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TRF3040

Texas Instruments

TRF3040 by Texas Instruments

TRF3040 by Texas Instruments is a 48-terminal cellphone IC with a package style of flatpack, low profile, fine pitch. Operating b/w -40 to 85°C, it's ideal for telecom applications requiring RF and baseband circuits. With a nominal voltage of 3.75V and gull wing terminal form, this IC is designed for industrial-grade temperature environments.

Median Price

$42.080

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 16 parts In-Stock

1+ parts

$42.080

100+ parts

-

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16

$42.080

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey Marketplace

USA . 2 parts In-Stock

1+ parts

$42.080

100+ parts

-

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2

$42.080

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Digiode

USA . 2,474 parts In-Stock

1+ parts

$113.744

100+ parts

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2,474

$113.744

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Electro Sonic

Canada . 3 parts In-Stock

1+ parts

$123.320

100+ parts

$39.360

1k+ parts

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3

$123.320

$39.360

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Vyrian

USA . 4,830 parts In-Stock

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4,830

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,257 parts In-Stock

1+ parts

$10.236

100+ parts

-

1k+ parts

$10.769

10k+ parts

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1,257

$10.236

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$10.769

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AZTECH Wire

Italy . 286 parts In-Stock

1+ parts

$11.020

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286

$11.020

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ChromeModa Solutions

Germany . 5,709 parts In-Stock

1+ parts

$11.501

100+ parts

$9.431

1k+ parts

-

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5,709

$11.501

$9.431

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IDEA Electronic Components Group

UK . 2,076 parts In-Stock

1+ parts

$11.501

100+ parts

$10.926

1k+ parts

$10.351

10k+ parts

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2,076

$11.501

$10.926

$10.351

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Corphita

USA . 2,544 parts In-Stock

1+ parts

$107.757

100+ parts

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2,544

$107.757

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DigiPath Technology Company

USA . 1,334 parts In-Stock

1+ parts

-

100+ parts

$10.369

1k+ parts

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1,334

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$10.369

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Overview

Enhance the performance of your cellphone with the TRF3040 by Texas Instruments. Crafted with precision and expertise, this RF and baseband circuit IC offers unmatched quality and reliability. Whether you're looking to improve call clarity, enhance data transmission, or optimize network connectivity, this versatile component delivers exceptional results. With a sleek design and industrial-grade temperature tolerance, the TRF3040 promises seamless integration and long-lasting durability. Elevate your mobile experience with Texas Instruments' cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a lightweight and durable construction for the cellphone IC, ensuring longevity and reliable performance.

Surface Mount: YES

Enables easy and efficient installation onto circuit boards, saving time and effort during assembly.

Package Shape: SQUARE

Optimal shape for space-saving design and efficient layout on the circuit board.

No. of Terminals: 48

Sufficient number of terminals for connectivity and functionality within the cellphone IC.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Allows for compact and slim design, ideal for modern slim smartphones while maintaining high performance.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, ensuring stable performance even under demanding conditions.

Minimum Operating Temperature: -40 °C

Operates effectively in cold environments, providing versatility for use in varying temperature conditions.

Terminal Position: QUAD

Quad terminal position enables efficient routing and connectivity, enhancing overall performance of the cellphone IC.

Maximum Seated Height: 1.6 mm

Low profile design allows for a slimmer overall product design, suitable for thin smartphone profiles.

Width: 7 mm

Compact width contributes to the overall space-saving design of the cellphone IC.

Length: 7 mm

Compact length allows for efficient use of space on the circuit board, optimizing layout and design.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, ensuring reliability and durability in harsh operating environments.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering onto circuit boards, enhancing ease of assembly and reliability.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Combines RF and baseband circuit functionality in one IC, providing comprehensive telecom capabilities in a single component.

Nominal Supply Voltage: 3.75 V

Optimal supply voltage for efficient and reliable operation of the cellphone IC.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting and efficient use of PCB space.

Technical Specifications

Cellphone ICs TRF3040 attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Nominal Supply Voltage:

3.75 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

TRF3040 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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