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CC1101RGP

Texas Instruments

CC1101RGP by Texas Instruments

CC1101RGP by Texas Instruments is a cellphone IC with 20 terminals, operating at 1.8/3.6V and supporting data rates up to 0.5 Mbps. It features a square chip carrier package style suitable for RF and baseband circuits in industrial temperature environments. The IC is surface mountable, with a compact size of 4x4mm and terminal pitch of 0.5mm, making it ideal for mobile communication applications.

Median Price

$3.935

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 5 parts In-Stock

1+ parts

$0.700

100+ parts

$0.692

1k+ parts

-

10k+ parts

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5

$0.700

$0.692

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-

Chip1Stop

Japan . 5 parts In-Stock

1+ parts

$3.420

100+ parts

-

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-

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5

$3.420

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-

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Texas Instruments

USA . 74,320 parts In-Stock

1+ parts

$3.702

100+ parts

$3.018

1k+ parts

$2.012

10k+ parts

-

74,320

$3.702

$3.018

$2.012

-

Mouser Electronics

USA . 808 parts In-Stock

1+ parts

$4.870

100+ parts

$3.530

1k+ parts

$3.400

10k+ parts

$2.700

808

$4.870

$3.530

$3.400

$2.700

DigiKey

USA . 110 parts In-Stock

1+ parts

$4.870

100+ parts

$3.687

1k+ parts

$3.330

10k+ parts

$3.221

110

$4.870

$3.687

$3.330

$3.221

RS (Exports)

UK . 838 parts In-Stock

1+ parts

-

100+ parts

$4.168

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-

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838

-

$4.168

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Verical

USA . 5 parts In-Stock

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5

-

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,339 parts In-Stock

1+ parts

$1.751

100+ parts

-

1k+ parts

-

10k+ parts

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3,339

$1.751

-

-

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$3.530

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$3.530

-

-

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Chip Stock

USA . 132,568 parts In-Stock

1+ parts

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132,568

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Vyrian

USA . 6,613 parts In-Stock

1+ parts

-

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6,613

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LIBRA Elektronik GmbH

Germany . 52 parts In-Stock

1+ parts

-

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52

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ACDS - Activité Composants Distribution Service

France . 42 parts In-Stock

1+ parts

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42

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ComSIT Distribution GmbH

Germany . 20 parts In-Stock

1+ parts

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20

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Holdelec - ElecDif-Pro

France . 9 parts In-Stock

1+ parts

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9

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 10,641 parts In-Stock

1+ parts

$1.080

100+ parts

$1.053

1k+ parts

$1.048

10k+ parts

-

10,641

$1.080

$1.053

$1.048

-

Ampacity Inc.

Singapore . 10,619 parts In-Stock

1+ parts

$1.570

100+ parts

-

1k+ parts

-

10k+ parts

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10,619

$1.570

-

-

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Corphita

USA . 1,521 parts In-Stock

1+ parts

$1.659

100+ parts

-

1k+ parts

-

10k+ parts

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1,521

$1.659

-

-

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Continental Prestige Electronics

USA . 6,214 parts In-Stock

1+ parts

$3.012

100+ parts

-

1k+ parts

-

10k+ parts

$2.952

6,214

$3.012

-

-

$2.952

Argo Parts USA

USA . 1,435 parts In-Stock

1+ parts

$3.012

100+ parts

-

1k+ parts

-

10k+ parts

-

1,435

$3.012

-

-

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Modulus Dynamics

Lithuania . 89 parts In-Stock

1+ parts

$3.918

100+ parts

$3.879

1k+ parts

$3.762

10k+ parts

-

89

$3.918

$3.879

$3.762

-

Advanced Electronics

New Zealand . 270 parts In-Stock

1+ parts

$9.112

100+ parts

$8.292

1k+ parts

$7.472

10k+ parts

-

270

$9.112

$8.292

$7.472

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Parana Technologies

USA . 1,085 parts In-Stock

1+ parts

$15.677

100+ parts

-

1k+ parts

$16.046

10k+ parts

-

1,085

$15.677

-

$16.046

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Corohmni

South Africa . 52 parts In-Stock

1+ parts

$16.503

100+ parts

-

1k+ parts

-

10k+ parts

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52

$16.503

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DigiPath Technology Company

USA . 919 parts In-Stock

1+ parts

$17.263

100+ parts

$15.882

1k+ parts

-

10k+ parts

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919

$17.263

$15.882

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-

ChromeModa Solutions

Germany . 6,218 parts In-Stock

1+ parts

$17.615

100+ parts

$14.444

1k+ parts

-

10k+ parts

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6,218

$17.615

$14.444

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IDEA Electronic Components Group

UK . 1,544 parts In-Stock

1+ parts

$17.615

100+ parts

$16.734

1k+ parts

$15.854

10k+ parts

-

1,544

$17.615

$16.734

$15.854

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Perfect Parts

USA . 22,606 parts In-Stock

1+ parts

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22,606

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Lixinc

USA . 18,684 parts In-Stock

1+ parts

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18,684

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A-Z Elektronik GmbH

Germany . 6,221 parts In-Stock

1+ parts

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6,221

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Alle Elektronik GmbH

Germany . 4,147 parts In-Stock

1+ parts

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4,147

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-

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Robosynatics

Brazil . 4,141 parts In-Stock

1+ parts

-

100+ parts

$9.362

1k+ parts

$9.171

10k+ parts

$9.171

4,141

-

$9.362

$9.171

$9.171

Lucentia Tech

USA . 4,141 parts In-Stock

1+ parts

-

100+ parts

$9.362

1k+ parts

$9.171

10k+ parts

$9.171

4,141

-

$9.362

$9.171

$9.171

Assy Fe

Spain . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

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1,000

-

-

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Netroflash

USA . 50 parts In-Stock

1+ parts

-

100+ parts

$3.459

1k+ parts

$3.353

10k+ parts

$3.283

50

-

$3.459

$3.353

$3.283

Overview

Elevate your cellphone experience with the CC1101RGP by Texas Instruments. Crafted with precision and quality, this RF and baseband circuit integrates seamlessly into your device, ensuring optimal performance. Whether you're looking to enhance connectivity or streamline data transfer, this industrial-grade IC offers unparalleled reliability and efficiency. Trust in Texas Instruments' expertise to deliver cutting-edge technology that exceeds expectations. Upgrade your mobile capabilities today with the CC1101RGP.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability for the IC, ensuring a longer lifespan.

Surface Mount: YES

Surface mount capability makes installation easier and more efficient, saving time and effort during assembly.

Package Shape: SQUARE

Square shape allows for compact design and efficient use of space in the device.

Power Supplies (V): 1.8/3.6

Support for multiple power supply voltages provides flexibility and compatibility with various system requirements.

No. of Terminals: 20

Having 20 terminals allows for more connections and functionality within the IC.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The variety of package styles offered gives options for different cooling and space requirements in the device.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures stable performance even under harsh environmental conditions.

Width: 4 mm

Compact width enables the IC to fit in smaller devices without taking up too much space.

Terminal Finish: Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

Multiple terminal finish options provide corrosion resistance and improve electrical conductivity for better performance.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Being designed for RF and baseband circuits makes it suitable for cellphones, ensuring optimal signal processing and communication capabilities.

Technical Specifications

Cellphone ICs CC1101RGP attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

Data Rate:

.5 Mbps

JESD-30 Code:

S-PQCC-N20

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC20,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/3.6

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4 mm

Trade Compliance

CC1101RGP Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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