 parts In-Stock

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$10.972

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$10.972

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Texas Native Microelectronics

USA . 2,415 parts In-Stock

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$12.611

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$12.107

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$11.728

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$11.098

2,415

$12.611

$12.107

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$11.098

Kenton Components

USA . 2,775 parts In-Stock

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$15.133

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$13.317

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$15.133

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$13.317

AZTECH Wire

Italy . 487 parts In-Stock

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$15.835

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Qasali Group International

UK . 2,938 parts In-Stock

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$34.050

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$31.666

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$29.964

2,938

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$29.964

Semicontronic

India . 1,119 parts In-Stock

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$866.000

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$844.350

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$840.020

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One Stop Electronics

USA . 1,651 parts In-Stock

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$994.000

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Perfect Parts

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Kepictronics

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Corphita

USA . 2,526 parts In-Stock

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Overview

Enhance the performance of your cellphone devices with the MAX2029ETP+T by Analog Devices. Known for their superior quality and reliability, Analog Devices delivers cutting-edge Cellphone ICs that are designed to optimize functionality and efficiency. This innovative product boasts a compact square package shape, surface mount capability, and industrial-grade temperature tolerance, making it ideal for various telecom applications. Experience seamless communication and enhanced connectivity with the MAX2029ETP+T, offering customers unmatched value and unparalleled benefits for all their electronic needs.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology increases reliability and reduces assembly costs.

Package Shape: SQUARE

Square package shape allows for more efficient use of board space.

No. of Terminals: 20

Having 20 terminals provides enough connectivity options for various functions.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Having a chip carrier, heat sink/slug, and very thin profile package style enhances thermal management and helps in space-constrained applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this product can withstand harsh environments.

Minimum Operating Temperature: -40 °C

The product can operate in extremely low temperatures, making it suitable for various conditions.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin finish provides good solderability and durability.

Terminal Position: QUAD

Quad terminal position allows for easy integration into circuit designs.

Maximum Seated Height: 0.8 mm

Having a maximum seated height of 0.8 mm enables the product to be used in compact devices.

Width: 5 mm

A width of 5 mm offers a balance between space savings and functionality.

Maximum Time At Peak Reflow Temperature (s): 30

The product can handle peak reflow temperatures for up to 30 seconds, ensuring proper soldering.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260 °C allows for reliable soldering during manufacturing.

Length: 5 mm

A length of 5 mm complements the square package shape, maximizing space efficiency.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable performance in demanding environments.

Technology: BICMOS

BiCMOS technology offers a combination of high-speed performance and low power consumption.

Terminal Form: NO LEAD

No-lead terminal form is environmentally friendly and provides better electrical performance.

Telecom IC Type: BASEBAND CIRCUIT

Being a baseband circuit IC type, the product is essential for communication processing in mobile devices.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V makes the product compatible with standard power sources.

Terminal Pitch: 0.65 mm

Having a terminal pitch of 0.65 mm allows for precise connections and compact layout designs.

Technical Specifications

Cellphone ICs MAX2029ETP+T attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N20

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

MAX2029ETP+T Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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