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TRF370317IRGET

Texas Instruments

TRF370317IRGET by Texas Instruments

TRF370317IRGET by Texas Instruments is a cellphone IC with 24 terminals in a square chip carrier package. It operates at -40 to 85°C, with a supply voltage of 5V and max current of 0.245mA. Ideal for RF and baseband circuits, it features nickel palladium gold finish and no-lead terminal form.

Median Price

$12.588

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 8,769 parts In-Stock

1+ parts

$11.766

100+ parts

$10.278

1k+ parts

$7.088

10k+ parts

-

8,769

$11.766

$10.278

$7.088

-

Mouser Electronics

USA . 362 parts In-Stock

1+ parts

$16.470

100+ parts

$13.420

1k+ parts

$11.110

10k+ parts

-

362

$16.470

$13.420

$11.110

-

Rochester

USA . 963 parts In-Stock

1+ parts

-

100+ parts

$10.190

1k+ parts

$9.120

10k+ parts

$8.580

963

-

$10.190

$9.120

$8.580

DigiKey

USA . 963 parts In-Stock

1+ parts

-

100+ parts

$13.410

1k+ parts

-

10k+ parts

-

963

-

$13.410

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,060 parts In-Stock

1+ parts

$9.348

100+ parts

-

1k+ parts

-

10k+ parts

-

1,060

$9.348

-

-

-

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$10.191

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$10.191

-

-

-

Vyrian

USA . 2,534 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,534

-

-

-

-

DigiKey Marketplace

USA . 963 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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963

-

-

-

-

LWI Electronics Inc

India . 417 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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417

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2,463 parts In-Stock

1+ parts

$8.360

100+ parts

-

1k+ parts

-

10k+ parts

-

2,463

$8.360

-

-

-

Corphita

USA . 929 parts In-Stock

1+ parts

$8.856

100+ parts

-

1k+ parts

-

10k+ parts

-

929

$8.856

-

-

-

Aranea Global

USA . 100 parts In-Stock

1+ parts

$9.987

100+ parts

-

1k+ parts

$9.588

10k+ parts

-

100

$9.987

-

$9.588

-

Continental Prestige Electronics

USA . 5,348 parts In-Stock

1+ parts

$10.191

100+ parts

-

1k+ parts

-

10k+ parts

$9.987

5,348

$10.191

-

-

$9.987

Parana Technologies

USA . 336 parts In-Stock

1+ parts

$11.518

100+ parts

-

1k+ parts

$11.931

10k+ parts

-

336

$11.518

-

$11.931

-

ChromeModa Solutions

Germany . 6,701 parts In-Stock

1+ parts

$12.942

100+ parts

$10.612

1k+ parts

-

10k+ parts

-

6,701

$12.942

$10.612

-

-

IDEA Electronic Components Group

UK . 2,126 parts In-Stock

1+ parts

$12.942

100+ parts

$12.295

1k+ parts

$11.648

10k+ parts

-

2,126

$12.942

$12.295

$11.648

-

A-Z Elektronik GmbH

Germany . 5,672 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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5,672

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-

-

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Perfect Parts

USA . 1,904 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,904

-

-

-

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Argo Parts USA

USA . 1,881 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,881

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-

-

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Kepictronics

USA . 1,820 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,820

-

-

-

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DigiPath Technology Company

USA . 1,023 parts In-Stock

1+ parts

-

100+ parts

$11.669

1k+ parts

-

10k+ parts

-

1,023

-

$11.669

-

-

Overview

Revolutionize your cellphone experience with the TRF370317IRGET by Texas Instruments. Known for their high-quality products, Texas Instruments has crafted this Cellphone IC to deliver unmatched performance and reliability. Whether you're looking to enhance your phone's signal reception or improve data transmission, this RF and baseband circuit is the perfect solution. With a compact and durable package style, this IC offers easy integration and long-lasting functionality. Upgrade your device today with the TRF370317IRGET and experience the difference that Texas Instruments technology can make in your everyday life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and efficient in protecting the IC components, making it a reliable choice.

Surface Mount: YES

Easy to install on PCBs, reducing assembly time and improving overall efficiency.

Package Shape: SQUARE

Compact design saves space and allows for easy integration into various electronic devices.

Power Supplies (V): 5

Operates efficiently with a standard supply voltage, ensuring compatibility with common power sources.

No. of Terminals: 24

Provides ample connections for various functions and applications, enhancing versatility.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Offers options for thermal management and space-saving capabilities for diverse uses.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, ensuring reliable performance in demanding conditions.

Minimum Operating Temperature: -40 °C

Functions effectively even in extremely low temperatures, making it suitable for a wide range of environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Ensures strong and reliable electrical connections for long-term stability.

Terminal Position: QUAD

Facilitates easy mounting and secure attachment to circuit boards, simplifying installation processes.

Maximum Seated Height: 1 mm

Low profile design allows for seamless integration into compact electronic devices.

Width: 4 mm

Space-efficient dimensions enable flexible placement within electronic assemblies.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand high reflow temperatures for improved soldering and assembly reliability.

Peak Reflow Temperature °C: 260

Withstands high peak temperatures during manufacturing processes, ensuring quality solder joints.

Length: 4 mm

Compact size enables versatile placement options within electronic systems.

Temperature Grade: INDUSTRIAL

Suitable for use in industrial environments with varying temperature conditions, guaranteeing robust performance.

Terminal Form: NO LEAD

Lead-free construction promotes environmental sustainability and complies with regulations.

Maximum Supply Current: 0.245 mA

Operates efficiently with low power consumption, ideal for energy-saving applications.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Supports telecommunications functions for seamless data transmission and reception capabilities.

Nominal Supply Voltage: 5 V

Operates within a standard voltage range for universal compatibility with power sources.

Terminal Pitch: 0.5 mm

Close terminal spacing enables compact design and efficient signal routing for enhanced performance.

Moisture Sensitivity Level (MSL): 2

Designed to withstand moderate levels of moisture exposure, ensuring reliability in varied environmental conditions.

Technical Specifications

Cellphone ICs TRF370317IRGET attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.245 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

TRF370317IRGET Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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