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TRF5901PT

Texas Instruments

TRF5901PT by Texas Instruments

TRF5901PT by Texas Instruments is a cellphone IC with 48 terminals in a square package. It operates at -40 to 85°C, consuming 0.053mA at 3V supply voltage. This RF and baseband circuit uses CMOS technology for industrial applications.

Median Price

$2.570

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1 parts In-Stock

1+ parts

-

100+ parts

$2.570

1k+ parts

$2.300

10k+ parts

$2.160

1

-

$2.570

$2.300

$2.160

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,385 parts In-Stock

1+ parts

$2.708

100+ parts

-

1k+ parts

-

10k+ parts

-

2,385

$2.708

-

-

-

Vyrian

USA . 3,909 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,909

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,811 parts In-Stock

1+ parts

$2.565

100+ parts

-

1k+ parts

-

10k+ parts

-

4,811

$2.565

-

-

-

AZTECH Wire

Italy . 835 parts In-Stock

1+ parts

$8.380

100+ parts

-

1k+ parts

-

10k+ parts

-

835

$8.380

-

-

-

Parana Technologies

USA . 662 parts In-Stock

1+ parts

$10.037

100+ parts

$932.044

1k+ parts

$9.033

10k+ parts

-

662

$10.037

$932.044

$9.033

-

DigiPath Technology Company

USA . 874 parts In-Stock

1+ parts

$11.051

100+ parts

-

1k+ parts

-

10k+ parts

-

874

$11.051

-

-

-

ChromeModa Solutions

Germany . 5,878 parts In-Stock

1+ parts

$11.277

100+ parts

$9.247

1k+ parts

-

10k+ parts

-

5,878

$11.277

$9.247

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IDEA Electronic Components Group

UK . 312 parts In-Stock

1+ parts

$11.277

100+ parts

$10.713

1k+ parts

$10.149

10k+ parts

-

312

$11.277

$10.713

$10.149

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Overview

Revolutionize the way you use your cellphone with the TRF5901PT by Texas Instruments. Crafted with precision and quality, this Cellphone IC offers unparalleled performance and reliability. From seamless connectivity to enhanced signal processing, this innovative product ensures a smooth user experience. Whether you're a tech enthusiast or a professional in the telecommunications industry, the TRF5901PT is designed to meet your needs. Trust in Texas Instruments, a renowned manufacturer known for pushing the boundaries of technology. Upgrade your devices with the TRF5901PT and discover a world of possibilities at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easier to handle and less prone to damage during handling or assembly.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of the product, saving time and reducing costs.

Power Supplies (V): 3

Operating at 3V allows for lower power consumption, making the product more energy efficient and potentially extending battery life.

No. of Terminals: 48

Having a higher number of terminals allows for more functionality and connectivity options in the product.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environments and ensure reliable performance even in hot conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product more efficient and reliable.

Maximum Supply Current: 0.053 mA

The low maximum supply current helps in reducing power consumption and heat generation, contributing to the overall efficiency of the product.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Having both RF and baseband circuitry integrated into one package simplifies the design and assembly process, leading to a more compact and cost-effective product.

Technical Specifications

Cellphone ICs TRF5901PT attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.053 mA

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

TRF5901PT Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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