Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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TOBY-L210-03S-03 by U-blox Ag is a Cellphone IC with 152 terminals in a rectangular grid array package. Operating b/w -20°C to 65°C, it integrates RF and baseband circuits for telecom applications. With a compact size of 24.8mm x 35.6mm and low seated height of 2.87mm, it's ideal for mobile device designs.
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Surface mount technology allows for easy and efficient assembly, making this product suitable for high-volume production.
The rectangular shape of the package provides a standardized form factor for easy integration into various electronic devices.
Having 152 terminals allows for a high level of connectivity and functionality in the device.
The grid array package style helps in optimizing space on the PCB and enhances thermal performance.
With a maximum operating temperature of 65°C, this product can withstand higher temperature environments without degradation in performance.
The ability to operate at temperatures as low as -20°C makes this product suitable for use in a wide range of climatic conditions.
Bottom terminal position facilitates easy and secure PCB mounting, ensuring a reliable connection.
The low seated height of 2.87 mm allows for compact design and space-saving in electronic devices.
The moderate width of 24.8 mm makes this product compatible with standard PCB layouts and designs.
The length of 35.6 mm provides sufficient space for embedding complex circuitry and components.
The no-lead terminal form enhances reliability and prevents potential solder joint failures in the long run.
Being a combination of RF and baseband circuitry allows for seamless communication and data processing in telecommunication devices.
The 3.8V supply voltage ensures compatibility with common power sources and helps in efficient power management.
Cellphone ICs TOBY-L210-03S-03 attributes and parameters. Explore more Cellphone ICs devices from U-blox Ag
Additional Features:
JESD-30 Code:
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Package Code:
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TOBY-L210-03S-03 Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Other - TOBY-L2/MPCI-L2 Quality 06/Oct/2023
Our world is moving fast, soon your car will drive itself and you will carry your doctor in your pocket. Your home will power the grid and you will be connected like never before. At u-blox we are setting the beat delivering the core technology to locate and wirelessly connect people, machines and everything else making us the agile and reliable partner that will take you beyond expectations. With our innovative products and services, we empower customers to locate their devices and connect them from silicon to cloud. Ever since three bright ETH doctorate students and their professor founded u-blox in 1997, two things have driven everything we do: a desire to innovate and a constant focus on giving our customers a real competitive edge.
SMBJ18CA
Continental Device India
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
General Diode
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
2N7002,215
NXP Semiconductors
2N7002,215 by NXP Semiconductors is a small signal N-CHANNEL FET with a min DS breakdown voltage of 60V and max drain current of 0.3A. It is used for switching applications in enhancement mode, operates b/w -65 to 150 °C, and has a max power dissipation of 0.2W.
LAN8720AI-CP-TR
Standard Microsystems
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;
IRLML6401TRPBF
International Rectifier
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.3 W; Minimum Operating Temperature: -55 Cel; Avalanche Energy Rating (EAS): 33 mJ;
LM317T
Bay Linear
Other Regulators; No. of Terminals: 3; No. of Outputs: 1; Surface Mount: NO; Maximum Load Regulation (%): 1.5 %; Operating Temperature (TJ-Min): 0 Cel;
OPA2227UA
Texas Instruments
OPA2227UA by Texas Instruments is a dual operational amplifier with low-offset voltage of 200 uV and bias current of 0.01 uA. It operates at temperatures ranging from -40 to 85 °C, making it suitable for industrial applications requiring precise signal amplification. With a unity gain bandwidth of 8000 kHz, this op amp is ideal for high-frequency circuit designs.
BAV99
Panasonic
MIXER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
Surge Components
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
1N4148
Toshiba
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
SS14
Taitron Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Diotec Semiconductor Ag
M39029/58-360
Itt Cannon
CONNECTOR ACCESSORY; Alternate Contacts: 030-2042-000; DIN Conformity: NO; Contact Gender: MALE; Terminal Type: WIRE; MIL-Connector Accessory Name: CONTACT;
Microsemi
M24308/2-1F
Cinch Connectivity Solutions
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Dielectric Withstanding Voltage (V): 1750VAC; No. of Connectors: ONE; Body Depth: .375 inch;
LM358N
LM358N by Texas Instruments is an operational amplifier with 2 functions, offering a max input offset voltage of 9000 uV and a nominal common mode reject ratio of 85 dB. Widely used in commercial applications, it operates at temperatures ranging from 0 to 70 °C and has a unity gain bandwidth of 1000 kHz.
DP83848IVVX/NOPB
National Semiconductor
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: QFP; Package Shape: SQUARE;
LM107H
General Electric Solid State
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Minimum Voltage Gain: 25000;
TCM4400EPN
Texas Instruments TCM4400EPN is a Cellphone IC with 80 terminals in a square flatpack package. Operating b/w -25 to 85°C, it uses BICMOS technology and requires 3V supply voltage. Ideal for baseband circuits, this IC has a low supply current of 0.03mA and compact dimensions of 12x12mm.
CC1000PWRG3
CC1000PWRG3 by Texas Instruments is a cellphone IC with 28 terminals, operating at temperatures from -40 to 85°C. It features a supply voltage of 2.5/3.3V and telecom IC type for RF and baseband circuits. The package is small outline, thin profile, with gull wing terminals suitable for industrial applications.
AT86RF233-ZUR
Microchip Technology
AT86RF233-ZUR by Microchip Technology is a cellphone IC with 32 terminals, operating at temperatures from -40 to 85°C. It features a supply voltage of 3V, CMOS technology, and RF/baseband circuitry. This surface-mount chip carrier has a compact square shape ideal for telecom applications.
LMV228TLX
LMV228TLX by Texas Instruments is a cellphone IC with a package style of grid array, very thin profile, and fine pitch. It operates in industrial temperature grades from -40 to 85°C and has a nominal voltage of 2.7V. This RF and baseband circuit IC is designed for telecom applications requiring precise performance in compact spaces.
IAM-91563-BLKG
Agilent Technologies
RF AND BASEBAND CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: TSSOP; Package Shape: RECTANGULAR; Surface Mount: YES;
AT86RF233-ZF
AT86RF233-ZF by Microchip is a cellphone IC with 32 terminals in a square chip carrier package. Operating temperature ranges from -40 to 125°C, suitable for automotive applications. It features RF and baseband circuitry, CMOS technology, and a nominal voltage of 3V.
TCM8000FR
Texas Instruments TCM8000FR is a Cellphone IC with BICMOS technology, 44 terminals in a square package. Operating temp range -25 to 80°C, suitable for baseband circuits. Package style: flatpack, terminal form: gull wing, and nominal voltage of 5V make it ideal for telecom applications.
HMC702LP6CETR
Analog Devices
Analog Devices' HMC702LP6CETR is a 40-terminal cellphone IC in a square chip carrier package with matte tin finish. Operating temperature range from -40 to 85 °C, suitable for industrial use. Features BICMOS technology for RF and baseband circuits, with nominal voltage of 3V.
AD6655ABCPZRL7-125
AD6655ABCPZRL7-125 by Analog Devices is a cellphone IC with 64 terminals, operating at -40 to 85 °C. It has a supply voltage of 1.8V and max current of 0.705mA. This BASEBAND CIRCUIT IC comes in a square chip carrier package with matte tin finish, suitable for industrial applications.
SKY13526-485LF
Skyworks Solutions
SKY13526-485LF by Skyworks Solutions is a 14-terminal cellphone IC with a square package shape and chip carrier style. Operating b/w -30°C to 90°C, it's ideal for RF and baseband circuits in telecom applications. With a compact size of 2x2mm and no-lead terminals, it offers high performance in a small footprint.
ST25R3916-AQWT
STMicroelectronics
RF AND BASEBAND CIRCUIT; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;
CC1150RGVR
CC1150RGVR by Texas Instruments is a cellphone IC with 16 terminals in a square chip carrier package. It operates b/w -40 to 85°C, has a data rate of 0.5 Mbps, and uses CMOS technology for RF and baseband circuits. Ideal for industrial telecom applications due to its compact size and low power consumption.
MAX2902ETI+
MAX2902ETI+ by Analog Devices is a cellphone IC with 28 terminals in a square chip carrier package. Operating temperature ranges from -40 to 85°C, suitable for industrial use. It integrates RF and baseband circuits, with a nominal voltage of 4.5V for telecom applications.
CC1111F8RSPG3
The Texas Instruments CC1111F8RSPG3 is a cellphone IC with 36 terminals in a square chip carrier package. Operating at 3V, it features RF and baseband circuit technology, suitable for telecom applications. With a temperature range of 0-85°C, this CMOS device has a terminal pitch of 0.5mm and is surface mountable.
LMV228URX
LMV228URX by Texas Instruments is a cellphone IC with a package style of grid array, very thin profile, and fine pitch. It operates in industrial temperature grades from -40 to 85°C and has a nominal voltage of 2.7V. This RF and baseband circuit IC is designed for telecom applications requiring precise performance in compact spaces.
TCM320AC56CN
Texas Instruments TCM320AC56CN is a 20-terminal IC with 5V power supply, operating b/w 0-70°C. It features a 13-bit linear coding, μ-law companding law, and telecom baseband circuit type. Ideal for cellphone applications due to its compact rectangular package style and through-hole terminal form.
MAX2550ETN+
Analog Devices' MAX2550ETN+ is a cellphone IC with 56 terminals in a square chip carrier package. Operating b/w -40 °C to 85°C, it has a supply voltage of 3.3V and max current of 390mA. Ideal for RF and baseband circuits, this IC features a terminal pitch of 0.4mm and is suitable for industrial temperature grade applications.
MAX4003ETA+
Maxim Integrated
MAX4003ETA+ by Maxim Integrated is a cellphone IC with 8 terminals in a small outline package. Operating temperature range from -40 to 85°C, suitable for industrial telecom applications. Features RF and baseband circuits, with nominal voltage of 3V for compact design.
HMC422MS8ETR
HMC422MS8ETR by Analog Devices is a cellphone IC with 8 terminals in a small outline, thin profile package. It operates b/w -40 to 85°C and has a nominal voltage of 3V. This RF and baseband circuit is designed for telecom applications requiring high performance in a compact form factor.
CC1101RGP
CC1101RGP by Texas Instruments is a cellphone IC with 20 terminals, operating at 1.8/3.6V and supporting data rates up to 0.5 Mbps. It features a square chip carrier package style suitable for RF and baseband circuits in industrial temperature environments. The IC is surface mountable, with a compact size of 4x4mm and terminal pitch of 0.5mm, making it ideal for mobile communication applications.
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TOBY-L210-03S
U-blox Ag
RF AND BASEBAND CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 152; Package Code: LGA; Package Shape: RECTANGULAR; Nominal Supply Voltage: 3.8 V;
TOBY-L210-65S
TOBY-L210-65S by U-blox Ag is a surface mount Cellphone IC with 1 function. It has 152 terminals and a rectangular package shape. With a max operating temperature of 65°C, it is suitable for RF and baseband circuit applications.
TOBY-L210-62S
TOBY-L210-62S by U-blox Ag is a CELL IC with 152 terminals in GRID ARRAY package. It operates b/w -20°C to 65°C, ideal for RF and baseband circuits in cellphones. With a compact size of 24.8mm x 35.6mm and low supply voltage of 3.8V, it's suitable for mobile communication applications.
TOBY-L280-03S
RF AND BASEBAND CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 152; Package Code: LGA; Package Shape: RECTANGULAR; Terminal Position: BOTTOM;
TOBY-L200-00S
RF AND BASEBAND CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 152; Package Code: LGA; Package Shape: RECTANGULAR; Maximum Operating Temperature: 65 Cel;
TOBY-L200-02S
RF AND BASEBAND CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 152; Package Code: LGA; Package Shape: RECTANGULAR; Length: 35.6 mm;
TOBY-L201-01S
RF AND BASEBAND CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 152; Package Code: LGA; Package Shape: RECTANGULAR; Package Body Material: UNSPECIFIED;
TOBY-L201-02S
RF AND BASEBAND CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 152; Package Code: LGA; Package Shape: RECTANGULAR; Additional Features: -40 to 85 extended operating temp available;
TOBY-L210-00S
TOBY-L210-02S
RF AND BASEBAND CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 152; Package Code: LGA; Package Shape: RECTANGULAR; Width: 24.8 mm;
TOBY-L210-60S
TOBY-L220-02S
TOBY-L220-62S
RF AND BASEBAND CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 152; Package Code: LGA; Package Shape: RECTANGULAR; Maximum Seated Height: 2.87 mm;
TOBY-L280-02S
TOBY-L200-00S-00
RF AND BASEBAND CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: NO LEAD; No. of Terminals: 152; Package Code: XMA; Package Shape: RECTANGULAR;
TOBY-L280-03A-01
RF AND BASEBAND CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 152; Package Code: XMA; Package Shape: RECTANGULAR; Surface Mount: YES;
TOBY-L210-03A-00
RF AND BASEBAND CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 152; Package Code: XMA; Package Shape: RECTANGULAR; Maximum Operating Temperature: 65 Cel;
TOBY-L200-03A-01
RF AND BASEBAND CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 152; Package Code: XMA; Package Shape: RECTANGULAR; Nominal Supply Voltage: 3.8 V;
TOBY-L210-03A-01
RF AND BASEBAND CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 152; Package Code: XMA; Package Shape: RECTANGULAR; No. of Functions: 1;
TOBY-L201-02S-02
RF AND BASEBAND CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 152; Package Shape: RECTANGULAR; Length: 35.6 mm;
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