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HMC702LP6CETR

Analog Devices

HMC702LP6CETR by Analog Devices

Analog Devices' HMC702LP6CETR is a 40-terminal cellphone IC in a square chip carrier package with matte tin finish. Operating temperature range from -40 to 85 °C, suitable for industrial use. Features BICMOS technology for RF and baseband circuits, with nominal voltage of 3V.

Median Price

$39.500

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,689 parts In-Stock

1+ parts

-

100+ parts

$39.500

1k+ parts

$35.340

10k+ parts

$33.260

1,689

-

$39.500

$35.340

$33.260

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 622 parts In-Stock

1+ parts

$39.188

100+ parts

-

1k+ parts

-

10k+ parts

-

622

$39.188

-

-

-

Vyrian

USA . 103 parts In-Stock

1+ parts

$41.250

100+ parts

-

1k+ parts

-

10k+ parts

-

103

$41.250

-

-

-

Chip Stock

USA . 953 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

953

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,448 parts In-Stock

1+ parts

$8.117

100+ parts

-

1k+ parts

$7.549

10k+ parts

-

1,448

$8.117

-

$7.549

-

IDEA Electronic Components Group

UK . 789 parts In-Stock

1+ parts

$8.728

100+ parts

-

1k+ parts

$8.292

10k+ parts

-

789

$8.728

-

$8.292

-

DigiPath Technology Company

USA . 684 parts In-Stock

1+ parts

$13.616

100+ parts

$13.071

1k+ parts

-

10k+ parts

$13.071

684

$13.616

$13.071

-

$13.071

Corphita

USA . 497 parts In-Stock

1+ parts

$37.125

100+ parts

-

1k+ parts

-

10k+ parts

-

497

$37.125

-

-

-

Semicontronic

India . 926 parts In-Stock

1+ parts

$76.310

100+ parts

$74.402

1k+ parts

$74.021

10k+ parts

-

926

$76.310

$74.402

$74.021

-

Authorized Procurement Solutions

USA . 30,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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30,000

-

-

-

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Lixinc

USA . 12,936 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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12,936

-

-

-

-

RC Electronics

USA . 1,874 parts In-Stock

1+ parts

-

100+ parts

$21.900

1k+ parts

$20.650

10k+ parts

$20.230

1,874

-

$21.900

$20.650

$20.230

A-Z Elektronik GmbH

Germany . 750 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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750

-

-

-

-

Microchip USA

USA . 257 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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257

-

-

-

-

Overview

Experience the cutting-edge technology of the HMC702LP6CETR by Analog Devices, a leading manufacturer in the industry. This cellphone IC offers unparalleled performance and reliability for a wide range of applications. With its advanced features and top-notch quality, this product is designed to meet the demands of today's fast-paced world. Trust Analog Devices to deliver excellence in every aspect, from design to functionality. Upgrade your devices with the HMC702LP6CETR and experience the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is lightweight and durable, making the product easy to handle and long-lasting.

Surface Mount: YES

Surface mount technology allows for easier and faster assembly of the product, reducing manufacturing time and cost.

Package Shape: SQUARE

The square shape of the package allows for efficient use of space on a circuit board, maximizing component density.

No. of Terminals: 40

Having 40 terminals allows for a high level of connectivity, enabling the product to support complex functions and features.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles ensures effective heat dissipation and space-saving design.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C ensures reliable performance even under harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C allows the product to function in cold climates without compromising performance.

Terminal Finish: MATTE TIN

MATTE TIN terminal finish provides good electrical conductivity and corrosion resistance, ensuring stable connections over time.

Terminal Position: QUAD

QUAD terminal position allows for efficient routing of signals and power, leading to better signal integrity and overall performance.

Maximum Seated Height: 0.9 mm

The low maximum seated height of 0.9 mm enables a slim and compact design, suitable for space-constrained applications.

Width: 6 mm

The compact width of 6 mm contributes to the overall small form factor of the product, making it ideal for portable devices.

Length: 6 mm

With a length of 6 mm, the product maintains a square shape, ensuring uniformity in design and efficient use of board space.

Temperature Grade: INDUSTRIAL

Being industrial-grade, the product is designed to withstand rugged conditions and perform reliably in demanding environments.

Technology: BICMOS

BICMOS technology combines the advantages of bipolar and CMOS technologies, offering high speed, low power consumption, and integration capabilities.

Terminal Form: NO LEAD

The no-lead terminal form is environmentally friendly and RoHS compliant, meeting modern regulations and standards.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Supporting RF and baseband circuit functions, the product is versatile and suitable for use in various communication applications.

Nominal Supply Voltage: 3 V

Operating at a nominal supply voltage of 3 V, the product offers energy efficiency and compatibility with common power sources.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5 mm allows for high-density packaging and precise connection, enhancing signal integrity and performance.

Technical Specifications

Cellphone ICs HMC702LP6CETR attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e3

Length:

6 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

.9 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

6 mm

Trade Compliance

HMC702LP6CETR Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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